Partner Network

Audio and Hearables Track

Extending and innovating with our voice and music Bluetooth® audio SoCs.

The Qualcomm Partner Network Audio and Hearables Track unites partners who enhance Snapdragon Sound™ platforms with cutting-edge features, enabling new use cases for OEMs across our ecosystem - including advanced capabilities through the Qualcomm® Voice and Music Extension initiative.

Advancing technology partners

The Qualcomm Partner Network Audio and Hearables Track brings together innovative solution providers who extend the advanced features of Snapdragon® audio platforms and accelerate innovation for wireless audio devices including earbuds, headphones, speakers, and next generation hearables.

Design Centers

Accelerate your proof of concept to commercialization with expert design services including specialties in integrating Qualcomm® technologies into customer products.

Software Providers

Unlock compelling use cases through companies engaged in the Qualcomm Voice and Music Extension initiative to deliver advanced capabilities through software solutions (e.g. algorithms or applications).

Distributors

Explore the global network of companies authorized to distribute Qualcomm technologies.

Manufacturer Representative

Connect with independent professionals who sell Qualcomm technologies to customers.

Why partner with Qualcomm

By becoming a Qualcomm Partner Network Audio and Hearables Track member, your software features can be integrated on Snapdragon Sound as turnkey solutions, while you gain tools, training, and co-marketing to accelerate innovation and expand your global reach.

Support, training, and enablement

Access to Qualcomm Technologies’ technical support team and training material for self-service education including documentation, tools, ADK source code, and development kits.

Partner promotion

Showcase your solutions on Qualcomm.com and marketing channels -boosting visibility and connecting you with OEMs and end customers.

Marketing assets

Access to Qualcomm's Brand Portal for ready-to-use assets and co-branding options.

Featured Audio and Hearables Partner Offerings

Explore offerings from Qualcomm Technologies partners that enable scalable, power-efficient, intelligent and differentiated hearable deployments across key verticals.

Development Hardware
Software
Services
Open-Q IQ6 SOM
The Open-Q™ IQ6 SOM module family is powered by the Qualcomm IQ615 processor, a cost-effective solution featuring a powerful image signal processor (ISP) and Qualcomm's heterogeneous compute architecture. The Open-Q™ IQ6 SOM excels in image processing performance, power efficiency, and operation across a wide thermal junction temperature range. It is ideally suited for industrial AI applications, including industrial gateways, controllers, smart controllers, and industrial HMIs. The module complies with the SMARC 2.1 standard, allowing easy integration with SMARC baseboards in the industry. Lantronix offers TAA and NDAA compliant products with at least 10 years of longevity for the Open-Q™ IQ6 SOM with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your p

KEY FEATURES:

  • Small form factor Sysyem-On-Module
By:Lantronix Inc.
Chipset:
QCS615
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

KEY FEATURES:

  • Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
  • Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
  • 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
  • -40°C to 85°C (Ta) operating temperature
By:Innodisk Corporation
Chipset:
QCS9075
QCS6490 Vision-AI Development Kit
The QCS6490 Vision-AI Development Kit features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm® QCS6490. It includes high-performance components such as an 8-core Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Qualcomm®Hexagon™ DSP with 6th gen Qualcomm®AI Engine (13 TOPS), Qualcomm Spectra™ 570L ISP (64MP/30fps), and Adreno 633 VPU (4K30/4K60). The kit offers integrated TPM, Wi-Fi/Bluetooth modules as assembly options, and an M.2 slot for NVME storage and advanced wireless options. Its 100 mm x 79 mm carrier board is compatible with similar AI developer boards, enable a drop. It ships with a Yocto-based Linux BSP and example AI/multi-camera applications, with additional OS options, including Windows 11 IoT Enterprise, available in 2H24.

KEY FEATURES:

  • M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
  • miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
  • 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
By:Tria
Chipset:
QCS6490QCS5430
Buy Now
SECO SOM-COMe-CT6- Dragonwing-IQ-X
The SECO SOM-COMe-CT6-Dragonwing-IQ-X is a key reference platform for high-performance, AI-driven edge applications. Built on the Qualcomm® Dragonwing™ IQ-X Series and compliant with the COM Express Type 6 standard, the module is designed to support demanding workloads such as computer vision, advanced analytics, and AI inference at the edge, while ensuring long-term availability and industrial-grade reliability.

KEY FEATURES:

  • Dragonwing IQ-X Series processors
  • Hexagon NPU, up to 45 TOPS
  • Up to 64GB LPDDR5 4224MT/s memory integrated on SiP
  • Available in Industrial Temperature Range (-40C to +85°C)
By:SECO spa
Chipset:
IQX7181MDIQX5121MD

Apply to the Qualcomm Partner Network Audio and Hearables Track

The Qualcomm Partner Network Audio and Hearables Track is open to applications. Join a global ecosystem of innovators to access Qualcomm Technologies tools, training, and visibility for your Audio solutions.

Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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