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Legal notice

January 2024 Security Bulletin

Updated On: 01/01/2024

This security bulletin is intended to help Qualcomm Technologies, Inc. (QTI) customers incorporate security updates in launched or upcoming devices. This document includes (i) a description of security issues that have been addressed in QTI’s proprietary code and (ii) links to publicly available code where security issues have been addressed.

Please reach out to [email protected] for any questions related to this bulletin.

Table of Contents

Announcements
Acknowledgements
Proprietary Software Issues
Open Source Software Issues
Industry Coordination

Announcements

None

Acknowledgements

We would like to thank these researchers for their contributions in reporting these issues to us.

CVE-2023-33030,CVE-2023-33032 Mahdi Braik of the Apple Media Products RedTeam
CVE-2023-33033,CVE-2023-33110,CVE-2023-33117,CVE-2023-33118,CVE-2023-33120 Conghui Wang (conghuiwang)
CVE-2023-33037,CVE-2023-33108,CVE-2023-28583 Reported to us through Google Android Security team; please see bulletins at https://source.android.com/security/overview/acknowledgements/ for individual credit information. For issues rated medium or lower, the individual credit information may appear in a future Android major release bulletin.
CVE-2023-33114 Ye Zhang (@VAR10CK) of Baidu Security
CVE-2023-33038 Zinuo Han(https://twitter.com/ele7enxxh) of OPPO Amber Security Lab

Proprietary Software Issues

The tables below summarize security vulnerabilities that were addressed through proprietary software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-33025 Critical Critical Data Modem Internal
CVE-2023-33036 Critical High Hypervisor Internal
CVE-2023-33014 High High Core Services Internal
CVE-2023-33030 High Critical HLOS 12/20/2022
CVE-2023-33032 High Critical TZ Secure OS 12/20/2022
CVE-2023-33033 High High Audio 03/20/2023
CVE-2023-33037 High High Automotive 01/27/2023
CVE-2023-33040 High High Data Modem Internal
CVE-2023-33062 High High WLAN Firmware Internal
CVE-2023-33109 High High WLAN Firmware Internal
CVE-2023-33112 High High WLAN Firmware Internal
CVE-2023-33116 High High WIN WLAN Host Internal
CVE-2023-43511 High High WLAN Firmware Internal
CVE-2023-43512 High High Qualcomm ESL Internal

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-28583 Medium Medium Data Network Stack & Connectivity 09/09/2022
CVE-2023-33038 Medium Medium Radio Interface Layer 01/29/2023

CVE-2023-33025

CVE ID CVE-2023-33025
Title Buffer Copy without Checking Size of Input in Data Modem
Description Memory corruption in Data Modem when a non-standard SDP body, during a VOLTE call.
Technology Area Data Modem
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Remote
Security Rating Critical
CVSS Rating Critical
CVSS Score 9.8
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/07/03
Affected Chipsets* AR8035, FastConnect 6700, FastConnect 6900, QCA8081, QCA8337, QCM4490, QCN6024, QCN9024, QCS4490, SM4450, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, WCD9370, WCD9375, WCD9380, WCN3950, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33036

CVE ID CVE-2023-33036
Title NULL Pointer Dereference in Hypervisor
Description Permanent DOS in Hypervisor while untrusted VM without PSCI support makes a PSCI call.
Technology Area Hypervisor
Vulnerability Type CWE-476 NULL Pointer Dereference
Access Vector Local
Security Rating Critical
CVSS Rating High
CVSS Score 7.1
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/07/03
Affected Chipsets* AQT1000, AR8035, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCS8550, QSM8350, Robotics RB3 Platform, SA6145P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8255P, SA8295P, SA8540P, SA9000P, SD 675, SD 8 Gen1 5G, SD 8CX, SD670, SD675, SD855, SD865 5G, SDX55, SDX57M, SM7250P, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR2 5G Platform, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3990, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33014

CVE ID CVE-2023-33014
Title Improper Input Validation in Services
Description Information disclosure in Core services while processing a Diag command.
Technology Area Core Services
Vulnerability Type CWE-20 Improper Input Validation
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.6
CVSS String CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/07/03
Affected Chipsets* AR8035, FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8650P, QAM8775P, QCA6595, QCA6595AU, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCM4490, QCN6024, QCN9024, QCS4490, QCS8550, SA8255P, SM4450, Snapdragon AR2 Gen 1 Platform, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, SSG2115P, SSG2125P, SXR1230P, SXR2230P, WCD9370, WCD9380, WCD9385, WCN3950, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33030

CVE ID CVE-2023-33030
Title Buffer Copy without Checking Size of Input in HLOS
Description Memory corruption in HLOS while running playready use-case.
Technology Area HLOS
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating High
CVSS Rating Critical
CVSS Score 9.3
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported 2022/12/20
Customer Notified Date 2023/07/03
Affected Chipsets* 315 5G IoT Modem, 9205 LTE Modem, 9206 LTE Modem, 9207 LTE Modem, APQ8017, APQ8037, APQ8064AU, AQT1000, AR8031, AR8035, C-V2X 9150, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM10056, Home Hub 100 Platform, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, MDM8207, MDM9250, MDM9628, MDM9640, MDM9650, MSM8108, MSM8209, MSM8608, MSM8909W, MSM8996AU, PM8937, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA4004, QCA4024, QCA6174A, QCA6234, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8337, QCA9367, QCA9377, QCA9379, QCA9984, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCN5021, QCN5022, QCN5052, QCN5121, QCN5122, QCN5152, QCN6023, QCN6024, QCN7606, QCN9000, QCN9011, QCN9012, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS8155, QCS8250, QCS8550, QET4101, QRB5165M, QRB5165N, QSM8250, QSM8350, QSW8573, QTS110, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA9000P, SC8180X+SDX55, SD 455, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD626, SD660, SD662, SD670, SD675, SD730, SD820, SD821, SD835, SD855, SD865 5G, SD888, SDM429W, SDX55, SDX57M, SG4150P, SM4125, SM4450, SM6250, SM6250P, SM7250P, SM7315, SM7325P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1100 Wearable Platform, Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 427 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 430 Mobile Platform, Snapdragon 435 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 450 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 630 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 820 Mobile Platform, Snapdragon 821 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 1300 Platform, Snapdragon Wear 2100 Platform, Snapdragon Wear 2500 Platform, Snapdragon Wear 3100 Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9306, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3610, WCN3615, WCN3620, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33032

CVE ID CVE-2023-33032
Title Integer Overflow or Wraparound in TZ Secure OS
Description Memory corruption in TZ Secure OS while requesting a memory allocation from TA region.
Technology Area TZ Secure OS
Vulnerability Type CWE-190 Integer Overflow or Wraparound
Access Vector Local
Security Rating High
CVSS Rating Critical
CVSS Score 9.3
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported 2022/12/20
Customer Notified Date 2023/07/03
Affected Chipsets* 9205 LTE Modem, AQT1000, AR8031, C-V2X 9150, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6800, FSM10056, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, IPQ9008, IPQ9574, QCA4004, QCA4024, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8386, QCA9377, QCM6125, QCN5021, QCN5022, QCN5052, QCN5121, QCN5122, QCN5152, QCN6023, QCN6024, QCN9000, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9274, QCS410, QCS610, QCS6125, QCS8155, QTS110, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SC8180X+SDX55, SD 675, SD675, SD730, SD855, SDX55, SM6250, SM6250P, Smart Audio 400 Platform, Snapdragon 665 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon Auto 5G Modem-RF, Snapdragon Wear 1300 Platform, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon Auto 4G Modem, WCD9306, WCD9335, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9380, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WSA8810, WSA8815

CVE-2023-33033

CVE ID CVE-2023-33033
Title Use of Out-of-range Pointer Offset in Audio
Description Memory corruption in Audio during playback with speaker protection.
Technology Area Audio
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/03/20
Customer Notified Date 2023/07/03
Affected Chipsets* 315 5G IoT Modem, 9205 LTE Modem, 9206 LTE Modem, 9207 LTE Modem, APQ8017, APQ8037, APQ8064AU, APQ8076, APQ8084, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Home Hub 100 Platform, MDM8207, MDM9225, MDM9225M, MDM9230, MDM9235M, MDM9250, MDM9330, MDM9625, MDM9625M, MDM9628, MDM9630, MDM9635M, MDM9640, MDM9650, MSM8108, MSM8209, MSM8608, MSM8909W, MSM8996AU, PM8937, QAM8295P, QCA4004, QCA6174, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCA9379, QCA9984, QCM2290, QCM4290, QCM4490, QCM6125, QCM6490, QCN6024, QCN9011, QCN9012, QCN9024, QCN9074, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS8250, QCS8550, QRB5165M, QRB5165N, QSM8250, QTS110, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8295P, SC8180X+SDX55, SD 455, SD 675, SD 8CX, SD460, SD626, SD660, SD662, SD670, SD675, SD730, SD820, SD835, SD855, SD865 5G, SD888, SDM429W, SDX55, SDX57M, SG4150P, SM4125, SM4450, SM6250, SM6250P, SM7250P, SM7315, SM7325P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1100 Wearable Platform, Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 427 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 430 Mobile Platform, Snapdragon 435 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 450 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 630 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 820 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon Auto 5G Modem-RF, Snapdragon Wear 1300 Platform, Snapdragon Wear 2100 Platform, Snapdragon Wear 2500 Platform, Snapdragon Wear 3100 Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9306, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3610, WCN3615, WCN3620, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33037

CVE ID CVE-2023-33037
Title Cryptographic Issues in Automotive
Description Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data.
Technology Area Automotive
Vulnerability Type CWE-310 Cryptographic Issues
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.1
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N
Date Reported 2023/01/27
Customer Notified Date 2023/07/03
Affected Chipsets* AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCM4325, QCM4490, QCN6024, QCN9024, QCS4490, QCS8550, QSM8350, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA9000P, SD 8 Gen1 5G, SD865 5G, SG4150P, SM4450, SM7250P, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR2 5G Platform, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33040

CVE ID CVE-2023-33040
Title Buffer Over-read in Data Modem
Description Transient DOS in Data Modem during DTLS handshake.
Technology Area Data Modem
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/07/03
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8035, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6174A, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCN6024, QCN9024, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS8550, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SC8180X+SDX55, SD 675, SD460, SD662, SD675, SD730, SD855, SD865 5G, SD888, SDX55, SDX57M, SG4150P, SM4450, SM6250, SM6250P, SM7250P, SM7315, SM7325P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon Auto 4G Modem, SW5100, SW5100P, SXR2130, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-33062

CVE ID CVE-2023-33062
Title Buffer Over-read in WLAN Firmware
Description Transient DOS in WLAN Firmware while parsing a BTM request.
Technology Area WLAN Firmware
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5010, IPQ5028, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9554, IPQ9570, IPQ9574, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA0000, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9886, QCA9888, QCA9889, QCA9980, QCA9984, QCA9985, QCA9986, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN7605, QCN7606, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QRB5165M, QRB5165N, QSM8250, QSM8350, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SC8180X+SDX55, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD660, SD662, SD670, SD675, SD730, SD855, SD865 5G, SD888, SDX55, SDX65M, SG4150P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33109

CVE ID CVE-2023-33109
Title NULL Pointer Dereference in WLAN Firmware
Description Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.
Technology Area WLAN Firmware
Vulnerability Type CWE-476 NULL Pointer Dereference
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ4018, IPQ4028, IPQ4029, IPQ5010, IPQ5028, IPQ5332, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8069, IPQ8070, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9554, IPQ9570, IPQ9574, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA0000, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6428, QCA6430, QCA6431, QCA6436, QCA6438, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9886, QCA9888, QCA9889, QCA9898, QCA9980, QCA9984, QCA9985, QCA9986, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN7605, QCN7606, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, QSM8250, QSM8350, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SC8180X+SDX55, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD660, SD662, SD670, SD675, SD730, SD835, SD855, SD865 5G, SD888, SDX55, SDX65M, SG4150P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33112

CVE ID CVE-2023-33112
Title Buffer Over-read in WLAN Firmware
Description Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element.
Technology Area WLAN Firmware
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, AR9380, CSR8811, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5010, IPQ5028, IPQ5332, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9554, IPQ9570, IPQ9574, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA0000, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9886, QCA9888, QCA9889, QCA9980, QCA9984, QCA9985, QCA9986, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCC710, QCM4490, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS4490, QCS6490, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, QSM8350, Qualcomm® Video Collaboration VC3 Platform, Robotics RB5 Platform, SA8255P, SA8295P, SD 8 Gen1 5G, SD865 5G, SD888, SG8275P, SM7315, SM7325P, SM8550P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, WCD9340, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3980, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33116

CVE ID CVE-2023-33116
Title Buffer over-read without Checking Size of Input in WLAN Host
Description Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver.
Technology Area WIN WLAN Host
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, AR9380, CSR8811, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ4018, IPQ4019, IPQ4028, IPQ4029, IPQ5010, IPQ5028, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9570, IPQ9574, QCA0000, QCA4024, QCA6391, QCA7500, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9880, QCA9886, QCA9888, QCA9889, QCA9898, QCA9980, QCA9984, QCA9985, QCA9990, QCA9992, QCA9994, QCC710, QCF8001, QCN5022, QCN5024, QCN5052, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN9000, QCN9011, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QFW7114, QFW7124, QRB5165M, QRB5165N, Robotics RB5 Platform, SDX55, SDX65M, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, WCD9340, WCD9380, WCD9385, WCN3980

CVE-2023-43511

CVE ID CVE-2023-43511
Title Loop with Unreachable Exit Condition (Infinite Loop) in WLAN Firmware
Description Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.
Technology Area WLAN Firmware
Vulnerability Type CWE-835 Loop with Unreachable Exit Condition ('Infinite Loop')
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, 9206 LTE Modem, APQ8017, APQ8064AU, APQ8092, APQ8094, AQT1000, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Home Hub 100 Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ4018, IPQ4028, IPQ4029, IPQ5010, IPQ5028, IPQ5332, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8069, IPQ8070, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9554, IPQ9570, IPQ9574, MDM9250, MDM9628, MDM9640, MDM9645, MDM9650, MSM8996AU, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA0000, QCA1023, QCA1062, QCA1064, QCA1990, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA4531, QCA6174, QCA6174A, QCA6175A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6428, QCA6430, QCA6431, QCA6436, QCA6438, QCA6554A, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9367, QCA9377, QCA9379, QCA9886, QCA9888, QCA9889, QCA9898, QCA9980, QCA9984, QCA9985, QCA9986, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN7605, QCN7606, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, QSM8250, QSM8350, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SC8180X+SDX55, SD 455, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD660, SD662, SD670, SD675, SD730, SD820, SD821, SD835, SD855, SD865 5G, SD888, SDX20M, SDX55, SDX65M, SG4150P, SG8275P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 200 Platform, Smart Audio 400 Platform, Snapdragon 1200 Wearable Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 630 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 808 Processor, Snapdragon 810 Processor, Snapdragon 820 Automotive Platform, Snapdragon 820 Mobile Platform, Snapdragon 821 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3610, WCN3615, WCN3660B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43512

CVE ID CVE-2023-43512
Title Buffer Over-read in Qualcomm ESL
Description Transient DOS while parsing GATT service data when the total amount of memory that is required by the multiple services is greater than the actual size of the services buffer.
Technology Area Qualcomm ESL
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* QCN7606

CVE-2023-28583

CVE ID CVE-2023-28583
Title Double Free in Data Network Stack & Connectivity
Description Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address.
Technology Area Data Network Stack & Connectivity
Vulnerability Type CWE-415 Double Free
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2022/09/09
Customer Notified Date 2023/07/03
Affected Chipsets* AQT1000, FastConnect 6200, QCA6420, QCA6430, QCA6574AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD855, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, SW5100, SW5100P, WCD9341, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835

CVE-2023-33038

CVE ID CVE-2023-33038
Title Integer Overflow or Wraparound in Radio Interface Layer
Description Memory corruption while receiving a message in Bus Socket Transport Server.
Technology Area Radio Interface Layer
Vulnerability Type CWE-190 Integer Overflow or Wraparound
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/01/29
Customer Notified Date 2023/07/03
Affected Chipsets* AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8295P, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCS410, QCS610, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD 8 Gen1 5G, SD855, SD865 5G, SM4450, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9341, WCD9370, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

*The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

Open Source Software Issues

The tables below summarize security vulnerabilities that were addressed through open source software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-33085 High High Wearables Internal
CVE-2023-33094 High High Graphics 08/16/2023
CVE-2023-33108 High High Graphics 08/16/2023
CVE-2023-33110 High High Audio 03/27/2023
CVE-2023-33113 High High Kernel Internal
CVE-2023-33114 High High NPU 06/05/2023
CVE-2023-33117 High High Audio 06/09/2023
CVE-2023-33118 High High Automotive Audio 06/10/2023
CVE-2023-33120 High High Audio 06/10/2023
CVE-2023-43514 High High DSP Service Internal

CVE-2023-33085

CVE ID CVE-2023-33085
Title Buffer Copy Without Checking Size of Input (Classic Buffer Overflow) in Wearables
Description Memory corruption in wearables while processing data from AON.
Technology Area Wearables
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCM4325, QCM6490, QCN6024, QCN9011, QCN9012, QCN9024, QCS410, QCS610, QCS6490, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD888, SDX55, SG8275P, SM7315, SM7325P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X65 5G Modem-RF System, SW5100, SW5100P, WCD9335, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/8b22a153a6396e22614aeddde0d2176be14b93d8
  • https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/330e477773663acc022668ab82f9c50a3157559c
  • https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/ce4331ec45a34c12af33f006176ce782e3674230

CVE-2023-33094

CVE ID CVE-2023-33094
Title Use After Free in Linux Graphics
Description Memory corruption while running VK synchronization with KASAN enabled.
Technology Area Graphics
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/08/16
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCM4325, QCM6490, QCM8550, QCN6024, QCN9011, QCN9012, QCN9024, QCS410, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QRB5165M, QRB5165N, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD660, SD865 5G, SD888, SG4150P, SG8275P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, SXR2130, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3615, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/0ffa1d8a647f8abc7d9af3653ac68e45a52d327b
  • https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/graphics-kernel/-/commit/9b8d4a05a2785008eabc9638b045e8c1e77a4168

CVE-2023-33108

CVE ID CVE-2023-33108
Title Use After Free in Graphics
Description Memory corruption in Graphics Driver when destroying a context with KGSL_GPU_AUX_COMMAND_TIMELINE objects queued.
Technology Area Graphics
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/08/16
Customer Notified Date 2023/10/02
Affected Chipsets* QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCS7230, QCS8250, Qualcomm® Video Collaboration VC5 Platform, SA6155P, SA8155P, SA8195P, SA8255P, SA8295P, Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, WSA8830, WSA8835
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/graphics-kernel/-/commit/68341b499048b6ca391fa87f8ed7b6f6e479a67f

CVE-2023-33110

CVE ID CVE-2023-33110
Title Use of Out-of-range Pointer Offset in Audio
Description The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
Technology Area Audio
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/03/27
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, 9206 LTE Modem, APQ8017, APQ8064AU, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, MDM9230, MDM9250, MDM9330, MDM9628, MDM9630, MDM9640, MDM9650, MSM8108, MSM8209, MSM8608, MSM8909W, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCC710, QCM2290, QCM4290, QCM4325, QCM6125, QCM6490, QCM8550, QCN6224, QCN6274, QCN9011, QCN9012, QCN9074, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SD 675, SD626, SD660, SD670, SD675, SD730, SD835, SD855, SD865 5G, SD888, SDM429W, SDX20M, SDX55, SG4150P, SG8275P, SM4125, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 2100 Platform, Snapdragon Wear 2500 Platform, Snapdragon Wear 3100 Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SW5100, SW5100P, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 400 Platform, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3610, WCN3615, WCN3620, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/45ca564803f7e2324f071852aaaec6edc03b7978
  • https://git.codelinaro.org/clo/la/kernel/msm-4.4/-/commit/fd59b4b0abb1efb064f705fb47723a9262be9a0f

CVE-2023-33113

CVE ID CVE-2023-33113
Title Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in Kernel
Description Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
Technology Area Kernel
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, MDM9650, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6391, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCM4325, QCM4490, QCM6490, QCM8550, QCN6024, QCN9011, QCN9012, QCN9024, QCS410, QCS4490, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD 8 Gen1 5G, SD888, SG8275P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X65 5G Modem-RF System, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2230P, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/602e97e56c6efffa019de189ce22b82309eb4c60
  • https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/84d3d13cffe2c478b6cefc63ea0006e2d29b137b

CVE-2023-33114

CVE ID CVE-2023-33114
Title Use after free in Neural Processing Unit
Description Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.
Technology Area NPU
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/06/05
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, Flight RB5 5G Platform, QAM8295P, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA8337, QCM6125, QCN9011, QCN9012, QCS410, QCS610, QCS6125, QCS6490, QCS8250, QRB5165M, QRB5165N, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD660, SD730, SD855, SD865 5G, SDX55, SM4125, SM6250, SM7250P, Smart Audio 400 Platform, Snapdragon 460 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, SXR2130, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WSA8810, WSA8815, WSA8830, WSA8835
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-4.19/-/commit/3192894ef6ca240155b6a394ca9956df04a51ed0
  • https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/576151177468a598b23859b5758d70e49d4be41f

CVE-2023-33117

CVE ID CVE-2023-33117
Title Use After Free in Audio
Description Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
Technology Area Audio
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/06/09
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCC710, QCM2290, QCM4290, QCM4325, QCM6490, QCM8550, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS410, QCS4290, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD660, SD865 5G, SD888, SG4150P, SG8275P, SM4125, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, SXR2130, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3615, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/2c7bc667e98ae3dfeac7deaf5463eb6dc7e5ef3c

CVE-2023-33118

CVE ID CVE-2023-33118
Title Use After Free in Automotive Audio
Description Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
Technology Area Automotive Audio
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/06/10
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCC710, QCM2290, QCM4290, QCM4325, QCM6490, QCM8550, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS410, QCS4290, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD660, SD865 5G, SD888, SG4150P, SG8275P, SM4125, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3615, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/bfd0e51c3c9b22c7f971d127dfd79158366c8f16
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/123330977821079a5259b3cd65be46cd05a7afb1

CVE-2023-33120

CVE ID CVE-2023-33120
Title Use After Free in Audio
Description Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Technology Area Audio
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/06/10
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, 9206 LTE Modem, APQ8017, APQ8064AU, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, MDM9230, MDM9250, MDM9330, MDM9628, MDM9630, MDM9640, MDM9650, MSM8108, MSM8209, MSM8608, MSM8909W, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCC710, QCM2290, QCM4290, QCM4325, QCM6125, QCM6490, QCM8550, QCN6224, QCN6274, QCN9011, QCN9012, QCN9074, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165M, QRB5165N, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SD 675, SD626, SD660, SD670, SD675, SD730, SD835, SD855, SD865 5G, SD888, SDM429W, SDX20M, SDX55, SG4150P, SG8275P, SM4125, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 200 Platform, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 1200 Wearable Platform, Snapdragon 208 Processor, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 2100 Platform, Snapdragon Wear 2500 Platform, Snapdragon Wear 3100 Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X20 LTE Modem, Snapdragon X24 LTE Modem, Snapdragon X5 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SW5100, SW5100P, SXR1120, SXR2130, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 400 Platform, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3610, WCN3615, WCN3620, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/6b8f3568740661978d7d60567ff5e27b5fb7d28d
  • https://git.codelinaro.org/clo/la/platform/vendor/opensource/audio-kernel/-/commit/cbc7de440c37338738d182c82548d3c6ea001dc1
  • https://git.codelinaro.org/clo/la/kernel/msm-4.4/-/commit/ca9d5a4f888f77ed54bd821f0ebbb5b2215c319b

CVE-2023-43514

CVE ID CVE-2023-43514
Title Use After Free in DSP Services
Description Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP.
Technology Area DSP Service
Vulnerability Type CWE-416 Use After Free
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM4325, QCM6490, QCM8550, QCN6224, QCN6274, QCS6490, QCS7230, QCS8250, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QRB5165N, QRU1032, QRU1052, QRU1062, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA6155P, SA8155P, SA8195P, SA8255P, SA8295P, SG4150P, SG8275P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 695 5G Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X75 5G Modem-RF System, SW5100, SW5100P, WCD9340, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/b1f71f187b5fee55fba5ca529facc3ac13d9f4af

* The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

** Data is generated only at the time of bulletin creation

Industry Coordination

Security ratings of issues included in Android security bulletins and these bulletins match in the most common scenarios but may differ in some cases due to one of the following reasons:

  • Consideration of security protections such as SELinux not enforced on some platforms
  • Differences in assessment of some specific scenarios that involves local denial of service or privilege escalation vulnerabilities in the high level OS kernel

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

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© 2022 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.

  • Table of Contents
  • Announcements
  • Acknowledgements
  • Proprietary Software Issues
  • CVE-2023-33025
  • CVE-2023-33036
  • CVE-2023-33014
  • CVE-2023-33030
  • CVE-2023-33032
  • CVE-2023-33033
  • CVE-2023-33037
  • CVE-2023-33040
  • CVE-2023-33062
  • CVE-2023-33109
  • CVE-2023-33112
  • CVE-2023-33116
  • CVE-2023-43511
  • CVE-2023-43512
  • CVE-2023-28583
  • CVE-2023-33038
  • Open Source Software Issues
  • CVE-2023-33085
  • CVE-2023-33094
  • CVE-2023-33108
  • CVE-2023-33110
  • CVE-2023-33113
  • CVE-2023-33114
  • CVE-2023-33117
  • CVE-2023-33118
  • CVE-2023-33120
  • CVE-2023-43514
  • Industry Coordination
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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