Cloud AI 100 Ultra
Cloud AI 100 Ultra
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100 UltraCloud AI

Delivers the performance and power efficiency necessary to deploy and accelerate AI inference at-scale

The Qualcomm Cloud AI 100 Ultra, the newest member of our portfolio of cloud artificial intelligence (AI) inference cards, is a performance- and cost-optimized AI inference solution, designed for Generative AI and large language models (LLMs). With up to 576 MB of on-die SRAM and 64 AI cores per card - and programmability for a wide range of workloads and acceleration techniques - Qualcomm Cloud AI 100 solutions address the unique requirements for scaling classic and generative AI workloads, ranging from computer vision and natural language processing to transformer-based LLMs.

Qualcomm Cloud AI is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Featured DocumentsCloud AI 100 Ultra Product Brief
AI Inference Suite

Qualcomm® AI Inference Suite for Cloud and On-Prem

The Qualcomm AI Inference Suite is a comprehensive set of software and services for Qualcomm Cloud AI accelerators spanning across on-premises solutions and cloud deployments.

It includes ready-to-use AI applications and agents, tools, and libraries for operationalizing generative AI at scale. For enterprises developing chatbots, co-pilots, and AI agents, the AI Inference Suite features a rich set of OpenAI-compatible APIs including user management and administration capabilities. It supports chat, image generation, multi-modal AI capabilities, and retrieval-augmented generation (RAG) functionalities.

The suite also supports integration with popular generative AI models, frameworks, cloud services, and is deployed using Kubernetes or bare-metal containers. Customers can build gen AI applications and agents using open-source or proprietary models, scale and optimize workflows, and run enterprise-grade solutions.

Cloud AI 100 Ultra

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Cloud AI 100 Ultra

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Specifications

SKU Form factor Power (TDP) Peak Integer Ops (INT8) Peak FP Ops (FP16) SRAM DRAM (w/ ECC) DRAM BW Host Interface
AI 100 Ultra PCIe FH3/4L (111.2mm x 237.9mm) 150W Up to 870 TOPS Up to 288 TFLOPS 576 MB 128 GB LPR4x 548 GB/s PCIe Gen4, 16 lanes
AI 80 Ultra PCIe FH3/4L (111.2mm x 237.9mm) 150W Up to 618 TOPS (155 TOPs/SoC) Up to 222 TFLOPS (56 TFLOPS/SoC) 576 MB 128 GB LPR4x 548 GB/s PCIe Gen4, 16 lanes
AI 100 Pro PCIe HHHL (68.9mm x 169.5mm) 75W Up to 400 TOPS Up to 200 TFLOPS 144 MB 32 GM LPR4x 137 GB/s PCIe Gen4, 8 lanes
AI 100 Standard PCIe HHHL (68.9mm x 169.5mm) 75W Up to 350 TOPS Up to 175 TFLOPS 126 MB 16 GB LPR4x 137 GB/s PCIe Gen4, 8 lanes
AI 80 Standard PCIe HHHL (68.9mm x 169.5mm) 75W Up to 190 TOPS Up to 86 TFLOPS 126 MB 16 GB LPR4x 137 GB/s PCIe Gen4, 8 lanes
Specifications
Qualcomm AI Cores
AI Number of Cores
Up to 16
Memory
AI SRAM Density
144 MB1
Data Types
Data Types
FP16, INT16, INT8, FP32
Process Node and Technology
Process Node
7 nm
Card
Raw Tera Operations Per Second (TOPS)
Dual M.2 (edge): 70 TOPS@15W TDP, PCIe: 400 TOPS@ 75W TDP, Dual M.2: 200 TOPS@ 25W TDP, PCIe: 350 TOPS @ 75W
Type
PCIe (HHHL), Dual M.2, Dual M.2 (edge)
PCIe Interface
8 lane Gen3/4 (PCIe), 4 lane Gen3/4 (Dual M.2)
DRAM Speed
2.1 GHz
DRAM Type
LPDDR4x
DRAM Density
Up to 32 GB
DRAM Bit Width
64-bit
DRAM Number of Channels
4
  1. 9 MB each AI core
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