AI-optimized and integrating Wi-Fi 7, Bluetooth®, and Ultra Wideband (UWB) together in a 6nm single-chip connectivity system for unparalleled performance across mobile, compute, and XR experiences.

The Qualcomm® FastConnect™ 7900 Mobile Connectivity System is an AI-enhanced connectivity system integrating Wi-Fi 7, Bluetooth, and UWB in a single-chip 2x2 offering on an in...

more

The Qualcomm® FastConnect™ 7900 Mobile Connectivity System is an AI-enhanced connectivity system integrating Wi-Fi 7, Bluetooth, and UWB in a single-chip 2x2 offering on an in...

more

The Qualcomm® FastConnect™ 7900 Mobile Connectivity System is an AI-enhanced connectivity system integrating Wi-Fi 7, Bluetooth, and UWB in a single-chip 2x2 offering on an industry-leading 6nm process node. Delivering ultra-high speeds and sustained low latency across Wi-Fi, leading Bluetooth LE Audio, and all-new proximity awareness capabilities, Fast...

more

The Qualcomm® FastConnect™ 7900 Mobile Connectivity System is an AI-enhanced connectivity system integrating Wi-Fi 7, Bluetooth, and UWB in a single-chip 2x2 offering on an industry-leading 6nm process node. Delivering ultra-high speeds and sustained low latency across Wi-Fi, leading Bluetooth LE Audio, and all-new proximity awareness capabilities, FastConnect 7900 is packed with premium innovation, building on an advanced implementation of High Band Simultaneous (HBS) Multi-Link with UWB and Bluetooth Channel Sounding to seamles...

more
Featured Documents
Product Brief

Redesigned, AI-optimized Wi-Fi 7

FastConnect 7900 is redesigned to a compact 6nm, packing all-new AI-optimized Wi-Fi 7 built for extreme power efficiency. New RF FEMs add additional power savings and longer battery life.

Comprehensive proximity awareness capabilities

FastConnect 7900 offers a range of technologies including Wi-Fi Ranging, Bluetooth Channel Sounding, and UWB designed to empower the user with comprehensive proximity capabilities.

Next-gen, multi-device experiences

All-new RF FEMs brings improved KPIs, high efficiency, low power consumption, and support for high-throughput HBS. Now with proximity awareness capabilities from FastConnect 7900, take your multi-device experiences to a new level of seamless immersion. HBS and HBS Multi-Link are also at the core of experiences such as Qualcomm XPAN and Snapdragon Seamless for unparalleled connectivity.

Revolutionary new sound experiences with Qualcomm XPAN and Snapdragon Sound

FastConnect 7900 offers amazing new audio experiences with support for the revolutionary new Qualcomm XPAN and the Snapdragon Sound™ Technology Suite. With these technologies, high-bitrate music streaming can be delivered over Wi-Fi at ultra-low power, from 96kHz scaling up to 192kHz, with whole home, building, and campus coverage. Qualcomm XPAN can also support high-quality audio, and HBS utilizes two simultaneous high-band connections to ensure the very best audio experiences with robustness.

Features

  • 6GHz, 5GHz, and 2.4GHz support
  • Up to 5.8 Gbps data rate using 4K QAM modulation and 320MHz channel bandwidth (single channel or 160 + 160 with High Band Simultaneous)
  • Up to 4.3 Gbps with 4K QAM and 240MHz combined channel bandwidth using multiple streams of globally available 5GHz spectrum
  • Unique HBS technology delivers multiple links of 5 and/or 6GHz performance
  • 40% lower power usage than previous generation
  • Bluetooth Channel Sounding, spatial audio, and ANT+ support
  • Support for Snapdragon Sound and Qualcomm XPAN
  • LE Audio for personal audio sharing and broadcast for listeners to share streams or join others
  • Multi-stream audio support for true wireless earbuds
Specifications
Wi-Fi
Wi-Fi/Bluetooth System
Qualcomm® FastConnect™ 7900
Peak Speed
5.8 Gbps
Generation
Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7
Standards
802.11b, 802.11g, 802.11n, 802.11ac, 802.11a, 802.11ax, 802.11be
Spectral Bands
6 GHz
Channels
320 MHz
Peak QAM
4K QAM
Encryption
256-bit AES-GCMP, 128-bit AES-CCMP
Security
WPA3 Enhanced Open, FIPS 140-2, TLS, WPA2, AES-CCMP, PAP, MS-CHAP, PEAP, EAP-TLS, 128-bit WEP, MS-CHAPv2, WPA2-PSK, EAP-TTLS, 64-bit WEP, 256-bit AES-GCMP, Protected Management Frames, WPA3 Personal, WPA3 Enterprise, WPA3 Easy Connect, 128-bit AES-GCMP
Features
Passpoint, TDLS, OFDMA (UL/DL), Wi-Fi QoS Management, MU-MIMO (UL/DL), Wi-Fi Optimized Connectivity, Wi-Fi Aware R3, Wi-Fi Location, Miracast, Voice-Enterprise, High Band Simultaneous (HBS) Multi-Link, Target Wake Time, XPAN Technology
Bluetooth
Specification Version
Bluetooth® 6.0
UWB
Standards
IEEE 802.15.4z, Fine Ranging (FiRa), Car Connectivity Consortium (CCC)
Transmit Chains
1
Receive Chains
3
Features
Time of Flight (ToF), Angle of Arrival (AoA)
Audio
Qualcomm® aptX™ audio technology support
Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Lossless
Audio Processing Technologies
Snapdragon Sound™ technology, Low latency Gaming mode with Voice back-channel, LE Audio, Spatial Audio
Other Audio Capturing Technologies
Stereo Recording
Process Node and Technology
Process Node
6 nm

Compare related products.

    Access more.
    To access more FastConnect 7900 resources, you need to be a member of a verified company. Company verification is initiated by filling out our access request form.
    Already have a Qualcomm account?