5 results
IQ-8275 Evaluation Kit
The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.
ByQualcomm
Chipset
Type Evaluation Boards
Arduino®️ VENTUNO™ Q
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

KEY FEATURES:

  • Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
  • 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
  • 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
  • Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
  • Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
  • Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
Chipset
Type Single-Board Computers
Thundercomm TurboX I8275 Development Kit
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.

KEY FEATURES:

  • Initial configuration with the I8275-AC SOM
  • Up to 40 TOPS of edge AI performance
  • Three 22-pin MIPI CSI camera connectors
  • HDMI output and DisplayPort 1.4
  • Three USB 3.0 Type-A ports
  • One USB 3.0 Type-C and one USB 2.0 Type-A port
  • Gigabit Ethernet
  • M.2 Key M and M.2 Key E expansion
  • 40-pin expansion connector and PWM fan connector
  • Qualcomm Linux support
  • Compact 120 mm x 100 mm carrier board
Chipset
Type Development Kits
SECO SOM-SMARC-Dragonwing-IQ8
SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.

KEY FEATURES:

  • Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
  • Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
  • High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
  • Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
Chipset
Type System-on-Modules