snapdragon

Snapdragon Automotive 5G Platform

3GPP Release 15-compliant 5G multimode modem supporting 5G, LTE, 3G, 2G connectivity, concurrent with C-V2X, DSDA, NG-ecall and location services

The Qualcomm® Snapdragon™ Automotive 5G Platform is our first automotive-grade 5G platform. It is 3GPP Release 15-compliant, engineered to support FDD and TDD networks, as well as standalone (SA) and non-standalone (NSA) modes of operation.

The Snapdragon Automotive 5G platform is optimized to support concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.

The Snapdragon Automotive 5G Platform also supports Qualcomm® Dead Reckoning 3 technology and Qualcomm® Vision Enhanced Precise Positioning technology (VEPP), optimized to provide highly accurate location positioning with a comprehensive virtually anytime/anywhere 3D navigation solution.

The Snapdragon Automotive 5G Platform features integrated C-V2X direct communications to provide superior support for rich in-vehicle experiences; precise positioning for lane level navigation accuracy; multi-gigabit cloud connectivity, vehicle-to-vehicle (V2V) and vehicle-to-roadside infrastructure (V2I) communications for safety; and high bandwidth low latency teleoperations support.

Qualcomm Snapdragon Automotive 5G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries

5G for Automotive

Ultra-high speeds and ultra-low latency to facilitate better security, availability, and quality-of-service for mission critical services.

Dual Sim Dual Active (DSDA) benefits

Via DSDA technology, car and driver can each choose their own independent network operator subscription in order support a variety of emerging mobility service models.

C-V2X concurrency

Concurrent C-V2X operation with 5G, 4G, 3G, and 2G helps to provide security among vehicles and road-side infrastructure.

Comprehensive RF Front End portfolio

Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.

Features

  • 5G technology provides multi-gigabit throughput for 4K/8K/HDR video steaming and 3D nav

  • Latency below 1ms to allow cooperative collision avoidance and synchronized driving

  • Improved quality-of-service, security, and availability for mission critical services

  • Qualcomm RFFE Solution from digital to antenna

    • Optimal system performance
    • RF module software integration with transceiver
  • Includes RF Modules targeted for Automotive:

    • Extended temperature range (-40 to +85C)
    • System level integration in telematics platform
  • Next Generation eCall (NG-ecall) over LTE network

Specifications

5G

5G Technology: 5G NR

5G Spectrum: sub-6 GHz, 5G/4G spectrum sharing

5G Modes: FDD, TDD, SA (standalone), NSA (non-standalone)

5G sub-6 GHz specs: 200 MHz bandwidth, 4x4 MIMO

CPU

CPU Cores: ARM Cortex A7

Process

Process Technology: 7 nm

Cellular Modem

Multi SIM: LTE Dual SIM Dual Active (DSDA)

LTE Downlink Features

Downlink Carrier Aggregation: 3x20 MHz carrier aggregation

Downlink LTE MIMO: 4x4 MIMO

PC5 Sidelink

Sidelink Features: PC5 Support, 23dBm, 20Mhz Channel BW

C-V2X Direct Communications: V2V, V2P, V2I, 3GPP R-14 Spec

Cellular Technology

Cellular Technology: WCDMA (DC-HSDPA, HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

LTE Technology: LTE FDD, LTE TDD including CBRS support, LAA

Location

Satellite Systems Support: Beidou, Galileo, GLONASS, GPS

RF

RFFE: 5G envelope tracking, 5G adaptive antenna tuning

USB

USB Version: USB 3.0, USB 2.0

Interface

Supported Interfaces: I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0, USB 3.0

Navigation Software

Dead Reckoning: Qualcomm® Dead Reckoning 3.0

    Qualcomm VEPP, Qualcomm RFFE and Qualcomm Dead Reckoning are products of Qualcomm Technologies, Inc. and/or its subsidiaries.