logoimage-hub-nav
Not Recommended For New Designs
Qualcomm Dragonwing™

QCS405

Contact sales
QCS4

Designed specifically for premium smart speaker and soundbar applications with an unparalleled level of integration and next-generation Voice UI compared to our previous SoCs, enhanced with our cutting-edge Qualcomm® AI Engine.

The Qualcomm Dragonwing™ QCS405 System-on-Chip (SoC) is designed to bring a wealth of new capabilities and smart functionality to smart speakers and soundbars.

QCS405 is part of our Qualcomm® QCS400 series of dedicated audio SoCs based on our high performance, low-power architecture, with on-device dual DSP, rich connectivity, visual display capabilities, and Qualcomm® Artificial Intelligence (AI) Engine. This advanced SoC is designed to significantly reduce overall BOM for complex, feature rich, voice-supported home audio products in the premium tier.

Qualcomm QCS405 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Product license agreement
Featured DocumentsProduct Brief
Benefits
default icon alt text
Ultimate audio experiences

Truly superior audio performance, with support for Dolby Atmos and DTS:X immersive home audio, Qualcomm® DDFA™ amplifier technology, and Qualcomm® aptX™ audio.

default icon alt text
Advanced DSP

Dedicated high-performance audio DSP with hardware enhancement capable of up to 32-channels of audio post processing. Dual DSP cores and integrated Qualcomm AI Engine support high performance and low-power keyword detection.

default icon alt text
Next-generation Voice UI

SoC designed to deliver configurable multi-keyword detection with Local Automatic Speech Recognition for customizable and "offline" user experiences, and multi-mic beamforming noise suppression with mono, stereo and multichannel echo cancellation.

default icon alt text
Improved low-power performance

Supports new levels of performance for portable and battery-powered smart speakers compared to our previous SoCs, and helps reduce standby current requirements for mains-connected speakers or smart assistants.

default icon alt text
Industry-leading integration

Unique, highly-integrated yet flexible single-chip architecture designed to deliver substantial power efficiencies, performance improvements and opportunities for advanced feature innovation, as well as helping manufacturers to reduce BOM.

default icon alt text
Industry-leading connectivity

Includes industry-leading connectivity with low-latency in-room/multi-room streaming and advanced Wi-Fi, Bluetooth and Zigbee coexistence technology

Features

  • Highly-integrated architecture, with four CPU cores, dual DSP, Wi-Fi, Bluetooth, powerful audio features, and our AI Engine on a single chip
  • Our AI Engine supports highly efficient on-device inferences and machine learning-based, embedded automatic speech recognition
  • Industry-leading connectivity with low-latency streaming and advanced Wi-Fi, Bluetooth, and Zigbee coexistence technology
  • Superior audio performance with support for Dolby Atmos and DTS:X immersive home audio
  • High performance, low-power keyword detection pre-loaded and running on an integrated DSP
  • Configurable multi-keyword detection with Local Automatic Speech Recognition designed for customizable user experiences
  • Compatible with DDFA amplifier technology and aptX audio
  • Includes low power far-field keyword detection, multi-mic beamforming noise suppression with mono, stereo, and multichannel echo cancellation
  • Industry-leading far field voice capture technology, with simultaneous multi key word detection
  • Support for up to 12 channel audio output to help meet the evolving needs of AVR space
  • Help to reduce product development time and cost, with our Audio Development Kit (ADK), and Software Evaluation Kit, as well as hardware reference designs
Specifications
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name
Qualcomm® Adreno™ 306
CPU Number of Cores
4
Qualcomm® Hexagon™ Processor Name
2x Qualcomm® Hexagon™
LR-WPAN
Protocol
Zigbee
CPU
Clock Speed
Up to 1.4 GHz
DSP
Name
2x Qualcomm® Hexagon™
Compute
V66 800 MHz with low power island, V66 700 MHz with Qualcomm® AI Engine
GPU
Name
Qualcomm® Adreno™ 306

Qualcomm Smart Audio Platform, Qualcomm AI Engine, Qualcomm Hexagon, Qualcomm Adreno, Qualcomm QCS400, Qualcomm DDFA and Qualcomm aptX are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Compare related products.

Note: to leverage the best experience for the product comparison table, please use the desktop to view content.

4 of 0 total products

Product

Other

QCS404
QCS405
Active
QCS403
QCS407
    Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

    Stay connected

    Get the latest Qualcomm and industry information delivered to your inbox.

    Subscribe
    Manage your subscription
    Also of Interest

    © Qualcomm Technologies, Inc. and/or its affiliated companies.

    Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated.

    Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

    References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

    Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

    Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

    Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.