2 results
Mango DVK
The Mango DVK is a comprehensive development kit that is specifically designed to support the Mango-I and Mango system-on-module (SOM) devices, which are based on the Qualcomm® IPQ6010 system-on-chip (SoC). This kit includes a rich set of interfaces, including an SFP port, USB 3.0 interface, 2.5 Gbps ETH interface, and 2x ETH 1Gbps interfaces, in addition to a UART header and GPIO header. The board also features a configuration switch, integrated antenna, and a U.FL connector for an external antenna. With these features, the Mango DVK provides developers with ample options for connecting and communicating with other devices and peripherals, making it a versatile and powerful tool for development and testing purposes.

KEY FEATURES:

  • UART/ GPIO headers | Configuration switch | DC power supply | 2.5 Gbps ETH interface + POE passive 24-48V | SFP Port | 2x ETH 1Gbps interface | SD card socket | EMMC module socket
Chipset
Type Development Kits
Mango Wi-Fi Module
The Mango System on Module (SOM) is built on the Qualcomm® IPQ6010 SoC, featuring a robust quad-core processor with NEON SIMD DSP extension on each core. This combination makes it a perfect fit for routers, gateways, and access points. The SOM includes a dual-band concurrent radio that supports WIFI 6 (802.11ax) technology with 2x2 MiMo capabilities. It also comes with two Ethernet SerDes to connect to external multi-GbE PHYs, advanced power management to minimize active-standby power consumption, and one USB3.0, USB2.0, PCIe 3.0, and other miscellaneous interfaces that can be reconfigured as general-purpose I/O pins. The SoC also boasts a hardware NAT engine and high-end security features such as a crypto engine. The module is surface mountable, and is available in two temperature ranges: commercial (0-65°C) and industrial (-40-85°C)

KEY FEATURES:

  • 1.5+ Gbps data rate and 1.4 Gbps over-the-air throughput | 4 download and upload OFDMAs | Multiple boot options SPI/NOR/NAND, Parallel NAND, eMMC, SD | Neon FPU and secure boot | Many peripheral interfaces: USB3.0/2.0, I2S/TDM, SPDIF, PWM, GPIOSs |
Chipset
Type System-on-Modules