We provide hardware design and production services, covering schematics, prototyping, final production—including certification via manufacturing partners. With China's highly efficient manufacturing capabilities, we ensure streamlined production processes. We also offer sub-board and custom module design. Our experienced team, focused solely on Qualcomm Technologies chips, delivers fast, cost-effective solutions to any specs, with a focus on optimizing range, minimizing leakage, and eliminating audio interference.

Firmware development services for wireless audio segments, covering classic Bluetooth and LE audio, with support for Bluetooth headsets, speakers, audio transmitters, receivers, intercoms and active noise cancellation headsets. Our design capabilities span all levels, including drivers, application frameworks, customized profiles, user case design, audio flow design, full applications and UI, as well as 3rd party IP porting and integration.We analyze customer requirements, work out software architecture and block diagrams, and formulate project resources and schedule plans.The firmware we deliver targets production quality, not just prototyping.

Our experience team can provide customized Audio DSP design services, which covering from customized audio chain design, enhanced post processing, audio algorithm porting and integration, full DSP software development to cover all user cases of a product. We can also define and handle the control interface to dynamically manage audio DSP workflow and configurations.Our service can also cover the correlated application reference software to match to the designed audio DSP software to make sure a seamless working manner in a high stability as well.

RelaJet provides integrated SW and HW solution for OTC hearing aid and hearing amplifier for form factors such as earbuds, OWS, CIC, and RIC based on Qualcomm® QCC518x and Qualcomm® QCC309x.

Want to change the game with your next product? We design high-performance audio hardware from the ground up—literally. From chip-down integration of the latest Qualcomm Technologies audio SoCs to smart antenna design and RF, power, and audio optimization, we engineer for excellence. Got demanding specs? We thrive on them: ultra-compact systems, flexible and rigid PCBAs, design-for-test/manufacture, and ultra-low power tuning. We meet regulatory requirements (even medical) and streamline manufacturing with custom end-of-line test jigs and scripts.Bring us your boldest ideas—we’ll make them work beautifully.