Press Release

Qualcomm to Deliver 28 Mbps Mobile Broadband with HSPA+ in 2007, Including up to Three-Fold Increase in WCDMA Voice Capacity

Backwards-Compatible Evolution of HSPA Garners Support from Multiple Operators

2007年2月12日SAN DIEGO

Qualcomm products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Incorporated (NASDAQ: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the expansion of its product roadmap to include HSPA+. The next generation of WCDMA systems, HSPA+ delivers broadband mobility at unparalleled data speeds and a superior user experience for applications such as Internet browsing, realtime location services, multimedia sharing and other services that can become a fundamental part of everyday life with the freedom that mobility can offer. Qualcomm will sample the Mobile Data Modem™ (MDM™) MDM8200™ solution, the first chipset supporting HSPA+, by the end of 2007. The MDM8200 solution will support deployments in existing frequency bands, as well as in the 2.5 GHz IMT-2000 Extension band.

“Qualcomm is building on its technology leadership - established with the first WCDMA, HSDPA and HSUPA solutions - to now deliver the first HSPA+ chipset,” said Dr. Sanjay K. Jha, chief operating officer of Qualcomm and president of Qualcomm CDMA Technologies. “HSPA+ will enable UMTS operators to seamlessly evolve their networks, utilizing their existing investments to deliver next-generation services starting in 2008.”

HSPA+, based on the 3GPP Release 7 standard, provides data rates of up to 28 Mbps on the downlink and 11 Mbps on the uplink, significant increases in network capacity, reduced latency and an enhanced user experience for many data-intensive applications. HSPA+ offers a two-fold network data capacity increase, resulting in improved economics for operators and enhanced broadband experience for the user. The data throughput of the MDM8200 HSPA+ chipset, as well as the Company's 802.11n WLAN AGN400™ chipset, is further enhanced with Qualcomm's TrueMIMO® technology.

“Cingular Wireless, now part of the new AT&T, is committed to providing its subscribers with cutting-edge wireless capabilities and sees HSPA+ as a very positive leap forward for WCDMA,” said Kris Rinne, senior vice president of architecture and planning. “With HSPA+, we will be able to leverage our existing network to drive increased voice capacity and higher broadband data speeds.”

“The 3 Group networks were designed from the start to deliver mobile broadband to our customers. We have been able to leverage our extensive 3G coverage and capacity to offer truly revolutionary Internet services and pricing to mobile customers with our X-series offering. Wireless devices are becoming a major interface to a range of high-bandwidth Internet applications like YouTube, Sling and other music, gaming and video services,” said Frank Meehan, director and general manager of 3G handsets and applications for HWL. “We are already offering the benefits of HSDPA to our customers to take advantage of these services. HSPA+ is a very exciting development that will allow customers with 3G/HSPA+ handsets to enjoy the world of the Internet on their mobile devices at speeds up to 28 megabits per second. The 3 Group, with its considerable worldwide 3G footprint, is well placed to continue driving the delivery of the mobile broadband Internet.”

“Telstra currently has the world's largest HSDPA network, and our future needs require even higher data rates to support inevitably bigger-bandwidth services, support for applications such as movie downloads, and an easy upgrade path,” said Jon Gonner, executive managing director for wireless at Telstra. “HSPA+ provides us with all of these capabilities, and we intend to roll the technology out to reinforce our position as having a leading-edge wireless data and voice network.”

“TIM has had great success with HSDPA deployment and the wide availability of cards and phones supporting it,” said Luigi Licciardi, senior vice president of mobile industry relations at Telecom Italia. “We look forward to continuing to offer our subscribers new compelling applications, and HSPA+ is a promising technology for the future to provide even higher bandwidth to our users and reinforce our leadership.”

The Continuous Packet Connectivity feature set in HSPA+ Release 7 increases voice capacity by two-fold over existing R'99 UMTS networks via VoIP, and up to three-fold using additional advanced receivers and vocoder enhancements, without compromising voice quality. HSPA+ is backward compatible with all prior generations of WCDMA and evolves existing networks without the need for new spectrum, providing a cost-effective migration path for network operators to seamlessly transition from HSDPA/HSUPA. Additional innovations in HSPA+ will enable longer battery life for devices. Trials are anticipated in early 2008, with the first commercial deployments expected in late 2008.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The NASDAQ Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the speed with which the Company develops and samples the MDM8200 chipset, the extent and speed to which HSPA+ networks are deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.
###