QCA7005
QCA7005
QCA7005

A HomePlug Green PHY (HPGP) powerline communication (PLC) connectivity solution for electric vehicle (EV) charging applications.

The QCA7005 is the latest addition to the Powerline Communications (PLC) portfolio of communication ICs from Qualcomm. It is fully compliant with the HomePlug Green PHY (HPGP) specification. The HomePlug Green PHY specification supports the requirements of automotive applications including the Combined Charging System (CCS) and the North American Charging Standard (NACS) as well as home, utility, and Smart Grid environments. The QCA7005 is interoperable up to the HPGP maximum data rate of 10 Mbps and offers lower power consumption, lower product complexity and reduced BOM costs.

With the release of firmware version QCA7000.NU.3.5, the PIB (Parameter Information Block) security issues referenced in DEF CON 33 and CVE‑2025‑47324 have been fully resolved and are now embedded directly into the firmware, making them non‑configurable. As a result, remote devices can no longer read or write any PLC‑side information. For more details, please refer to the QCA7000.NU.3.5 firmware release notes.

QCA7005 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Benefits

default icon alt text
Compliant with HPGP standard

Meets industry standards for powerline communications.

default icon alt text
Compliant with CCS and NACS
Meets industry standards for EV charging application.
default icon alt text
Interoperable with QCA7000 and QCA7006AQ
Footprint and pinout compatibility with QCA7000 and QCA7006AQ devices
default icon alt text
Smart-grid charging

Allows for advanced bi-directional communication between EVs, charging stations and the grid to support smart charging applications. Powerline communication devices help to manage and balance energy flow as more road users continue trending toward EVs.

Features

  • PLC HomePlug Green PHY (HPGP) communication mode
  • Interoperable with HPAV and HPAV2 communication modes
  • Boot from host or external flash
  • Dedicated flash memory port
  • Host digital interfaces: SPI (Slave), UART
  • Powered by Single 3.3 VDC rail (integrated power management unit)
Specifications
Ethernet
Peak PHY Rate
10 MBps
Standards
IEEE 1901
Powerline Communication Standards
Home Plug Green PHY
Home Plug Green PHY
Modulation
QPSK
Interfaces
General Purpose I/Os
4
Supported Interfaces
SPI, UART
Layers
PHY, MAC
Package
Pins
68 pins
Size
8 × 8 mm
Type
QFN
Operating Temperature Range
Maximum Temperature
85 °C
Minimum Temperature
-40 °C
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

Stay connected

Get the latest Qualcomm and industry information delivered to your inbox.

Subscribe
Manage your subscription
Also of Interest

© Qualcomm Technologies, Inc. and/or its affiliated companies.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.