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BTM581 Module
The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

KEY FEATURES:

  • Bluetooth 5.4 & Qualcomm® QCC5181 chip
  • Multi - codec (aptX, aptX HD, aptx-adaptive) support
  • 240 MHz audio DSP integration
Classic R
Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.

KEY FEATURES:

  • Better Hearing Experience - RelaJet AI Speech Enhancement Engine
  • Sustainable design - Replaceable lithium battery
  • User interaction - Qualcomm Technologies chipset with Bluetooth® compatibility & Qualcomm® tuning APP
Chipset
Type Reference Design Platforms
SonicBoom by Virscient
Launching a new audio product? Our hardware reference designs make it easy. Whether it’s earbuds, headsets, glasses, or speakers, we deliver complete, application-specific platforms packed with everything you need—microphones, amps, sensors, chargers, even a charging case. Designed for quick and easy customization, our schematics and layouts are clean, functional, and structured for speed. And yes, we provide polished Altium master design files, so you’re not starting from scratch. Just plug in your vision—we’ll help bring it to life.

KEY FEATURES:

  • Application specific reference designs
  • Easily customizable
Qualcomm QCC517x reference design Powerofyle by Exeger
Powerfoyle is groundbreaking solar-cell technology, invented and produced in Sweden by Exeger and designed to power electronic devices with indoor and outdoor light.Exeger reference design for integration with Qualcomm Technologies, Inc. development boards, File contains guide, schematic and source code for Qualcomm ® QCC5171 module with Bluetooth connectivity.
Chipset
Type Reference Design Platforms
IDC777-DISKIT
IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.

KEY FEATURES:

  • Development Board for the IDC777
  • Dual Mode LE Audio (Auracast/Unicast) and BR/EDR
Chipset
Type Development Kits

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