Designed with both 32-bit and 64-bit CPU support, the Qualcomm® Snapdragon™ 410 processor supports both multi-SIM multimode 4G LTE for worldwide smartphones and versatile power efficiency for embedded applications.
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Featured Documents
Product Brief
LTE Category
Downlink LTE Category: LTE Category 4
LTE Downlink Features
Downlink Carrier Aggregation: 1x20 MHz downlink
Downlink QAM: Up to 64-QAM
LTE Uplink Features
Uplink Carrier Aggregation: 1x20 MHz
Uplink QAM: Up to 16-QAM
LTE Speed
LTE Peak Download Speed: 150 Mbps
LTE Peak Upload Speed: 50 Mbps
Cellular Technology
LTE Technology: LTE FDD, LTE TDD, LTE Broadcast
Cellular Technology: WCDMA (DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
Cellular Modem
Multi SIM: LTE Dual SIM
Next-generation Calling Services: Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD Voice over 3G and VoLTE
Wi-Fi
Wi-Fi Standards: 802.11n
Bluetooth
Bluetooth Version: Bluetooth 4.1
Location
Advanced Location Features: Low Power Geofencing and Tracking
Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)
Location Support: Qualcomm® Location
Satellite Systems Support: GPS, GLONASS, Beidou
RF
RFFE: Qualcomm® RF Front-End (RFFE) solution
USB
USB Version: USB 2.0
Camera
Single Camera: Up to 13.5 MP
Video Capture (30 FPS): 1080p video capture
Video
Video Playback: Up to 1080p video playback
Codec Support: H.265 (HEVC), H.264 (AVC)
Display
Max On-Device Display: FHD+, WUXGA
Display Pixels: 1920x1200
Max External Display: Up to 720p
CPU
CPU Clock Speed: Up to 1.2 GHz
CPU Cores: Quad-core CPU, 4x ARM Cortex A53
CPU Architecture: 64-bit
Process
Process Technology: 28 nm LP
DSP
DSP Technology: Qualcomm® Hexagon™ DSP
GPU
GPU Name: Qualcomm® Adreno™ 306 GPU
Charging
Qualcomm® Quick Charge™ Support: Qualcomm® Quick Charge™ 2.0 technology
Memory
Memory speed: 533MHz
Memory Type: LPDDR2, LPDDR3, non-POP
Storage
eMMC: eMMC 4.51
SD: SD 3.0 (UHS-I)
Part
Part Numbers: 8916