工业基础设施
Industrial Infrastructures
全新推出的三款工规级处理器平台——高通跃龙™ IQ9、IQ8 与 IQ6 系列,专为严苛的工业应用场景量身打造。此系列芯片组凭借高达 100 TOPS 的端侧AI性能、极端温度耐受性与内置安全功能,赋能开发人员和企业打造面向机器人、无人机、工业自动化应用等领域的定制化解决方案。
实用文档
平台产品组合
Qualcomm® 产品能够实时处理海量数据、优化运行效率并推动创新。
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Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | Bluetooth Specification Version | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ IQ9 Series | ||||||||||||||||
IQ-9075 Active | Qualcomm® Kryo™ | 8 | Up to 2.36 GHz | Qualcomm® Adreno™ 663 | 800 MHz | 3200 MHz | LPDDR5 | — | 12 | 2x Display Serial Interface (DSI) | 21x QUP1 | Linux Yocto | Wi-Fi 4 | 802.11be | Bluetooth® 5.3 | 4 nm |
Qualcomm® Dragonwing™ IQ8 Series | ||||||||||||||||
IQ-8275 Active | Qualcomm® Kryo™ | 8 | Up to 2.35 GHz | Qualcomm® Adreno™ 623 | 877 MHz | 3200 MHz | LPDDR5x | 1x Qualcomm® Hexagon™ V66 | 5 | 1x 4-lane Display Serial Interface (DSI) | 1x QSPI | Linux Yocto | — | — | Bluetooth® 5.3 | 4 nm |
Qualcomm® Dragonwing™ IQ6 Series | ||||||||||||||||
IQ-615 Sampling | Qualcomm® Kryo™ 460 | 8 | Up to 1.9 GHz | Qualcomm® Adreno™ 612 | Up to 845 MHz | 1555 MHz | LPDDR4x | Qualcomm® Hexagon™ V66 | 3 | — | 100x GPIO | Linux Yocto | — | — | Bluetooth® 5.3 | — |
Qualcomm® Dragonwing™ IQ-X Series | ||||||||||||||||
IQ-X Series Active | Qualcomm® Oryon™ | 12 | 3.4 GHz | Qualcomm® Adreno™ | 1.25 GHz | 4200 MHz | LPDDR5x | Qualcomm® Hexagon™ V73M | — | 1x 4-lane Embedded DisplayPort (eDP) | QUP | Windows | — | — | — | — |
- Supports UART/I2C/SPI
探索基于高通跃龙™的成果
您可通过我们的设备查找器,探索所有搭载高通跃龙™处理器的设备系列。对比功能与性能,精准匹配您的需求。
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