snapdragon

Snapdragon Automotive 4G Platform

6th generation multimode LTE modem with integrated C-V2X for automotive

Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.

Designed to support up to five aggregated LTE carriers, the Snapdragon Automo....

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Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.

Designed to support up to five aggregated LTE carriers, the Snapdragon Automo....

more

Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.

Designed to support up to five aggregated LTE carriers, the Snapdragon Automotive 4G Platform uses spectrum deployed by global carriers. It also supports concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.

Th....

more

Qualcomm® Snapdragon™ Automotive 4G Platform is our 6th generation multimode LTE modem for automotive.

Designed to support up to five aggregated LTE carriers, the Snapdragon Automotive 4G Platform uses spectrum deployed by global carriers. It also supports concurrent multi-frequency, multi-constellation GNSS, including GPS, Galileo, Glonass, BDS and QZSS.

The Snapdragon Automotive 4G Platform also supports Qualcomm® Dead Reckoning 3 technology and Qualcomm® Vision Enhanced Precise Positioning technology (VEPP), optimized to provide hi....

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Qualcomm Snapdragon Automotive 4G Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Advanced LTE and GNSS Integration

Features advanced LTE and satellite system integration designed to improve measurement accuracy in challenging environments and remove ionospheric delay.

LTE + C-V2X Concurrency

LTE Category 16 downlink for 1 Gbps speeds combined with C-V2X PC5 capability in the 20 MHz band.

RF Front end portfolio

Integrated with Qualcomm® RF Front End (RFFE) solutions to help reduce design complexity as antenna complexity increases.

Features

  • LTE downlink at Cat 16, Uplink at Cat 13

  • Improved measurement accuracy by up to 50% in challenged multipath environments

  • Direct measurement and help eliminate ionospheric delay when L1/L2/L5 multifrequency GNSS is running concurrently

  • Increased robustness with improved jammer mitigation

  • Qualcomm RFFE Solution from digital to antenna

    • Optimal system performance
    • RF module software integration with transceiver
  • Includes RF Modules targeted for Automotive:

    • Extended temperature range (-40 to +85C)
    • System level integration in Telematics platform

Specifications

CPU

CPU Clock Speed: Up to 1.5 GHz

CPU Cores: ARM Cortex A7

Process

Process Technology: 10 nm

LTE Category

Downlink LTE Category: LTE Category 16

Uplink LTE Category: LTE Category 13

LTE Downlink Features

Downlink Carrier Aggregation: 4x20 MHz carrier aggregation

Downlink LTE MIMO: Up to 4x4 MIMO on two carriers

LTE Uplink Features

Uplink Technology: Qualcomm® Snapdragon™ Upload+, Uplink Data Compression (UDC)

Uplink Carrier Aggregation: 2x20 MHz carrier aggregation

Uplink LTE Streams: Up to 2x 75Mbps LTE streams

LTE Speed

LTE Peak Download Speed: 1 Gbps

LTE Peak Upload Speed: 150 Mbps

Cellular Technology

Cellular Technology: WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

LTE Technology: LTE TDD, LTE FDD, LAA

Wi-Fi

Wi-Fi Standards: 802.11ax, 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Peak Speed: 1.774 Gbps

Qualcomm® Wi-Fi 6-ready technology features: Dual-band simultaneous (DBS), Target Wakeup Time, 8x8 sounding, WPA3 security support

Channel Utilization: 20/40/80 MHz

MIMO Configuration: 2x2 (2-stream)

Bluetooth

Bluetooth Version: Bluetooth 5.1

Location

Satellite Systems Support: Beidou, Galileo, GNSS, GPS, QZSS

USB

USB Version: USB 3.1, USB 2.0

General Audio

Audio Technology: Qualcomm® aptX™ audio technology

Interface

Supported Interfaces: USB 3.1, I²S, PCIe, I²C, GPIO, SDIO, SPI, UART, USB 2.0

Package

Package Type: Non-stacked

Package Size: 8.3 x 8.3 x 0.73 mm

Navigation Software

Dead Reckoning: Qualcomm® Dead Reckoning 3.0

    Qualcomm Dead Reckoning, Qualcomm VEPP, Qualcomm RFFE, Qualcomm Wi-Fi, Qualcomm aptX and Qualcomm Snapdragon Upload+ are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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    References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

    Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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    Nothing in these materials is an offer to sell any of the components or devices referenced herein.