FastConnect C7700
FastConnect C7700
FastConnectC7700

Tailored for mainstream consumer electronics and compute applications and built with highperformance Wi-Fi 7 and advanced proximity capabilities.

The Qualcomm® FastConnect™ C7700 Connectivity System is a highly-integrated, cost-effective 14 nm 2x2 Wi-Fi and qualified against Bluetooth® Core 6.0 system with flexible interfaces such as PCIe, SDIO, and USB. It is designed to deliver ultra-high speeds (up to a peak speed of 5.8 Gbps*) with 320MHz channels and premium Bluetooth features.

FastConnect C7700 packs in core Wi-Fi 7 features including wide 320MHz channels, 4K QAM, and Multi-Link Operation (MLO) for fast speeds and low latency.

FastConnect C7700 also brings advanced prox...

* Speed claims refer to maximum physical layer (PHY) rate

Product license agreement
Featured Documents Product Brief

Benefits

default icon alt text
Designed for compute and consumer electronics
FastConnect C7700 is a highly integrated, cost-effective solution for mainstream compute and consumer electronics. It integrates PAs and LNAs as well as a variety of interface connections including PCIe, USB, and SDIO for flexible application design.
default icon alt text
Multi-gigabit performance
Bring Wi-Fi 7 into the mainstream with blazing-fast speeds up to 5.8 Gbps and advanced features such as 4K QAM and MLO. Enjoy performance at range and low latency thanks to ultra-wide 320MHz channels.
default icon alt text
Proximity capabilities
Easily find your Wi-Fi and Bluetooth-enabled devices with FastConnect C7700 proximity capabilities. By using Wi-Fi Ranging and Bluetooth Channel Sounding, users unlock seamless new ways to interact with nearby capable devices.
default icon alt text
Improved power efficiency
Architectural improvements boost power efficiency for both Wi-Fi and Bluetooth.

Features

  • Built for Wi-Fi 7 Certification
  • 6GHz, 5GHz, and 2.4GHz support
  • Up to a peak speed of 5.8 Gbps data rate using 4K QAM modulation and 320MHz channel bandwidth*
  • Premium Wi-Fi 7 experience when paired with a compatible AP
  • Bluetooth Core Specification 6.0, Bluetooth Channel Sounding, LE Audio, and LE Long Range
  • Snapdragon Sound technology

* Speed claims refer to maximum physical layer (PHY) rate

Specifications

© Qualcomm Technologies, Inc. and/or its affiliated companies.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated.

Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.