Snapdragon 410 Processor

Designed with both 32-bit and 64-bit CPU support, the Qualcomm® Snapdragon™ 410 processor supports both multi-SIM multimode 4G LTE for worldwide smartphones and versatile power eff....

Designed with both 32-bit and 64-bit CPU support, the Qualcomm® Snapdragon™ 410 processor supports both multi-SIM multimode 4G LTE for worldwide smartphones and versatile power efficiency for embedded applications.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Specifications

CPU

CPU Clock Speed: Up to 1.2 GHz

CPU Cores: 4x ARM Cortex A53, Quad-core CPU

CPU Architecture: 64-bit

DSP

DSP Technology: Qualcomm® Hexagon™ DSP

Cellular Modem-RF

Peak Download Speed: 150 Mbps

Peak Upload Speed: 50 Mbps

Cellular Modem-RF Specs: 1x20 MHz (UL), LTE Category 4 (DL), 1x20 MHz downlink (DL)

Performance Enhancement Technologies: Qualcomm® RF Front-End (RFFE) solution

Cellular Technology: LTE Broadcast, LTE TDD, LTE FDD, WCDMA (DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

Calling Services: Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD Voice over 3G and VoLTE

Multi SIM: LTE Dual SIM

Wi-Fi

Standards: 802.11n

Bluetooth

Bluetooth Specification Version: Bluetooth 4.1

Location

Satellite Systems Support: Beidou, GLONASS, GPS

Location Support: Qualcomm® Location

Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)

Advanced Location Features: Low Power Geofencing and Tracking

USB

USB Version: USB 2.0

Camera

Single Camera: Up to 13.5 MP

Video Capture (30 FPS): 1080p video capture

Video Playback

Codec Support: H.264 (AVC), H.265 (HEVC)

Video Playback: Up to 1080p video playback

Display

Max On-Device Display: FHD+, WUXGA

Max External Display: Up to 720p

Display Pixels: 1920x1200

GPU

GPU Name: Qualcomm® Adreno™ 306 GPU

Charging

Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 2.0 technology

Memory

Memory Speed: 533MHz

Memory Type: LPDDR2, LPDDR3, non-POP

Storage

eMMC: eMMC 4.51

SD: SD 3.0 (UHS-I)

Process

Process Node and Technology: 28 nm LP

Part

Part Number(s): 8916

Digital integrated in SoC, Analog added via additional chip
Digital integrated in SoC, Analog added via additional chip

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Snapdragon 410 Processor

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Specifications