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Vivo X Fold is the world’s first foldable smartphone with Qualcomm 3D Sonic Sensor Gen 2 Sensors in both displays

On April 11th via a virtual event, Vivo launched three flagship devices all powered by Snapdragon Mobile Platforms – the Vivo X Fold (Snapdragon 8 Gen 1), Vivo X Note (Snapdragon 8 Gen 1), and Vivo Pad (Snapdragon 780).

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The Vivo X Fold is the Vivo’s first foldable smartphone design, and the company held nothing back. The X Fold is powered by the Snapdragon 8 Gen 1 for incredible performance and battery life. But the Vivo X Fold packs not one, but TWO Qualcomm 3D Sonic Sensor Gen 2s – one on each display (the outside display and in the inside foldable display).

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Having a Qualcomm 3D Sonic Fingerprint sensor on each display gives users more flexibility when unlocking their smartphone and delivers a speedy experience. It also sports a cross match feature, where the user only needs to register fingerprints on one of the displays – the device will match the prints on the second display so that users do not have to re-enroll.

Ultrasonic waves produced by the Qualcomm 3D Sonic Sensor Gen 2 can penetrate the opaque foldable display stack, offering a significant advantage over competing optical sensing methods. The Qualcomm 3D Sonic Sensor Gen 2 is 50% faster and 77% larger than Gen 1. The larger sensor provides a larger region for placing your finger and allows the Qualcomm 3D Sonic Sensor Gen 2 to capture 1.7x more biometric data for faster and more secure unlocking.

Vivo invited Qualcomm Incorporated President & CEO Cristiano Amon to make an appearance at the virtual event. Amon highlighted the strong collaboration between Vivo and Qualcomm Technologies and the amazing features that Vivo delivers by leveraging the Snapdragon 8 Gen 1. Among those features highlighted, Amon focused on security and the benefits of the Qualcomm 3D Sonic Sensor Gen 2.

The Vivo X Fold is currently available only in China. Prices of X Fold start from CNY8,999 ($1,450), X Note start from CNY5,999 ($950).

Snapdragon, Qualcomm 3D Sonic Fingerprint, and Qualcomm 3D Sonic Sensor are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Opinions expressed in the content posted here are the personal opinions of the original authors, and do not necessarily reflect those of Qualcomm Incorporated or its subsidiaries ("Qualcomm"). The content is provided for informational purposes only and is not meant to be an endorsement or representation by Qualcomm or any other party. This site may also provide links or references to non-Qualcomm sites and resources. Qualcomm makes no representations, warranties, or other commitments whatsoever about any non-Qualcomm sites or third-party resources that may be referenced, accessible from, or linked to this site.

About the Author
Gordon Thomas
Gordon ThomasSr. Director, Product Management, Qualcomm Technologies, Inc.
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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