QCC3001

End of life

QCC3001

Contact sales

On this page

Overview

Benefits

Block Diagram

Features / Specs

Product Comparison

Access More

Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.

The QCC3001 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.

The QCC3001 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.

A single-chip dual-mode Bluetooth 5 system, QCC3001 SoC features 8th generation Qu...

QCC3001, Qualcomm cVc, Qualcomm Kalimba, and Qualcomm TrueWireless are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Cost-effective, single-chip flash programmable platform solution

QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs.

Support for Over-the-Air updates

Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory.

8th generation cVc noise cancellation technology

cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices.

QCC3001 Block Diagram

Features

Dual-mode Bluetooth 5 qualified radio
Variants designed to address both headsets/headphones and speaker applications
Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single
chip solution
Customizable application code
Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
A rich set of features, use cases and programmability at more cost-effective price points
Pin compatible with CSRA63xxx and CSRA64xxx family of products
Supports OTA updates
Integrated Qualcomm TrueWireless Stereo technology
Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
SBC and AAC codecs
Promotes reduced development time with support of application image and source code, IDE and configuration
Updated Generic Application Interface Architecture (GAIA) protocol v3

Specifications

CPU

Clock Speed

Up to 80 MHz

DSP

Name

Qualcomm® Kalimba™

Bluetooth

Specification Version

Bluetooth® 5.0

Connection Technology

Bluetooth® Low Energy, Bluetooth® Classic, Dual-mode Bluetooth®

Topologies

Qualcomm® TrueWireless™ technology

Classic Profiles

Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3, Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5, Bluetooth® Hands-Free Profile (HFP) 1.7

Audio

Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support

Qualcomm® cVc™ Echo Cancelling and Noise Suppression

Flash

Density

Up to 64 MB

Location

External

BGA
WLCSP

Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Compare related products.

Note: to leverage the best experience for the product comparison table, please use the desktop to view content.

4 of 4 total products

Product	CPU Clock Speed	DSP Name	Bluetooth Specification Version	Connection Technology	Classic Profiles	Audio Playback Interfaces Modes	Package Type
Other
QCC3002 End of life	Up to 80 MHz	Qualcomm® Kalimba™	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	Mono	WLCSP BGA
QCC3004 End of life	Up to 80 MHz	Qualcomm® Kalimba™	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	Stereo	QFN BGA
QCC3005 Not for new design	Up to 80 MHz	Qualcomm® Kalimba™	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	Stereo	QFN BGA
QCC3001 End of life	Up to 80 MHz	Qualcomm® Kalimba™	Bluetooth® 5.0	Bluetooth® Low Energy Bluetooth® Classic Dual-mode Bluetooth®	Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth® Hands-Free Profile (HFP) 1.7	Mono	WLCSP BGA

Access more.

To access more QCC3001 resources, you need to be a member of a verified company. Company verification is initiated by filling out our access request form.

Already have a Qualcomm account?

QCC3001 Block Diagram

Features

Compare related products.

Other