Designed to support Industry 4.0 including the Factory of the Future and with its support of features such as eURLLC to provide low latency and link reliability (up to 99.9999%) needed for factory automation, mission critical control of equipment and machines. This platform addresses the demands of 5G, including public and private networks, indoor and outdoor mmWave and Sub-6 GHz deployments, industrial automation, and more.

This platform offers unmatched data speeds, capacity and global band support of up to 8 Gbps with 1 GHz bandwidth support on mmWave and support for wider 200MHz. The Qualcomm Dragonwing™ FSM200 Platform also supports spectrum aggregation of 200 MHz of sub-6 GHz spectrum across FDD and TDD delivering data speeds of up to 4 Gbps.

The Qualcomm Dragonwing™ FSM200 Platform supports all key 5G functional split options allowing for the disaggregation of the RAN into standards-based and interoperable modular components which provides OEMs and operators ultimate deployment flexibility.

The new platform brings major enhancements to RF with its support for all commercial global mmWave and Sub-6 GHz bands, including the new n259 (41 GHz), n258(26 GHz) and FDD bands. This next generation platform is primed to take powerful mmWave performance to more places, indoors and outdoors and around the globe, while, in parallel, introducing new Sub-6 opportunities with small cell densification in public and private networks.

The new platform offers superior power efficiency, high performance and reliability while meeting challenging power, cost and size requirements for indoor and outdoor deployments. With its low power operation, the Qualcomm Dragonwing™ FSM200 Platform enables Power over Ethernet (PoE) support which allows utilization of power and backhaul from one source which simplifies deployments and reducing cost. It also facilitates small form factor designs for indoor deployments in offices, factories, and public venues.