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Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.

KEY FEATURES:

  • • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
Chipset
Type Development Kits
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.

KEY FEATURES:

  • Qualcomm® QRB5165 chipset
  • 8GB LPDDR5 RAM + 128GB UFS Flash
  • Ubuntu 18.04 Linux
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Ultra-compact 50 x 29 mm form factor
Chipset
Type System-on-Modules
TurboX C5165N SOM

The TurboX C5165N SOM (System on Module) is a high-performance, intelligent compute module based on the Qualcomm(R) QRB5165N with a higher temperature rating. The Qualcomm QRB5165N, built on the 7nm process, is designed for robotics applications that require superior performance, power efficiency, and powerful computing (15 TOPS). It supports two MIPI-DSIs, video decoding up to 4K@240FPS / 8K@60FPS, video encoding up to 4K@120FPS / 8K@30FPS, six MIPI-CSIs, up to 7-camera currency, as well as a rich set of peripheral interfaces, including Wi-Fi 6, GPIO, UART, I2C, I3C, SPI, USB 3.1 and PCIe 3.0. The TurboX C5165N SOM is a high-performance AIoT SOM for service or industrial robots and drones providing customers with a rich set of hardware interfaces and a dedicated software SDK to validate functions and build the prototype quickly.

KEY FEATURES:

  • Non-POP design, higher temperature tolerance
  • Extended UFS interface
  • Extended PCIe interface
Chipset
Type System-on-Modules
Qualcomm® Robotics RB6 Platform

The Qualcomm® Robotics RB6 platform sits at the premium tier of Qualcomm Technologies’ robotics solutions, delivering expanded capabilities that take enterprise and industrial robotics innovation to the next level with enhanced AI and 5G. This solution enables cutting-edge 5G connectivity with support for global sub-6GHz and mmWave bands in mainstream, enterprise, and private networks.

KEY FEATURES:

  • Easy-to-use, comprehensive, customizable premium AI SDK
  • Enhanced Qualcomm® AI Engine and power-efficient on-device AI computing and video processing
  • Latest 5G connectivity
  • Comprehensive hardware solution
Chipset
Type Reference Design Platforms
5G Mezz package(Sub-6G only, Japan&Korea), Thundercomm T55M

With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.

Chipset
Type Expansion Boards