The Open-Q™ 5165N SOM is a LGA (54mm x 45mm) production-ready computing module based on the powerful Qualcomm Dragonwing™ QRB5165N System-on-Chip. The QRB5165N utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th generation AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Supporting Wi-Fi 6 connectivity (external), advanced camera features, and high-speed interfaces, the 5165N SOM creates the perfect computing core for a variety of leading-edge robotics applications. Along with the companion development kit, advanced robotics-focused OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring the highest AI processing performance in low-power embedded situations.

The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.

The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.

VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.

Based on the Qualcomm® QRB5165 SoC, 5G communication module, extension I/F supporting AI accelerator chipset, multiple GPIO ports and Ethercat for multi-camera and vision sensors, this platform boasts advanced specifications and high-performance mobility that provide the compatibility and scalability required for implementing intelligent robots.