Snapdragon Automotive 4G Platform
6th generation multimode LTE modem with integrated C-V2X for automotive
6th generation multimode LTE modem with integrated C-V2X for automotive
Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.
Designed to support up to five aggregated LTE carriers, the Snapdragon Automo....
Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.
Designed to support up to five aggregated LTE carriers, the Snapdragon Automo....
Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.
Designed to support up to five aggregated LTE carriers, the Snapdragon Automotive 4G Platform uses spectrum deployed by global carriers. It also supports concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.
Th....
Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.
Designed to support up to five aggregated LTE carriers, the Snapdragon Automotive 4G Platform uses spectrum deployed by global carriers. It also supports concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.
The Snapdragon Automotive 4G Platform also supports Qualcomm® Dead Reckoning 3 technology and Qualcomm® Vision Enhanced Precise Positioning technology (VEPP), optimized to provide hi....
Qualcomm Snapdragon Automotive 4G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Advanced LTE and GNSS Integration
Features advanced LTE and satellite system integration designed to improve measurement accuracy in challenging environments and remove ionospheric delay.
LTE + C-V2X Concurrency
LTE Category 16 downlink for 1 Gbps speeds combined with C-V2X PC5 capability in the 20 MHz band.
RF Front end portfolio
Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.
Features
LTE downlink at Cat 16, Uplink at Cat 13
Improved measurement accuracy by up to 50% in challenged multipath environments
Direct measurement and help eliminate ionospheric delay when L1/L2/L5 multifrequency GNSS is running concurrently
Increased robustness with improved jammer mitigation
Qualcomm RFFE Solution from digital to antenna
- Optimal system performance
- RF module software integration with transceiver
Includes RF Modules targeted for Automotive:
- Extended temperature range (-40 to +85C)
- System level integration in Telematics platform
Specifications
CPU
CPU Clock Speed: Up to 1.5 GHz
CPU Cores: ARM Cortex A7
Cellular Modem-RF
Peak Download Speed: 1 Gbps
Peak Upload Speed: 150 Mbps
Cellular Modem-RF Specs: 2x20 MHz carrier aggregation (UL), 4x20 MHz carrier aggregation (DL), LTE Category 16 (DL), LTE Category 13 (UL)
Performance Enhancement Technologies: Qualcomm® Snapdragon™ Upload+, Uplink Data Compression (UDC)
Cellular Technology: LAA, LTE TDD, WCDMA (DB-DC-HSDPA, DC-HSUPA), LTE FDD, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
Wi-Fi
Peak Speed: 1.774 Gbps
Standards: 802.11ax, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Wi-Fi Features: 8x8 sounding (ready), Dual-band simultaneous (DBS) (ready), WPA3 security support (ready)
Qualcomm® Wi-Fi 6 technology features: Target Wake Time
Channel Utilization: 20/40/80 MHz
MIMO Configuration: 2x2 (2-stream)
Bluetooth
Bluetooth Specification Version: Bluetooth 5.1
Location
Satellite Systems Support: Beidou, Galileo, GNSS, GPS, QZSS
USB
USB Version: USB 3.1, USB 2.0
Audio
Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Audio
Interfaces
Supported Interfaces: USB 3.1, I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0
Navigation Software
Dead Reckoning: Qualcomm® Dead Reckoning 3.0
Process
Process Node and Technology: 10 nm
Package
Package Type: Non-stacked
Size: 8.3 x 8.3 x 0.73 mm
Qualcomm Dead Reckoning, Qualcomm VEPP, Qualcomm RFFE, Qualcomm Wi-Fi, Qualcomm aptX and Qualcomm Snapdragon Upload+ are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.