Snapdragon System-in-Package
Custom-built, integrated solution that enables design flexibility and robust features with low power consumption.
Custom-built, integrated solution that enables design flexibility and robust features with low power consumption.
Qualcomm® Snapdragon™ System-in-Package is a custom-built, integrated module that supports design flexibility and robust smartphone features with low power consumption.
Smartphone ....
Qualcomm® Snapdragon™ System-in-Package is a custom-built, integrated module that supports design flexibility and robust smartphone features with low power consumption.
Smartphone ....
Qualcomm® Snapdragon™ System-in-Package is a custom-built, integrated module that supports design flexibility and robust smartphone features with low power consumption.
Smartphone manufacturers gain more design flexibility, enabling them to choose to extend efficiencies to device design and/or build in more features and attributes. Advanced technologies acro....
Qualcomm® Snapdragon™ System-in-Package is a custom-built, integrated module that supports design flexibility and robust smartphone features with low power consumption.
Smartphone manufacturers gain more design flexibility, enabling them to choose to extend efficiencies to device design and/or build in more features and attributes. Advanced technologies across camera, multimedia, power management, and performance allow Snapdragon System-in-Package powered devices to provide excellent coverage and improved connectivity.
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.
All-in-one package
Qualcomm Technologies combines multiple high-end software and hardware components into one robust, feature-rich, integrated semiconductor. With this unified approach, devices containing a Snapdragon System-in-Package may be developed in less time and at lower cost.
Integrated module for design flexibility
Incorporating advanced Snapdragon technologies into a single module maximizes space and minimizes board size. Manufacturers can choose, depending on need, whether they will produce a thinner device or build in more features like additional cameras or bigger batteries.
Connections that go the distance
In the heart of the city or on the outskirts, Snapdragon System-in-Package powered devices will provide excellent coverage. The Snapdragon X9 LTE modem is designed to support global networks and bands for reliable connectivity and super-fast speeds, allowing users to quickly share high-res photos and videos.
Powering advanced mobile experiences
This integrated semiconductor balances cutting-edge performance with ultra-low power usage. The system is designed to handle advanced on-device interactions without draining the battery, so users can accomplish more on a single charge.
Maximizing every on-device moment
Bring forth the gamut of entertainment experiences. Turn your device into a multimedia machine with support for brilliant displays, hi-fi audio and action-packed mobile gaming. In the photography department, multi-camera support provides access to an expansive set of advanced features.
Snapdragon System-in-Package Block Diagram
You deserve to be a Snapdragon Insider.
Snapdragon Insiders will get behind-the-scenes access, premium experiences and extra perks that only the Snapdragon Insiders program can deliver. Join our community to get the inside track and help us shape the future of Snapdragon.
Features
World’s first Snapdragon System-in-Package custom designed for smartphones and IoT devices
Integrated semiconductor featuring Snapdragon technology enabling design efficiencies, reduced development costs and accelerated time to commercialization
Advanced technology across camera, connectivity, multimedia, power and performance for amazing smartphone experiences
Snapdragon X9 LTE modem includes access to 4G, 3G and 2G frequency bands
Qualcomm® Adreno™ 506 PC-class graphics with support for advanced APIs and Hardware Tessellation
Snapdragon sensor core is designed to support new always-on use cases at reduced power levels and cost
Specifications
Cellular Modem
Modem Name: Qualcomm® Snapdragon™ X9 LTE modem
Peak Download Speed: 300 Mbps
Peak Upload Speed: 150 Mbps
Uplink Technology: Qualcomm® Snapdragon™ Upload+
Downlink Carrier Aggregation: 2x20 MHz carrier aggregation
Uplink Carrier Aggregation: 2x20 MHz carrier aggregation
Downlink LTE Category: LTE Category 7
Uplink LTE Category: LTE Category 13
Multi SIM: LTE Dual SIM
Downlink QAM: Up to 64-QAM
Uplink QAM: Up to 64-QAM
Calling Services: VoLTE with SRVCC to 3G and 2G, Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD and Ultra HD Voice (EVS)
Cellular Technology: Qualcomm® Snapdragon™ All Mode, LTE TDD, LTE FDD, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
Wi-Fi
Wi-Fi Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4GHz, 5GHz
Peak Speed: 433 Mbps
Channel Utilization: 20/40/80 MHz
MIMO Configuration: 1x1 (1-stream)
Peak QAM: 256 QAM
Wi-Fi Features: MU-MIMO, Integrated baseband
Bluetooth
Bluetooth Version: Bluetooth 4.2
Bluetooth Technology: Bluetooth Low Energy
NFC
Near Field Communications: Supported
Location
Satellite Systems Support: Beidou, Galileo, GLONASS, GPS
Location Support: Qualcomm® Location
Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)
Advanced Location Features: Sensor-assisted Navigation, Low Power Geofencing and Tracking, Pedestrian Navigation
RF
RFFE: Qualcomm® RF Front-End (RFFE) solution
USB
USB Version: USB 3.0
CPU
CPU Clock Speed: 1.8 GHz
CPU Cores: 8x ARM Cortex A53, Octa-core CPU
CPU Architecture: 64-bit
Process
Process Technology: 14 nm LPP
DSP
DSP Technology: Qualcomm® Hexagon™ 546 DSP
Camera
Image Signal Processor: 2x Image Signal Processor (ISP)
Camera Features: Qualcomm® Clear Sight™ camera features, Real time Bokeh during camera preview
Slow Motion Video Capture: 1080p @ 60 FPS
Dual Camera, ZSL, 30fps: Up to 13 MP
Single Camera, ZSL, 30fps: Up to 21 MP
Single Camera, 24fps: Up to 24 MP
Video
Video Playback: Up to 1080p video playback @ 60 fps
Codec Support: H.265 (HEVC), H.264 (AVC)
Display
Max On-Device Display: FHD+, WUXGA
UI FPS: Up to 60 FPS
General Audio
Audio Technology: Qualcomm Aqstic™ audio technology
GPU
GPU Name: Qualcomm® Adreno™ 506 GPU
API Support: OpenGL ES 3.1, OpenCL™ 2.0 full
Charging
Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 3.0 technology
Security Support
Security Features: Eye based authentication, Qualcomm® Mobile Security
Memory
Memory speed: 933MHz
Memory Type: LPDDR3
Storage
eMMC: eMMC 5.1
SD: SD 3.0 (SDCC)
- Meets operator CA requirements: Claro, TIM and Vivo in Brazil
Qualcomm Snapdragon, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Location, Qualcomm RF Front End solution, Qualcomm Clear Sight Camera, Qualcomm Aqstic, Qualcomm Snapdragon All Mode, Qualcomm Snapdragon Upload+, Qualcomm Quick Charge, and Qualcomm Mobile Security are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.