Snapdragon Automotive 5G Platform
3GPP Release 15-compliant 5G multimode modem supporting 5G, LTE, 3G, 2G connectivity, concurrent with C-V2X, DSDA, NG-ecall and location services
3GPP Release 15-compliant 5G multimode modem supporting 5G, LTE, 3G, 2G connectivity, concurrent with C-V2X, DSDA, NG-ecall and location services
Qualcomm Snapdragon Automotive 5G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries
5G for Automotive
Ultra-high speeds and ultra-low latency to facilitate better security, availability, and quality-of-service for mission critical services.
Dual Sim Dual Active (DSDA) benefits
Via DSDA technology, car and driver can each choose their own independent network operator subscription in order support a variety of emerging mobility service models.
C-V2X concurrency
Concurrent C-V2X operation with 5G, 4G, 3G, and 2G helps to provide security among vehicles and road-side infrastructure.
Comprehensive RF Front End portfolio
Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.
Features
5G technology provides multi-gigabit throughput for 4K/8K/HDR video steaming and 3D nav
Latency below 1ms to allow cooperative collision avoidance and synchronized driving
Improved quality-of-service, security, and availability for mission critical services
Qualcomm RFFE Solution from digital to antenna
- Optimal system performance
- RF module software integration with transceiver
Includes RF Modules targeted for Automotive:
- Extended temperature range (-40 to +85C)
- System level integration in telematics platform
Next Generation eCall (NG-ecall) over LTE network
Specifications
5G
5G Technology: 5G NR
5G Spectrum: sub-6 GHz, 5G/4G spectrum sharing
5G Modes: FDD, TDD, SA (standalone), NSA (non-standalone)
5G sub-6 GHz specs: 200 MHz bandwidth, 4x4 MIMO
CPU
CPU Cores: ARM Cortex A7
Process
Process Technology: 7 nm
Cellular Modem
Multi SIM: LTE Dual SIM Dual Active (DSDA)
LTE Downlink Features
Downlink Carrier Aggregation: 3x20 MHz carrier aggregation
Downlink LTE MIMO: 4x4 MIMO
PC5 Sidelink
Sidelink Features: PC5 Support, 23dBm, 20Mhz Channel BW
C-V2X Direct Communications: V2V, V2P, V2I, 3GPP R-14 Spec
Cellular Technology
Cellular Technology: WCDMA (DC-HSDPA, HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
LTE Technology: LTE FDD, LTE TDD including CBRS support, LAA
Location
Satellite Systems Support: Beidou, GPS, Galileo, GLONASS
RF
RFFE: 5G envelope tracking, 5G adaptive antenna tuning
USB
USB Version: USB 3.0, USB 2.0
Interface
Supported Interfaces: I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0, USB 3.0
Navigation Software
Dead Reckoning: Qualcomm® Dead Reckoning 3.0
Qualcomm VEPP, Qualcomm RFFE and Qualcomm Dead Reckoning are products of Qualcomm Technologies, Inc. and/or its subsidiaries.