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Legal notice

May 2023 Security Bulletin

Updated On: 05/01/2023

This security bulletin is intended to help Qualcomm Technologies, Inc. (QTI) customers incorporate security updates in launched or upcoming devices. This document includes (i) a description of security issues that have been addressed in QTI’s proprietary code and (ii) links to publicly available code where security issues have been addressed.

Please reach out to [email protected] for any questions related to this bulletin.

Table of Contents

Announcements
Acknowledgements
Proprietary Software Issues
Open Source Software Issues
Industry Coordination

Announcements

None

Acknowledgements

We would like to thank these researchers for their contributions in reporting these issues to us.

CVE-2023-21665,CVE-2023-21666 Jann Horn of Google Project Zero
CVE-2022-33281 Jun Cen ([email protected])

Proprietary Software Issues

The tables below summarize security vulnerabilities that were addressed through proprietary software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2022-25713 High High Automotive Internal
CVE-2022-33273 High High Trusted Execution Environment Internal
CVE-2022-33304 High High Data Network Stack & Connectivity Internal
CVE-2022-33305 High High LTE Internal
CVE-2022-34144 High High Modem Internal
CVE-2022-40504 High High LTE Internal
CVE-2022-40505 High High Data Network Stack & Connectivity Internal
CVE-2022-40508 High High Modem Internal
CVE-2023-21642 High High Multimedia Internal

CVE-2022-25713

CVE ID CVE-2022-25713
Title Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive
Description Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key.
Technology Area Automotive
Vulnerability Type CWE-119 Improper Restriction of Operations within the Bounds of a Memory Buffer
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* AR8035, FastConnect 6200, FastConnect 6800, FastConnect 6900, QAM8295P, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QSM8350, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SA8540P, SA9000P, SD 8 Gen1 5G, SD865 5G, SM7250P, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR2 5G Platform, SXR2130, WCD9380, WCD9385, WSA8810, WSA8815, WSA8830, WSA8835

CVE-2022-33273

CVE ID CVE-2022-33273
Title Buffer over-read in Trusted Execution Environment
Description Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation.
Technology Area Trusted Execution Environment
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.3
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:N/A:L
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* AQT1000, AR8035, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8295P, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QSM8350, Robotics RB3 Platform, SA6145P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8295P, SA8540P, SA9000P, SD 675, SD 8 Gen1 5G, SD 8CX, SD670, SD675, SD855, SD865 5G, SDX55, SDX57M, SM7250P, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR2 5G Platform, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3990, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2022-33304

CVE ID CVE-2022-33304
Title NULL pointers dereference in Modem
Description Transient DOS due to NULL pointer dereference in Modem while performing pullup for received TCP/UDP packet.
Technology Area Data Network Stack & Connectivity
Vulnerability Type CWE-476 NULL Pointer Dereference
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 9205 LTE Modem, 9206 LTE Modem, 9207 LTE Modem, AR8031, CSRA6620, CSRA6640, FastConnect 6900, FastConnect 7800, Home Hub 100 Platform, MDM8207, QCA4004, QCA4024, QTS110, Smart Audio 400 Platform, Snapdragon 1100 Wearable Platform, Snapdragon 1200 Wearable Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon Wear 1300 Platform, Snapdragon X5 LTE Modem, SSG2115P, SSG2125P, SXR1230P, SXR2230P, WCD9306, WCD9330, WCD9335, WCD9380, WCD9385, WCN3980, WCN3999, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2022-33305

CVE ID CVE-2022-33305
Title Null pointer dereference in Modem
Description Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH.
Technology Area LTE
Vulnerability Type CWE-476 NULL Pointer Dereference
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 315 5G IoT Modem, AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6391, QCA6574A, QCA6595AU, QCA6696, QCA8081, QCA8337, QCM2290, QCM4290, QCM4325, QCM6490, QCN6024, QCN9024, QCS2290, QCS4290, QCS6490, SD888, SDX55, SDX57M, SG4150P, SM7250P, SM7315, SM7325P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, SW5100, SW5100P, WCD9335, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3910, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835

CVE-2022-34144

CVE ID CVE-2022-34144
Title Reachable assertion in Modem
Description Transient DOS due to reachable assertion in Modem during OSI decode scheduling.
Technology Area Modem
Vulnerability Type CWE-617 Reachable Assertion
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 315 5G IoT Modem, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6391, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCM4490, QCM6490, QCN6024, QCN9024, QCS4490, QCS6490, SD888, SDX55, SDX57M, SM4450, SM7250P, SM7315, SM7325P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2022-40504

CVE ID CVE-2022-40504
Title Reachable assertion in Modem
Description Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.
Technology Area LTE
Vulnerability Type CWE-617 Reachable Assertion
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 315 5G IoT Modem, APQ8017, AQT1000, AR8035, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM10055, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCN6024, QCN9024, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Robotics RB3 Platform, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SC8180X+SDX55, SD 455, SD 675, SD460, SD626, SD660, SD662, SD670, SD675, SD730, SD855, SD865 5G, SD888, SDX55, SDX57M, SG4150P, SM4450, SM6250, SM6250P, SM7250P, SM7315, SM7325P, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 427 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 435 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 450 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 630 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon Auto 4G Modem, SW5100, SW5100P, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3610, WCN3615, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2022-40505

CVE ID CVE-2022-40505
Title Buffer over-read in Modem
Description Information disclosure due to buffer over-read in Modem while parsing DNS hostname.
Technology Area Data Network Stack & Connectivity
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 8.2
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 9205 LTE Modem, 9206 LTE Modem, 9207 LTE Modem, MDM8207, QCA4004, QCA4010, QTS110, Snapdragon 1100 Wearable Platform, Snapdragon 1200 Wearable Platform, Snapdragon Wear 1300 Platform, Snapdragon X5 LTE Modem, WCD9306, WCD9330

CVE-2022-40508

CVE ID CVE-2022-40508
Title Reachable assertion in Modem
Description Transient DOS due to reachable assertion in Modem while processing config related to cross carrier scheduling, which is not supported.
Technology Area Modem
Vulnerability Type CWE-617 Reachable Assertion
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2022/11/07
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCN6024, QCN9024, SD855, SD865 5G, SD888, SDX55, SDX57M, SM7250P, SM7315, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 780G 5G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon XR2 5G Platform, SXR2130, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835

CVE-2023-21642

CVE ID CVE-2023-21642
Title Improper Access Control in HAB Memory Management
Description Memory corruption in HAB Memory management due to broad system privileges via physical address.
Technology Area Multimedia
Vulnerability Type CWE-284 Improper Access Control
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/02/06
Affected Chipsets* QAM8295P, QCA6574AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SA8540P, SA9000P

*The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

Open Source Software Issues

The tables below summarize security vulnerabilities that were addressed through open source software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2022-33292 High High Qualcomm IPC Internal
CVE-2023-21665 High High Graphics 02/08/2023
CVE-2023-21666 High High Graphics 02/08/2023

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2022-33281 Medium Medium ComputerVision 07/25/2022

CVE-2022-33292

CVE ID CVE-2022-33292
Title Use after free in Qualcomm IPC
Description Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.
Technology Area Qualcomm IPC
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2022/10/03
Affected Chipsets* SG4150P, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), WCD9370, WCD9375, WCN3950, WCN3988, WSA8810
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/1f33564f37d7b0e21cd9b2725198d56706b210b7

CVE-2023-21665

CVE ID CVE-2023-21665
Title Incorrect Type Conversion or Cast in Graphics
Description Memory corruption in Graphics while importing a file.
Technology Area Graphics
Vulnerability Type CWE-704 Incorrect Type Conversion or Cast
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/02/08
Customer Notified Date 2023/03/06
Affected Chipsets* 315 5G IoT Modem, 9206 LTE Modem, APQ8017, APQ8052, APQ8056, APQ8064AU, APQ8076, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, Flight RB5 5G Platform, Home Hub 100 Platform, MDM9250, MDM9628, MDM9650, MSM8108, MSM8209, MSM8608, MSM8996AU, QAM8295P, QCA6174, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCA9379, QCM2290, QCM4290, QCM6125, QCM6490, QCN6024, QCN9011, QCN9012, QCN9024, QCN9074, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCS8155, QCS8250, QRB5165M, QRB5165N, QSM8250, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8295P, SD 675, SD626, SD660, SD670, SD675, SD730, SD835, SD855, SD865 5G, SD888, SDM429W, SDX20M, SDX55, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 450 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 617 Processor, Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 630 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 650 Mobile Platform, Snapdragon 652 Mobile Platform, Snapdragon 653 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SW5100, SW5100P, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 400 Platform, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3610, WCN3615, WCN3620, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-4.19/-/commit/86695e1dd101e71571998281541b0b4378f89414

CVE-2023-21666

CVE ID CVE-2023-21666
Title Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics
Description Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
Technology Area Graphics
Vulnerability Type CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/02/08
Customer Notified Date 2023/03/06
Affected Chipsets* 315 5G IoT Modem, 9206 LTE Modem, APQ8017, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6800, FastConnect 6900, Flight RB5 5G Platform, Home Hub 100 Platform, MDM9250, MDM9628, MDM9650, MSM8108, MSM8209, MSM8608, MSM8909W, QCA6174, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA8337, QCA9367, QCA9377, QCA9379, QCM2290, QCM4290, QCM6125, QCN9011, QCN9012, QCN9074, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS8155, QCS8250, QRB5165M, QRB5165N, QSM8250, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SD 675, SD626, SD660, SD670, SD675, SD730, SD835, SD855, SD865 5G, SDM429W, SDX20M, SDX55, SM4125, SM6250, SM6250P, SM7250P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 450 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF, Snapdragon Wear 2100 Platform, Snapdragon Wear 2500 Platform, Snapdragon Wear 3100 Platform, Snapdragon Wear 4100+ Platform, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 400 Platform, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3610, WCN3615, WCN3620, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WSA8810, WSA8815, WSA8830, WSA8835
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-4.19/-/commit/9968fcdd9d1c853d0c6472307510a81f5db398da

CVE-2022-33281

CVE ID CVE-2022-33281
Title Improper validation of array index in computer vision.
Description Memory corruption due to improper validation of array index in computer vision while testing EVA kernel without sending any frames.
Technology Area ComputerVision
Vulnerability Type CWE-129 Improper Validation of Array Index
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2022/07/25
Customer Notified Date 2022/11/07
Affected Chipsets* FastConnect 6900, FastConnect 7800, Snapdragon 8 Gen 1 Mobile Platform, WCD9380, WSA8830, WSA8835
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/eva-kernel/-/commit/376895dac210c2abfd3b8abb1df201daa171e270

* The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

** Data is generated only at the time of bulletin creation

Industry Coordination

Security ratings of issues included in Android security bulletins and these bulletins match in the most common scenarios but may differ in some cases due to one of the following reasons:

  • Consideration of security protections such as SELinux not enforced on some platforms
  • Differences in assessment of some specific scenarios that involves local denial of service or privilege escalation vulnerabilities in the high level OS kernel

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

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© 2022 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.

  • Table of Contents
  • Announcements
  • Acknowledgements
  • Proprietary Software Issues
  • CVE-2022-25713
  • CVE-2022-33273
  • CVE-2022-33304
  • CVE-2022-33305
  • CVE-2022-34144
  • CVE-2022-40504
  • CVE-2022-40505
  • CVE-2022-40508
  • CVE-2023-21642
  • Open Source Software Issues
  • CVE-2022-33292
  • CVE-2023-21665
  • CVE-2023-21666
  • CVE-2022-33281
  • Industry Coordination
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