Press Release

Qualcomm Technologies Announces Comprehensive RF Front-End Platform for the Next Generation of Advanced Global Mobile Devices

Company Ships Multimode GaAs Power Amplifier Modules and First Dynamic Antenna Tuning Solution for Carrier Aggregation

21 févr. 2017SAN DIEGO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), is introducing a suite of comprehensive RF front-end (RFFE) solutions, making it the first mobile technology provider to develop and commercialize a comprehensive platform spanning from the digital modem to the antenna port. The latest additions to the Qualcomm® RF360™ family of RFFE products are Qualcomm Technologies’ first gallium arsenide (GaAs) power amplifier modules (QPA5460, QPA5461, QPA4360 and QPA4361) and the next-generation Qualcomm® TruSignal™ antenna performance enhancement solution (QAT35xx) to drive superior RF performance by utilizing modem intelligence and system-level design and optimization.

The recently announced joint venture between Qualcomm Incorporated and TDK Corporation, RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings) helps build Qualcomm Technologies’ comprehensive RFFE technology portfolio. RF360 Holdings brings a legacy of expertise in RF filtering and modules as well as integrated and discrete micro-acoustic components such as multi-technology RF filters, duplexers, multiplexers and extractors, and has an established footprint in flagship smartphones. As a result, Qualcomm Technologies has the in-house capability and access to develop, integrate, manufacture, assemble, test and deliver GaAs and CMOS power amplifiers, BAW, SAW and TC-SAW filters and filter modules, high performance switches, power trackers, antenna tuners and integrated modules - all the components necessary for a comprehensive leading-edge RFFE solution to complement its leading modem technology for next generation mobile devices.

New RF Front-End Module Solutions
As Qualcomm Technologies’ first GaAs based products, the QPA546x and QPA436x multimode, multiband power amplifier (MMPA) modules are optimized for envelope-tracking and average power tracking, respectively, and combine high, mid and low band power amplifiers with high performance switches to provide highly integrated modules for regional and global designs with superior power efficiency. QPA5461 is designed to work with the QET4100 envelope tracker and is the first MMPA optimized for High Power User Equipment (HPUE) operation, providing high power-efficiency solutions for devices in LTE TDD networks.

The QPA546x MMPA is part of a modular front-end solution supporting carrier aggregation, that includes a D5328 front-end module (FEMiD) with integrated quadplexer and a D5285 diversity receive (DRX) module. Compatible BAW filters are available for designs requiring higher performance in high bands such as band 41. The D5328 comprises of SAW filters, TC-SAW filters, and proprietary layer-transfer switches. The D5285 diversity receive module includes SAW filters and layer-transfer switches. This modular configuration offers a low part-count solution with low design-in effort for devices that support leading-edge connectivity features such as Gigabit LTE, LTE-Advanced and 4x4 MIMO.

Next-generation Qualcomm® TruSignal™ antenna performance enhancement solutions
Comprising the QAT3550 impedance tuner, the QAT3514 aperture tuner, QAT3522 antenna diversity switch and advanced modem software, the latest generation of Qualcomm Technologies’ TruSignal provides a comprehensive antenna performance enhancement technology suite that is the mobile industry’s first commercial adaptive antenna tuning solution supporting carrier aggregation. The TruSignal solution is designed to use the modem’s intelligent processing power to continuously optimize signal quality and support a consistent user experience across use conditions while maximizing network coverage and battery life for sleek LTE-Advanced mobile devices including smartphones with metal backs. For consumers, this means support for a more consistent data and voice experience indoors and outdoors.  For original equipment manufacturers (OEMs), the adaptive tunability of the system helps reduce time-to-certification by addressing the risk of mismatch from antenna redesign iterations.

“The ability to develop the key RFFE components, coupled with our leading modem expertise, allow us to push the boundary on overall system performance while offering high levels of integration,” said James Wilson, vice president and general manager, RFFE modules, Qualcomm Technologies, Inc. “Offering a comprehensive end-to-end solution enables us to make it faster and easier for our customers to create tomorrow’s mobile devices, while providing better data speeds, more optimized signal performance and fewer dropped calls to consumers.”

The QAT35xx antenna tuning and diversity switch products are supported for use with the Qualcomm® Snapdragon™ 835 processor.

The QPA546x, QPA436x, D5328 and D5285 products are released and sampling today. The QAT35xx solutions are currently in production and are expected to be in commercially available devices soon.

About Qualcomm
Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

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1-858-845-5959

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Investor Relations

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Qualcomm Snapdragon 835 Mobile Platform Powers Gigabit LTE and Immersive Experiences on Samsung Galaxy S8

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced that its premium mobile platform is powering Samsung’s latest and most sophisticated flagship smartphone, the Samsung Galaxy S8, for select regions. The Samsung Galaxy S8 is powered by the Qualcomm® Snapdragon™ 835 Mobile Platform, featuring the first commercial SoC manufactured using 10nm FinFET technology, and which integrates the Snapdragon X16 LTE modem. This powerful platform allows the Galaxy S8 to support Gigabit LTE, for fiber-optic Internet speeds on the go, and more consistent mobile data performance in more places. The Galaxy S8 is the first smartphone to feature Qualcomm® TruSignal™ adaptive antenna tuning technology for carrier aggregation, designed to deliver a more consistent voice and data experience, indoors and outdoors. The Snapdragon 835 is roughly 35 percent smaller in package size and consumes roughly 25 percent less power compared to the previous generation flagship processor, which equates to longer battery life and a thinner design. The processor also supports next-generation immersive entertainment experiences, such as mobile virtual reality (VR), with leading edge still and video capture.

“We are proud to continue our long and productive collaboration with Samsung to help bring the most advanced mobile experiences, such as Gigabit LTE and mobile VR, to consumers with the new Samsung Galaxy S8,” said Alex Katouzian, senior vice president and general manager, mobile, Qualcomm Technologies, Inc. “Featuring a thin and light design with superior battery life, immersive multimedia, and exceptional photography with Gigabit LTE speeds, the Samsung Galaxy S8 powered by the Snapdragon 835 Mobile Platform delivers the experiences today’s mobile users demand.”

The Snapdragon 835 Mobile Platform offers improved processing power and performance with the new Qualcomm® Kryo™ 280 CPU and Qualcomm® Hexagon™ 682 DSP, and is designed to simultaneously meet the high performance demands, thermal limits and power efficiency constraints of the next-generation VR designs, like the Samsung Gear VR for Galaxy S8. Snapdragon 835 delivers up to a 25 percent increase in 3D graphics rendering performance with the Qualcomm® Adreno™ 540 GPU compared to Adreno 530. Snapdragon 835 also supports object and scene-based 3D audio as well as visually immersive 4K Ultra HD premium (HDR10) video, that enables the Samsung Galaxy S8 to play HDR movies and other types of videos from major content publishers. At the core of the capture experience is the Qualcomm Spectra™ 180 ISP, featuring dual 14-bit ISPs that support the Galaxy S8 8MP front camera and 12MP rear camera for the ultimate photography and ultra-high definition videography experience. Both still and video capture experiences are enhanced with advanced auto-focus technologies along with HDR true-to-life colors and perceptual quantization video encoding.  The Snapdragon 835 also features the Qualcomm Haven™ security platform with enhanced security for biometrics and device attestation, which can be experienced in the Galaxy S8. The Galaxy S8’s signal performance, power efficiency and thermal performance are enhanced by an advanced RF front-end which includes Qualcomm Technologies’ envelope tracker, impedance tuner, diversity receive modules, aperture tuners, low-noise amplifiers, extractor and BAW filter.

“We value the long history of collaboration that we share with Qualcomm Technologies, and are excited to work with them on the Galaxy S8, the mobile industry’s first smartphone based on 10nm FinFET process technology to be available to consumers,” said Robert Kim, vice president, product strategy team, mobile communications business, Samsung Electronics. “Doing so provides our customers with a best-in-class mobile experience, which includes the most advanced features in connectivity, immersion, machine learning and security.”

More information on the Snapdragon Mobile Platform can be found at https://www.qualcomm.com/products/snapdragon/processors/835. For more information about the Samsung Galaxy S8, please visit www.samsung.com/galaxy or www.samsungmobilepress.com.

About Qualcomm

Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including our QCT semiconductor business. To learn more, visit Qualcomm’s website, blog, Twitter and Facebook pages.

 

29 mars 2017
Press Releases

Qualcomm Technologies Announces Comprehensive RF Front-End Platform for the Next Generation of Advanced Global Mobile Devices

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), is introducing a suite of comprehensive RF front-end (RFFE) solutions, making it the first mobile technology provider to develop and commercialize a comprehensive platform spanning from the digital modem to the antenna port. The latest additions to the Qualcomm® RF360™ family of RFFE products are Qualcomm Technologies’ first gallium arsenide (GaAs) power amplifier modules (QPA5460, QPA5461, QPA4360 and QPA4361) and the next-generation Qualcomm® TruSignal™ antenna performance enhancement solution (QAT35xx) to drive superior RF performance by utilizing modem intelligence and system-level design and optimization.

The recently announced joint venture between Qualcomm Incorporated and TDK Corporation, RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings) helps build Qualcomm Technologies’ comprehensive RFFE technology portfolio. RF360 Holdings brings a legacy of expertise in RF filtering and modules as well as integrated and discrete micro-acoustic components such as multi-technology RF filters, duplexers, multiplexers and extractors, and has an established footprint in flagship smartphones. As a result, Qualcomm Technologies has the in-house capability and access to develop, integrate, manufacture, assemble, test and deliver GaAs and CMOS power amplifiers, BAW, SAW and TC-SAW filters and filter modules, high performance switches, power trackers, antenna tuners and integrated modules - all the components necessary for a comprehensive leading-edge RFFE solution to complement its leading modem technology for next generation mobile devices.

New RF Front-End Module Solutions
As Qualcomm Technologies’ first GaAs based products, the QPA546x and QPA436x multimode, multiband power amplifier (MMPA) modules are optimized for envelope-tracking and average power tracking, respectively, and combine high, mid and low band power amplifiers with high performance switches to provide highly integrated modules for regional and global designs with superior power efficiency. QPA5461 is designed to work with the QET4100 envelope tracker and is the first MMPA optimized for High Power User Equipment (HPUE) operation, providing high power-efficiency solutions for devices in LTE TDD networks.

The QPA546x MMPA is part of a modular front-end solution supporting carrier aggregation, that includes a D5328 front-end module (FEMiD) with integrated quadplexer and a D5285 diversity receive (DRX) module. Compatible BAW filters are available for designs requiring higher performance in high bands such as band 41. The D5328 comprises of SAW filters, TC-SAW filters, and proprietary layer-transfer switches. The D5285 diversity receive module includes SAW filters and layer-transfer switches. This modular configuration offers a low part-count solution with low design-in effort for devices that support leading-edge connectivity features such as Gigabit LTE, LTE-Advanced and 4x4 MIMO.

Next-generation Qualcomm® TruSignal™ antenna performance enhancement solutions
Comprising the QAT3550 impedance tuner, the QAT3514 aperture tuner, QAT3522 antenna diversity switch and advanced modem software, the latest generation of Qualcomm Technologies’ TruSignal provides a comprehensive antenna performance enhancement technology suite that is the mobile industry’s first commercial adaptive antenna tuning solution supporting carrier aggregation. The TruSignal solution is designed to use the modem’s intelligent processing power to continuously optimize signal quality and support a consistent user experience across use conditions while maximizing network coverage and battery life for sleek LTE-Advanced mobile devices including smartphones with metal backs. For consumers, this means support for a more consistent data and voice experience indoors and outdoors.  For original equipment manufacturers (OEMs), the adaptive tunability of the system helps reduce time-to-certification by addressing the risk of mismatch from antenna redesign iterations.

“The ability to develop the key RFFE components, coupled with our leading modem expertise, allow us to push the boundary on overall system performance while offering high levels of integration,” said James Wilson, vice president and general manager, RFFE modules, Qualcomm Technologies, Inc. “Offering a comprehensive end-to-end solution enables us to make it faster and easier for our customers to create tomorrow’s mobile devices, while providing better data speeds, more optimized signal performance and fewer dropped calls to consumers.”

The QAT35xx antenna tuning and diversity switch products are supported for use with the Qualcomm® Snapdragon™ 835 processor.

The QPA546x, QPA436x, D5328 and D5285 products are released and sampling today. The QAT35xx solutions are currently in production and are expected to be in commercially available devices soon.

About Qualcomm
Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm’s
website, OnQ blog, Twitter and Facebook pages.

21 févr. 2017
Press Releases

Qualcomm and TDK Announce Launch of Joint Venture

Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE business unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.

“The ongoing expansion of mobile communication across multiple industries, and the unprecedented deployment of multi-carrier 4G technologies now reaching over sixty-five 3GPP frequency bands are driving manufacturers of wireless solutions to higher levels of miniaturization, integration and performance, especially for the RFFE in these devices,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and president, QCT. “Further, 5G will increase the level of complexity even more. To that end, the ability to provide the ecosystem a truly complete solution is essential to enabling our customers to deliver mobile solutions at scale and on time.”

Together with RF360 Holdings, Qualcomm Technologies, Inc. (QTI) will be ideally positioned to design and supply products with end-to-end performance and global scale from the modem/transceiver all the way to the antenna in a fully integrated system.

RF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW), to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules from QTI that will include front-end components designed and developed by QTI. These components include CMOS, SOI and GaAs Power Amplifiers[1], a broad portfolio of Switches, Antenna Tuning, Low Noise Amplifiers (LNAs) and the industry’s leading Envelope Tracking solution.

Deepening collaboration between Qualcomm and TDK

In addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications.

“The deeper collaboration with Qualcomm fits perfectly into our growth strategy,” said Shigenao Ishiguro, President and CEO of TDK Corporation. “It is a further step that aims to open up new promising business opportunities for TDK, while strengthening the company's innovativeness and thus competitiveness in such attractive future markets as sensors, MEMS, wireless charging and batteries. Our customers will clearly benefit from the resulting unique and comprehensive technologies and products portfolio.”

Additional transaction details

RF360 Holdings will be a Singapore corporation and will have a global presence with R&D and manufacturing and/or sales locations in Europe and Asia and its headquarters in Munich, Germany. Christian Block will serve as Senior Vice President and General Manager of RFFE, QTI, which includes RF360 Holdings. Block was previously the Chief Technology Officer of EPCOS AG, a wholly-owned subsidiary of TDK, and General Manager of the TDK SAW Business Group.

As asserted on January 12, 2016, when the agreement to form the joint venture was announced, RF360 Holdings will initially be owned 51 percent by Qualcomm Global Trading PTE. Ltd. (QGT) and 49 percent by EPCOS AG (EPCOS). QGT has an option to acquire (and EPCOS has an option to sell) the remaining interest in the joint venture 30 months after the closing date.

Giving effect to the payment made at closing, additional future payments to TDK based on sales by the joint venture of RF filter functions, as well as Qualcomm and TDK’s joint collaboration efforts, and assuming QGT’s exercise of its option to acquire EPCOS’ interest in the joint venture, the aggregate transaction value is expected to be approximately $3 billion US dollars. Qualcomm expects the transaction to be accretive to Non-GAAP earnings per share in the 12 months following the transaction close.

About RF360 Holdings

RF360 Holdings is a Qualcomm and TDK Joint Venture driving innovation in Radio Frequency Front End (RFFE). With more than 4,000 employees worldwide, RF360 Holdings develops and manufactures innovative RFFE filtering solutions for mobile devices and fast growing business segments, such as IoT, drones, robotics, automotive applications and more. RF360 Holdings offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe.

About Qualcomm

Qualcomm’s technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now, we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries including automotive, computing, IoT and healthcare, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including our semiconductor business, QCT, and our mobile, automotive, computing, IoT and healthcare businesses. To learn more, visit Qualcomm’s website, blog, Twitter and Facebook pages.

Qualcomm and Qualcomm RF360 are trademarks of Qualcomm Incorporated, registered in the United States and other countries. RF360 is a trademark of Qualcomm Incorporated.

Note Regarding Forward-Looking Statements

This news release contains forward-looking statements that are subject to risks, uncertainties and assumptions. If such risks or uncertainties materialize or such assumptions prove incorrect, actual results could differ materially from those expressed or implied by such forward-looking statements. All statements other than those of historical fact could be deemed forward-looking statements, including but not limited to statements regarding the manner in which the parties plan to effect the transaction; the expected benefits and costs of the transaction; the anticipated technology and industry trends and related expected developments in the relevant business segments; the expertise each party brings to the transaction; the size of the RFFE opportunity and the competitive position of QTI and the joint venture; the parties’ plans relating to the transaction and other technology collaborations; the expected timing of the completion of the transaction; the parties’ ability to complete the transaction considering the various regulatory approvals and other closing conditions; the parties’ plans, strategies and objectives for future operations, product offerings, product development, product extensions, product integration, and growth opportunities in certain business areas, including RFFE modules and RF filters; the importance of module solutions to support the increasing complexity in the RFFE; the potential future financial impact of the transaction; and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the possibility that expected benefits of the transaction may not materialize as anticipated; that the transaction may not be timely completed, if at all; as well as the other risks detailed from time to time in Qualcomm’s SEC reports, including its most recent Annual Report on Form 10-K for the fiscal year ended September 27, 2015. The parties do not undertake any obligation to update, or continue to provide information with respect to, any forward-looking statement, whether as a result of new information, future events or otherwise.

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio includes electronic components, modules and systems* marketed under the product brands TDK and EPCOS, power supplies, magnetic application products as well as energy devices, flash memory application devices, and others. TDK focuses on demanding markets in the areas of information and communication technology and consumer, automotive and industrial electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2016, TDK posted total sales of $10.2 billion US dollars and employed about 92,000 people worldwide.

* The product portfolio includes ceramic, aluminum electrolytic and film capacitors, ferrites, inductors, high-frequency components and modules, piezo and protection components, and sensors.

Note Regarding Forward-Looking Statements

This material contains forward-looking statements, including projections, plans, policies, management strategies, targets, schedules, understandings, and evaluations about TDK, or its group companies (TDK Group). These forward-looking statements are based on the current forecasts, estimates, assumptions, plans, beliefs, and evaluations of the TDK Group in light of the information currently available to it, and contain known and unknown risks, uncertainties, and other factors. The TDK Group therefore wishes to caution readers that, being subject to risks, uncertainties, and other factors, the TDK Group’s actual results, performance, achievements, or financial position could be materially different from any future results, performance, achievements, or financial position expressed or implied by these forward-looking statements, and the TDK Group undertakes no obligation to publicly update or revise any forward-looking statements after the issue of this material except as provided for in laws and ordinances. The electronics markets in which the TDK Group operates are highly susceptible to rapid changes, risks, uncertainties, and other factors that can have significant effects on the TDK Group including, but not limited to, shifts in technology, fluctuations in demand, prices, interest and foreign exchange rates, and changes in economic environments, conditions of competition, laws and regulations.

3 févr. 2017