Samsung Galaxy S8

Samsung Galaxy S8

Featuring a Snapdragon 835 Mobile Platform.

Featuring a thin and light design with superior battery life, exceptional photography, and immersive multimedia including mobile virtual reality (VR). The integrated Snapdragon X16 LTE modem supports Gigabit LTE, for fiber-optic Internet speeds on the go, and more consistent mobile data performance in more places. Qualcomm TruSignal adaptive antenna tuning technology for carrier aggregation is designed to deliver a consistent voice and data experience, indoors and outdoors.

 

Powered by a Snapdragon 835 Mobile Platform.

With an advanced 10-nanometer design, the Qualcomm® Snapdragon™ 835 Mobile Platform can support phenomenal mobile performance. It is 35% smaller and uses 25% less power than previous designs, and is engineered to deliver exceptionally long battery life, life-like VR and AR experiences, cutting-edge camera capabilities and Gigabit Class download speeds.

More Samsung devices

All Snapdragon powered devices

Quick Charge 2.0

Qualcomm® Quick Charge™ 2.0 can help this device charge up to 75% faster. In internal tests, Quick Charge 2.0 managed a 60% charge in just 30 minutes.

©2020 Qualcomm Technologies, Inc. and/or its affiliated companies.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell any of the components or devices referenced herein.