Snapdragon Automotive 5G Platform

3GPP Release 15-compliant 5G multimode modem supporting 5G, LTE, 3G, 2G connectivity, concurrent with C-V2X, DSDA, NG-ecall and location services

The Qualcomm® Snapdragon™ Automotive 5G Platform is our first automotive-grade 5G platform. It is 3GPP Release 15-compliant, engineered to support FDD and TDD networks, as well as ....

The Qualcomm® Snapdragon™ Automotive 5G Platform is our first automotive-grade 5G platform. It is 3GPP Release 15-compliant, engineered to support FDD and TDD networks, as well as standalone (SA) and non-standalone (NSA) modes of operation.

The Snapdragon Automotive 5G platform is optimized to support concurrent multi-frequency, multi-constellation GNSS, inc....

The Snapdragon Automotive 5G platform is optimized to support concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.

The Snapdragon Automotive 5G Platform also supports Qualcomm® Dead Reckoning 3 technology and Qualcomm® Vision Enhanced Precise Position....

Qualcomm Snapdragon Automotive 5G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries

5G for Automotive

Ultra-high speeds and ultra-low latency to facilitate better security, availability, and quality-of-service for mission critical services.

Dual Sim Dual Active (DSDA) benefits

Via DSDA technology, car and driver can each choose their own independent network operator subscription in order support a variety of emerging mobility service models.

C-V2X concurrency

Concurrent C-V2X operation with 5G, 4G, 3G, and 2G helps to provide security among vehicles and road-side infrastructure.

Comprehensive RF Front End portfolio

Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.

Features

5G technology provides multi-gigabit throughput for 4K/8K/HDR video steaming and 3D nav
Latency below 1ms to allow cooperative collision avoidance and synchronized driving
Improved quality-of-service, security, and availability for mission critical services
Qualcomm RFFE Solution from digital to antenna
- Optimal system performance
- RF module software integration with transceiver
Includes RF Modules targeted for Automotive:
- Extended temperature range (-40 to +85C)
- System level integration in telematics platform
Next Generation eCall (NG-ecall) over LTE network

Specifications

CPU

CPU Cores: ARM Cortex A7

Cellular Modem-RF

Cellular Modem-RF Specs: 200 MHz bandwidth (sub-6 GHz), 3x20 MHz carrier aggregation (DL)

Performance Enhancement Technologies: 5G envelope tracking

Cellular Technology: TDD, 5G NR, 5G/4G spectrum sharing, LAA, SA (standalone), NSA (non-standalone), FDD, sub-6 GHz, WCDMA (DC-HSDPA, HSUPA), LTE FDD, LTE TDD including CBRS support, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

Multi SIM: LTE Dual SIM Dual Active (DSDA)

Sidelink Features: PC5 Support, 23dBm, 20Mhz Channel BW

C-V2X Direct Communications: V2V, V2P, V2I, 3GPP R-14 Spec

Location

Satellite Systems Support: Beidou, Galileo, GLONASS, GPS

RFFE: 5G adaptive antenna tuning

USB

USB Version: USB 3.0, USB 2.0

Interfaces

Supported Interfaces: I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0, USB 3.0

Navigation Software

Dead Reckoning: Qualcomm® Dead Reckoning 3.0

Process

Process Node and Technology: 7 nm

Qualcomm VEPP, Qualcomm RFFE and Qualcomm Dead Reckoning are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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