6th generation multimode LTE modem with integrated C-V2X for automotive
Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.
Designed to support up to five aggregated LTE carriers, the Snapdragon Automotive 4G Platform uses spectrum deployed by global carriers. It also supports concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.
The Snapdragon Automotive 4G Platform also supports Qualcomm® Dead Reckoning 3 technology and Qualcomm® Vision Enhanced Precise Positioning technology (VEPP), optimized to provide highly accurate location positioning with a comprehensive virtually anytime/anywhere 3D navigation solution.
The Snapdragon Automotive 4G Platform features integrated C-V2X direct communications to provide superior support for rich in-vehicle experiences; precise positioning for lane level navigation accuracy; multi-gigabit cloud connectivity, vehicle-to-vehicle (V2V) and vehicle-to-roadside infrastructure (V2I) communications for safety; and high bandwidth low latency teleoperations support.
Qualcomm Snapdragon Automotive 4G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Features advanced LTE and satellite system integration designed to improve measurement accuracy in challenging environments and remove ionospheric delay.
LTE Category 16 downlink for 1 Gbps speeds combined with C-V2X PC5 capability in the 20 MHz band.
Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.
LTE downlink at Cat 16, Uplink at Cat 13
Improved measurement accuracy by up to 50% in challenged multipath environments
Direct measurement and help eliminate ionospheric delay when L1/L2/L5 multifrequency GNSS is running concurrently
Increased robustness with improved jammer mitigation
Qualcomm RFFE Solution from digital to antenna
Includes RF Modules targeted for Automotive:
CPU Clock Speed: Up to 1.5 GHz
CPU Cores: ARM Cortex A7
Process Technology: 10 nm
Downlink LTE Category: LTE Category 16
Uplink LTE Category: LTE Category 13
LTE Downlink Features
Downlink Carrier Aggregation: 4x20 MHz carrier aggregation
Downlink LTE MIMO: Up to 4x4 MIMO on two carriers
LTE Uplink Features
Uplink Technology: Qualcomm® Snapdragon™ Upload+, Uplink Data Compression (UDC)
Uplink Carrier Aggregation: 2x20 MHz carrier aggregation
Uplink LTE Streams: Up to 2x 75Mbps LTE streams
LTE Peak Download Speed: 1 Gbps
LTE Peak Upload Speed: 150 Mbps
Cellular Technology: WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
LTE Technology: LTE TDD, LTE FDD, LAA
Wi-Fi Standards: 802.11ax, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Peak Speed: 1.774 Gbps
Qualcomm® Wi-Fi 6-ready technology features: Dual-band simultaneous (DBS), Target Wakeup Time, 8x8 sounding, WPA3 security support
Channel Utilization: 20/40/80 MHz
MIMO Configuration: 2x2 (2-stream)
Bluetooth Version: Bluetooth 5.1
Satellite Systems Support: Beidou, Galileo, GNSS, GPS, QZSS
USB Version: USB 3.1, USB 2.0
Audio Technology: Qualcomm® aptX™ audio technology
Supported Interfaces: USB 3.1, I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0
Package Type: Non-stacked
Package Size: 8.3 x 8.3 x 0.73 mm
Dead Reckoning: Qualcomm® Dead Reckoning 3.0
Qualcomm Dead Reckoning, Qualcomm VEPP, Qualcomm RFFE, Qualcomm Wi-Fi, Qualcomm aptX and Qualcomm Snapdragon Upload+ are products of Qualcomm Technologies, Inc. and/or its subsidiaries.