QCC3024

Not for new design

QCC3024

Contact sales

On this page

Overview

Benefits

Block Diagram

Features / Specs

Product Comparison

Access More

Entry-Level Flash Low-Power Bluetooth Audio SoC

The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.

The QCC3024 is available in a VFBGA package and is designed to help customers reduce development time and cost when developing Bluetooth Stereo Headsets.

Qualcomm QCC3024 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Powerful tri-core processing designed to support flexible innovation

The QCC3024 embeds a tri-core processing architecture, consisting in a pair of programmable dedicated 32-bit application processors and a single, configurable, Qualcomm® Kalimba™ DSP audio subsystem.

Advanced array of audio technologies

The QCC3024 is designed to help create consistent, high-quality audio streaming over Bluetooth, as well as Qualcomm® cVc™ Noise Cancellation Technology to help suppress background noise and echo feedback for a quieter and more seamless user experience.

Digital Assistant ready

The QCC3024 supports voice services via button-press activation. This feature is designed to relay the audio stream and voice control capabilities to a handset to process and execute commands.

Extremely low-power

Bluetooth Stereo Headsets using QCC3024 can extend their battery life by up to approximately three times more than similar headsets using our previous generation ROM products.

Advanced development tools

The QCC3024 is designed to support freedom and flexibility for innovation. A new feature rich audio development kit (ADK) and enhanced development tools are designed to help reduce time needed for integration and commercialization.

QCC3024 Block Diagram

Features

Bluetooth Low Energy 5.0
Extremely low-power audio DSP with on-chip ROM and RAM
High-performance 24-bit stereo audio interface
Digital and analog microphone interfaces
Flexible PIO controller and LED pins with PWM support
Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger
SBC and AAC audio codec support
Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
90-ball 5.5 x 5.5 x 1.0 mm, 0.5 mm pitch VFBGA
Single ended antenna connection with on-chip balun and Tx/Rx switch
Bluetooth, Bluetooth low energy, and mixed topologies supported
32-bit Firmware Processor, reserved for system use, runs Bluetooth upper stack, profiles, house-keeping code
On-chip caches per core allow for optimized performance and power consumption
32-bit Kalimba audio digital signal processor (DSP) core with flexible clocking from 2 MHz to 120 MHz to allow optimization and trade-off performance vs. power consumption
Both analog-to-digital converter (ADC)s and digital-to analog converter (DAC)s support sample rates of 8, 16, 32, 44.1, 48, 96 kHz. DACs also support 192 kHz.

Specifications

CPU

Architecture

32-bit

Clock Speed

Up to 32 MHz

Features

Programmable CPU

DSP

Name

1x Qualcomm® Kalimba™

Clock Speed

1x 120 MHz

Data RAM

256 kB

Program RAM

80 kB

Features

Configurable DSP

Bluetooth

Specification Version

Bluetooth® 5.0

Connection Technology

Bluetooth® Low Energy, Bluetooth® Classic, Dual-mode Bluetooth®

Topologies

Qualcomm® Broadcast Audio technology

Classic Data Rate

2 Mbps

Low Energy Features

Bluetooth® Low Energy sensor hub

Audio

Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support

2-mic Headset, 1-mic Headset, Qualcomm® cVc™ Echo Cancelling and Noise Suppression

Voice Services

Digital Assistant Activation

Button press

Qualcomm Kalimba, Qualcomm cVc and Qualcomm Broadcast Audio are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Compare related products.

Note: to leverage the best experience for the product comparison table, please use the desktop to view content.

4 of 4 total products

Product	CPU Clock Speed	DSP Name	Clock Speed	Features	Bluetooth Specification Version	Connection Technology	Classic Profiles	Classic Data Rate	Low Energy Features	Audio Qualcomm® aptX™ audio technology support	Voice Services Digital Assistant Activation	Power Consumption Amperage	Audio Playback Interfaces Modes	Package Type	Size
Other
QCC3024 Not for new design	Up to 32 MHz	1x Qualcomm® Kalimba™	1x 120 MHz	Configurable DSP	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	—	2 Mbps	Bluetooth® Low Energy sensor hub	Qualcomm® aptX™ Audio	Button press	Less than 6 mA	Stereo	VFBGA	—
QCC3034 Not for new design	Up to 32 MHz	1x Qualcomm® Kalimba™	1x 120 MHz	Configurable DSP	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	—	2 Mbps	Bluetooth® Low Energy sensor hub	Qualcomm® aptX™ Audio Qualcomm® aptX™ HD	Button press	Less than 6 mA	Stereo	VFBGA	5.5 × 5.5 × 1 mm
QCC3005 Not for new design	Up to 80 MHz	Qualcomm® Kalimba™	—	—	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	—	—	Qualcomm® aptX™ Audio	—	—	Stereo	QFN BGA	5.5 × 5.5 × 1 mm¹ 6.0 × 6.0 × 0.6 mm²
QCC3004 End of life	Up to 80 MHz	Qualcomm® Kalimba™	—	—	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	—	—	—	—	—	Stereo	QFN BGA	5.5 × 5.5 × 1 mm¹ 6.0 × 6.0 × 0.6 mm²

Access more.

To access more QCC3024 resources, you need to be a member of a verified company. Company verification is initiated by filling out our access request form.

Already have a Qualcomm account?

QCC3024 Block Diagram

Features

Compare related products.

Other