Bringing Real-Time 3D Mapping to a Handheld Scanner
Customer
A global survey and measurement technology company
Solution Partner
eInfochips Inc., an Arrow company
Application
Handheld imaging laser scanner for real-time 3D spatial mapping and digital twin creation
Industry
Architecture, engineering and construction (AEC), industrial, and smart cities
Qualcomm Platform
Dragonwing QCS8550
Featured Offering
eInfochips Aikri QCS8550 System on Module
Overview
Traditional 3D laser scanning often requires multiple stationary setups, followed by post-processing to combine the captured data.
A global measurement technology company wanted its second-generation scanner to capture a space continuously as the operator walked through it. The device needed to combine LiDAR measurements, camera imagery, and motion data into an accurate 3D model.
To build it, the company partnered with eInfochips, whose Aikri QCS8550 System on Module (SoM) based on the Dragonwing QCS8550 provided the production-ready compute foundation.
The Challenge: More Sensor Processing Within the Same Handheld Design
As the operator moved through a space, the scanner needed to continuously determine its position, align LiDAR measurements with visual data, compensate for motion, and process four camera streams simultaneously.
The platform had to:
- Run LiDAR SLAM, visual SLAM, and IMU processing concurrently and support four synchronized HDR cameras
- Process imagery for navigation, panoramic capture, and point-cloud colorization
- Transfer larger scan files more quickly
- Preserve the existing enclosure and thermal design
- Support BSP development, certification, manufacturing, and long-term maintenance
The customer needed an integrated platform that could handle these workloads without adding multiple processing devices or increasing the scanner’s size.
The Solution: An eInfochips Platform Powered by Dragonwing QCS8550
eInfochips integrated the AiKri QCS8550 SoM into a custom carrier board connecting the scanner’s LiDAR subsystem, cameras, sensors, storage, wireless connectivity, and high-speed I/O. The platform combined the processing, imaging, AI, and connectivity capabilities required for handheld 3D capture.
The solution included:
- Real-time sensor fusion: Dragonwing QCS8550 provided 48 INT8 TOPS of AI performance for processing LiDAR, camera, and IMU data on the device, helping enable continuous localization without cloud dependence.
- Four-camera HDR imaging: The Qualcomm Spectra™ ISP supported four synchronized HDR camera streams for visual SLAM, panoramic capture, and point-cloud colorization.
- Faster data transfer: USB 3.1 Type-C connectivity provided the bandwidth needed to help offload large 3D capture files.
- Production-ready integration: The AiKri SoM provided a reusable compute platform, while the custom carrier supported the scanner’s specific sensor and I/O requirements.
The Results: Continuous 3D Spatial Mapping in a Handheld Device
- Walk-and-scan mapping: The scanner processed LiDAR, camera, and motion data as the operator moved through a building or industrial environment, reducing reliance on stationary scanning positions.
- More capability in the same enclosure: The platform was designed to deliver more compute, imaging, AI, and connectivity performance without requiring a larger handheld design.
- Faster data transfer: High-speed USB connectivity helped cut the time required to move captured data into downstream processing and visualization systems.
- Faster path to production: The production-ready SoM and reusable reference design helped reduce platform bring-up, software integration, and certification risk.
- Support for additional products: The reference architecture was reused across two additional product derivatives.
- Long-term platform stability: The Qualcomm Product Longevity Program covers Dragonwing QCS8550 through April 2033 and is structured to give a stable foundation for ongoing production and maintenance.
