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Qualcomm Dragonwing™
QCS605
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QCS6

10nm SoC purpose-built to deliver high-performing, power-efficient edge computing for next-generation smart cameras and smart home applications with an octa-core CPU and 4K video capture.

The Qualcomm Dragonwing™ QCS605 SoC is a high performance IoT System-on-Chip (SoCs) that incorporates key features for building advanced use cases encompassing machine learning, edge computing, sensor processing, voice UI enablement and integrated wireless connectivity.

The 10nm QCS605 SoC is engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, across a wide range of IoT applications. It integrates a powerful image signal processor...

Qualcomm QCS605 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Product license agreement
Featured DocumentsProduct Brief

Benefits

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Low power performance

Engineered specifically for camera applications that utilize intensive processing features and designed to reduce power consumption.

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Built-in AI

On-device machine learning through the Qualcomm AI Engine can support AI use cases including face detection, face recognition, object tracking and people counting.

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4K Ultra HD video

Dual ISPs support staggered HDR, low light noise reduction, and enhanced auto-focus performance, plus 4K video capture and playback at 60fps and support for secondary streams for preview and streaming.

QCS605 Block Diagram

Features

  • Dual 14-bit Qualcomm Spectra™ 270 ISP capable of supporting up to dual 16MP sensors
  • Fabricated using the advanced 10nm FinFET process for exceptional thermal and power efficiency
  • Qualcomm® Adreno™ 615 GPU with 64-bit addressing @ up to 780MHz with latest API support
  • Qualcomm® Hexagon™ 685 DSP with dual hexagon vector extensions for running DNN models and advanced Qualcomm® Neural Processing SDK support
  • Octa-core Qualcomm® Kryo™ 300 CPU optimized for power and DMIPS
  • Qualcomm® AI Engine designed to support on-device machine learning
  • Low power sensor core helps support always-on use cases at reduced power levels
  • Supports up to 2x2 802.11ac Wi-Fi with MU-MIMO and dual band simultaneous transmission, Bluetooth 5.1
  • Support for high resolution 24-bit audio, with Qualcomm® aptX™ and aptX HD audio codecs, Qualcomm Aqstic™ audio codec
  • HW based security designed with features such as secure boot from hardware root of trust, trusted execution environment, hardware crypto engines, storage security, debug security with lifecycle control, key provisioning and wireless protocol security
Specifications
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name
Qualcomm® Adreno™ 615
CPU Name
Qualcomm® Kryo™
Qualcomm® Hexagon™ Processor Name
Qualcomm® Hexagon™ 685
Qualcomm® Hexagon™ Processor Features
Fused AI Accelerator architecture
Qualcomm® Sensing Hub Features
Dual-core AI processor
Artificial Intelligence (AI) Frameworks and Runtimes
ONNX, Qualcomm® Neural Processing SDK, Tensorflow, Caffe, Android NN, Caffe2
Tera Operations Per Second (TOPS)
2.1 TOPS @ 1w
CPU
Name
Qualcomm® Kryo™ 300
Number of Cores
8
Architecture
64-bit
Clock Speed
Up to 2.5 GHz
GPU
Name
Qualcomm® Adreno™ 615
APIs
OpenGL® ES 3.2, OpenCL™, Vulkan® 1.1
DSP
Name
2x Qualcomm® Hexagon™ Vector Processor, Qualcomm® Hexagon™ 685
Features
Qualcomm All-Ways Aware™ technology
Location
Location Support
Qualcomm® Location
Satellite Systems
GLONASS, Beidou, SBAS, GPS, QZSS, Galileo
Frequency Support
Triple
Accuracy
Lane-level
Features
Global Freeway Vehicle Navigation

Qualcomm Vision Intelligence Platform, Qualcomm Spectra, Qualcomm Aqstic, Qualcomm aptX, Qualcomm Hexagon, Qualcomm Adreno, Qualcomm Neural Processing SDK, Qualcomm Kryo, Qualcomm All-Ways Aware, Qualcomm Location, Qualcomm AI Engine, Qualcomm Noise and Echo Cancelation and Qualcomm Quick Charge are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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Product

CPU

Name

Number of Cores

Clock Speed

GPU

Name

DSP

Name

Wi-Fi

Generation

Standards

MIMO Configuration

Bluetooth

Specification Version

Interfaces

Supported Interfaces

Memory

Speed

Type

Process Node and Technology

Process Node

Other

QCS605

Qualcomm® Kryo™ 300

8

Up to 2.5 GHz

Qualcomm® Adreno™ 615

2x Qualcomm® Hexagon™ Vector Processor
Qualcomm® Hexagon™ 685

Wi-Fi 4
Wi-Fi 5

802.11a
802.11b
802.11g
802.11n
802.11ac

2x2

Bluetooth® 5.0

USB 3.1

1866 MHz

LPDDR4x

10 nm

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