snapdragon

Snapdragon X20 LTE Modem

Introducing maximum modem speed. Meet the world’s first-announced modem to support Cat 18 LTE, the Qualcomm® Snapdragon™ X20 LTE modem. With the fastest LTE download speeds yet, ou....

more

Introducing maximum modem speed. Meet the world’s first-announced modem to support Cat 18 LTE, the Qualcomm® Snapdragon™ X20 LTE modem. With the fastest LTE download speeds yet, ou....

more

Introducing maximum modem speed. Meet the world’s first-announced modem to support Cat 18 LTE, the Qualcomm® Snapdragon™ X20 LTE modem. With the fastest LTE download speeds yet, our second generation Gigabit LTE modem, built in a leading-edge 10nm FinFET process, is yet another step on the path to 5G—helping more operators around the world bring fiber optic ....

more

Introducing maximum modem speed. Meet the world’s first-announced modem to support Cat 18 LTE, the Qualcomm® Snapdragon™ X20 LTE modem. With the fastest LTE download speeds yet, our second generation Gigabit LTE modem, built in a leading-edge 10nm FinFET process, is yet another step on the path to 5G—helping more operators around the world bring fiber optic speeds wirelessly to your device for the latest generation of mobile experiences.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

Breaking the Gigabit barrier.

By supporting speeds up to 1.2 Gbps, the Snapdragon X20 LTE modem is up to 20% faster than the previous generation, and also provides support for Cat 13 upload speeds up to 150 Mbps. With this kind of speed, the Snapdragon X20 LTE modem can bring new experiences to your mobile device at lightning speed—so you can experience immersive 360-degree video, connected cloud computing, rich entertainment and instant apps at the speed you need.

Going global with Gigabit.

The Snapdragon X20 LTE modem is designed to provide vastly expanded spectrum flexibility compared to the previous generation. With support for up to 5x carrier aggregation, up to 4x4 MIMO on three aggregated carriers and up to 12 LTE spatial streams, it can help many more operators around the world deploy Gigabit LTE service. Additionally, with support for License Assisted Access (LAA), Snapdragon X20 helps allow operators with as little as 10MHz of licensed spectrum tap into unlicensed spectrum to deploy Gigabit LTE, relieving congestion in crowded areas. So, even at the busiest times, you can get the service you need, when you need it, on your device.

Convenience and clarity.

Snapdragon X20 is the first LTE modem to support Dual SIM Dual VoLTE (DSDV)—engineered to bring you the clarity of HD and Ultra HD Voice with the convenience and flexibility of dual SIM. No longer should having a dual SIM phone mean sacrificing call quality on the second SIM. And of course, you can select to use the blazing fast Category 18 LTE data speeds on either SIM.

New spectrum. New opportunities.

Snapdragon X20 supports the new Citizens Broadband Radio Service (CBRS) band in the United States. CBRS provides a unique new way of sharing spectrum that can allow operators to tap into a vast spectrum resource to improve their service, or allow new entrants to setup private LTE networks.

You deserve to be a Snapdragon Insider.

Snapdragon Insiders will get behind-the-scenes access, premium experiences and extra perks that only the Snapdragon Insiders program can deliver. Join our community to get the inside track and help us shape the future of Snapdragon.

Specifications

Cellular Modem

Chipset: Qualcomm® Snapdragon™ X20 LTE Modem, Snapdragon 8cx Compute Platform, Snapdragon 855 Mobile Platform

Peak Download Speed: 1.2 Gbps

Peak Upload Speed: 150 Mbps

Uplink Technology: Qualcomm® Snapdragon™ Upload+, Uplink Data Compression (UDC)

Downlink Carrier Aggregation: 5x20 MHz carrier aggregation

Uplink Carrier Aggregation: 2x20 MHz carrier aggregation

Downlink LTE Category: LTE Category 18

Uplink LTE Category: LTE Category 13

Downlink LTE MIMO: Up to 4x4 MIMO on three carriers

Multi SIM: Dual SIM Dual VoLTE (DSDV)

Uplink LTE Streams: Up to 2x 75Mbps LTE streams

Downlink LTE Streams: Maximum 12 spatial streams

Downlink QAM: Up to 256-QAM

Uplink QAM: Up to 64-QAM

Calling Services: VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G

Cellular Technology: LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

    Compare related products.

    ChipsetPeak Download SpeedPeak Upload SpeedUplink TechnologyDownlink Carrier AggregationUplink Carrier AggregationDownlink LTE CategoryUplink LTE CategoryDownlink LTE MIMOMulti SIMUplink LTE StreamsDownlink LTE StreamsDownlink QAMCalling Services
    Qualcomm® Snapdragon™ X20 LTE Modem
    Snapdragon 8cx Compute Platform
    Snapdragon 855 Mobile Platform
    1.2 Gbps
    150 Mbps
    Qualcomm® Snapdragon™ Upload+
    Uplink Data Compression (UDC)
    5x20 MHz carrier aggregation
    2x20 MHz carrier aggregation
    LTE Category 18
    LTE Category 13
    Up to 4x4 MIMO on three carriers
    Dual SIM Dual VoLTE (DSDV)
    Up to 2x 75Mbps LTE streams
    Maximum 12 spatial streams
    Up to 256-QAM
    VoLTE with SRVCC to 3G and 2G
    HD and Ultra HD Voice (EVS)
    CSFB to 3G and 2G
    Snapdragon X24 LTE Modem
    Snapdragon 8cx Compute Platform
    Snapdragon 855 Mobile Platform
    2 Gbps
    316 Mbps
    Qualcomm® Snapdragon™ Upload+
    Uplink Data Compression (UDC)
    7x20 MHz carrier aggregation
    3x20 MHz carrier aggregation
    LTE Category 20
    LTE Category 13
    Up to 4x4 MIMO on five carriers
    Full-Dimension MIMO (FD-MIMO)
    LTE Dual SIM Dual Standby (DSDS)+LAA
    Dual SIM Dual VoLTE (DSDV)
    Up to 2x 106Mbps LTE streams
    Maximum 20 spatial streams
    Up to 256-QAM
    VoLTE with SRVCC to 3G and 2G
    HD and Ultra HD Voice (EVS)
    CSFB to 3G and 2G
    Snapdragon X16 LTE Modem
    Snapdragon 835 Mobile Platform
    Snapdragon 835 Mobile Compute Platform
    1 Gbps
    150 Mbps
    Qualcomm® Snapdragon™ Upload+
    Uplink Data Compression (UDC)
    4x20 MHz carrier aggregation
    2x20 MHz carrier aggregation
    LTE Category 16
    LTE Category 13
    Up to 4x4 MIMO on two carriers
    LTE + W/G/1x Dual SIM Dual Standby (DSDS)
    Up to 2x 75Mbps LTE streams
    Maximum 10 spatial streams
    Up to 256-QAM
    VoLTE with SRVCC to 3G and 2G
    HD and Ultra HD Voice (EVS)
    CSFB to 3G and 2G
    Qualcomm® Snapdragon™ X12 LTE Modem
    Snapdragon 821 Mobile Platform
    Snapdragon 820 Mobile Platform
    Snapdragon 675 Mobile Platform
    Snapdragon 670 Mobile Platform
    Snapdragon 665 Mobile Platform
    Snapdragon 660 Mobile Platform
    Snapdragon 636 Mobile Platform
    Snapdragon 630 Mobile Platform
    600 Mbps
    150 Mbps
    Qualcomm® Snapdragon™ Upload+
    Uplink Data Compression (UDC)
    3x20 MHz carrier aggregation
    2x20 MHz carrier aggregation
    LTE Category 12
    LTE Category 13
    Up to 4x4 MIMO on one carrier 1
    LTE Dual SIM Dual Standby (DSDS)
    Up to 2x 75Mbps LTE streams
    Up to 256-QAM
    VoLTE with SRVCC to 3G and 2G
    Voice over Wi-Fi (VoWiFi) with LTE call continuity
    Native HD video calling
    HD Voice over 3G and VoLTE
    CSFB to 3G and 2G
    1. Not supported in Snapdragon 660/630

    ©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.

    References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

    Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

    Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

    Nothing in these materials is an offer to sell any of the components or devices referenced herein.