Home Security & Automation
Our flexible connectivity and advanced processor solutions help customers to develop smart home hubs, connected control panels, security cameras, door locks, and more that can seamlessly integrate with existing smart home products and the cloud.
Product |
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Vision Intelligence 400 Platform |
Vision Intelligence 300 Platform |
Vision Intelligence 200 Platform |
Vision Intelligence 100 Platform |
Home Hub 100 Platform |
AIE GPU | Hexagon Processor | Neural Processing | CPU Clock Speed | CPU Cores | CPU Architecture | DSP Technology | Wi-Fi Standards | MIMO Configuration | Image Signal Processor | Single Camera | Audio Technology | GPU Name |
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Qualcomm® Adreno™ 615 GPU | Qualcomm® Hexagon™ 685 DSP | 2.1 TOPS @ 1w Android NN Caffe Caffe2 ONNX Qualcomm® Neural Processing SDK Tensorflow | Up to 2.5 GHz | Qualcomm® Kryo™ 300 CPU Octa-core CPU | 64-bit | 2x Qualcomm® Hexagon™ Vector eXtensions (HVX) Qualcomm® Hexagon™ 685 DSP Qualcomm All-Ways Aware™ technology | 802.11ac Wave 2 802.11a/b/g 802.11n | 2x2 (2-stream) | 2x Qualcomm Spectra™ 270 image signal processor 14-bit | Up to 32 MP | Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology | Qualcomm® Adreno™ 615 GPU |
Qualcomm® Adreno™ 615 GPU | Qualcomm® Hexagon™ 685 DSP | 1.9 TOPS @ 1w Android NN Caffe Caffe2 ONNX Qualcomm® Neural Processing SDK Tensorflow | Up to 1.7 GHz 1 Up to 1.6 GHz 2 | Qualcomm® Kryo™ 300 CPU Quad-core CPU | 64-bit | Qualcomm® Hexagon™ 685 DSP Qualcomm® Hexagon™ Vector Processor Qualcomm All-Ways Aware™ technology | 802.11ac 802.11a/b/g 802.11n | 1x1 (1-stream) | 2x Qualcomm Spectra™ 270 image signal processor 14-bit | Up to 24 MP | Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology | Qualcomm® Adreno™ 615 GPU |
— | — | — | Up to 2.2 GHz | 8x ARM Cortex A53 | 64-bit | Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology | 802.11ac 802.11a/b/g 802.11n | 1x1 (1-stream) | — | Up to 24 MP | Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology | Qualcomm® Adreno™ 506 GPU |
— | — | — | 1.8 GHz | 8x ARM Cortex A53 | 64-bit | Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology | 802.11ac 802.11a/b/g 802.11n | 1x1 (1-stream) | — | Up to 21 MP | Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology | Qualcomm® Adreno™ 506 GPU |
— | — | — | Up to 128 MHz | Arm Cortex-M4F CPU | — | — | 802.11a/b/g 802.11n | 1x1 (1-stream) | — | — | — | — |
AIE GPU | Hexagon Processor | CPU Clock Speed | CPU Cores | Wi-Fi Standards | Wi-Fi Spectral Bands | MIMO Configuration | Bluetooth Version | Bluetooth Technology | Single Camera | Video Capture (30 FPS) | Slow Motion Video Capture | Supported Interfaces | Package Type | Pitch | Package Size |
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— | — | 1.8 GHz | 8x ARM Cortex A53 Octa-core CPU | 802.11ac with MU-MIMO 802.11a/b/g 802.11n | 2.4GHz 5GHz | 2x2 (2-stream) | Bluetooth 4.1 | Bluetooth Low Energy | Up to 24 MP | 4K Ultra HD video capture | — | — | — | — | — |
— | — | Up to 1.3 GHz | 4x ARM Cortex A7 Quad-core CPU | 802.11ac with MU-MIMO 802.11a/b/g 802.11n | 2.4GHz 5GHz | 2x2 (2-stream) | Bluetooth 4.1 | Bluetooth Low Energy | Up to 16 MP | 720p video capture | — | — | — | — | — |
Qualcomm® Adreno™ 615 GPU | Qualcomm® Hexagon™ 685 DSP | Up to 2.5 GHz | Qualcomm® Kryo™ 300 CPU Octa-core CPU | 802.11ac Wave 2 802.11a/b/g 802.11n | 2.4GHz 5GHz | 2x2 (2-stream) | Bluetooth 5.0 | — | Up to 16 MP | — | 4K Ultra HD @ 60 FPS | — | — | — | — |
Qualcomm® Adreno™ 615 GPU | Qualcomm® Hexagon™ 685 DSP | Up to 1.7 GHz 1 Up to 1.6 GHz 2 | Qualcomm® Kryo™ 300 CPU Quad-core CPU | 802.11ac 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | Bluetooth 5.0 | — | Up to 16 MP | — | 1080p @ 60 FPS | — | — | — | — |
— | — | Up to 128 MHz | Arm Cortex-M4F CPU 3 Arm Cortex-M0 CPU 4 Tensilica Xtensa 5 | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | Bluetooth 5.0 | Qualcomm® Bluetooth mesh Bluetooth Low Energy | — | — | — | I²S PWM ADC 6 SDIO2.0 6 SPI/Q-SPI 6 I²C 6 GPIO 6 SPI 6 UART 6 | BGA | 0.65mm Pitch | 11.2 x 11.2 x 0.95 mm |
— | — | Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | — | — | I²S I²C JTAG SDIO SPI UART USB 2.0 | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
— | — | Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | — | — | I²S I²C JTAG SDIO SPI UART USB 2.0 | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Bluetooth Technology | Bluetooth Radio | Maximum Output Power | Maximum Input Voltage | ROM | RAM | Supported Interfaces | Analog I/O | General Purpose I/Os | PWM | PWM (LED) | Maximum Temperature | Minimum Temperature | Package Type | Pitch | Package Size |
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Qualcomm® Bluetooth mesh Bluetooth Low Energy | — | — | — | — | 300+KB | I²S PWM ADC 1 SDIO2.0 1 SPI/Q-SPI 1 I²C 1 GPIO 1 SPI 1 UART 1 | — | — | — | — | — | — | QFN | 0.9mm Pitch | 8 x 8 mm |
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology | Direct 50Ω connection to antenna Integrated balun -92dBm receiver sensitivity | Up to +4dBm | — | — | 80 KB RAM | I²C master/slave QSPI flash UART | — | 33x | 5x | — | 85°C | -30°C | LGA | 0.5mm Pitch | 8 x 8 x 0.75mm |
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology | Direct 50Ω connection to antenna Integrated balun | Up to +4dBm | — | — | 80 KB RAM | I²C master/slave QSPI flash SPI master/slave UART | 1 | 15x | 5x | — | 85°C | -30°C | LGA | 0.5mm Pitch | 5 x 5 x 0.75mm |
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology | Direct 50Ω connection to antenna -91.5 dBm RX sensitivity Integrated balun | Up to +4dBm | — | — | 80 KB RAM | I²S PDM I²C SPI UART | — | 37x | 5x | — | 85°C | -30°C | LGA | 0.5mm Pitch | 5 x 5 x 0.75mm |
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology | Direct 50Ω connection to antenna -91.5 dBm RX sensitivity Integrated balun | Up to +4dBm | — | — | 80 KB RAM | I²C master/slave QSPI flash SPI master/slave UART | — | 15x | 5x | — | 85°C | -30°C | QFN | 0.5mm Pitch | 5 x 5 x 0.65 mm |
Bluetooth Low Energy CSRmesh™ technology | 50Ω -93dBm receiver sensitivity | Up to +9dBm | 4.4V | 64KB ROM | 64 KB RAM | I²C SPI UART | 3 | 12x | 4x | — | — | — | UT-WLCSP | 0.4mm Pitch | 2.43 x 2.56 x 0.35 mm |
Bluetooth Low Energy CSRmesh™ technology | 50Ω -93dBm receiver sensitivity | Up to +9dBm | 4.4V | 64KB ROM | 64 KB RAM | I²C SPI UART | 3 | 12x | 4x | — | — | — | QFN | 0.4mm Pitch | 4 x 4 x 0.6 mm |
Bluetooth Low Energy CSRmesh™ technology | 50Ω -93dBm receiver sensitivity | Up to +9dBm | 4.4V | 64KB ROM | 64 KB RAM | I²C SPI UART | 3 | 32x | 3x | — | — | — | QFN | 0.5mm Pitch | 8 x 8 x 0.9 mm |
Bluetooth Low Energy CSRmesh™ technology | 50Ω -93dBm receiver sensitivity | Up to +9dBm | 4.4V | 64KB ROM | 64 KB RAM | I²C SPI UART | 3 | 12x | 4x | — | 85°C | -40°C | QFN | 0.5mm Pitch | 5 x 5 x 0.65 mm |
Bluetooth Low Energy Dual-mode Bluetooth | 50Ω -90dBm receiver sensitivity | Up to +9dBm | 3.2V | 8Mb ROM | 56 KB RAM | I²C SPI UART USB 2.0 | 22 | Digital I/O 22x | 3x | 4 | 85°C | -40°C | BGA | 0.5mm Pitch | 6 x 6 x 1 mm |
Bluetooth Low Energy Dual-mode Bluetooth | 50Ω -90dBm receiver sensitivity | Up to +9dBm | 3.2V | 8Mb ROM | 56 KB RAM | — | 22 | Digital I/O 22x | 3x | 4 | 70°C | -20°C | BGA QFN | 0.4mm Pitch 2 0.5mm Pitch 3 | 6 x 6 x 1 mm 3 10 x 10 mm 2 |
Bluetooth Low Energy Dual-mode Bluetooth | 50Ω -90dBm receiver sensitivity | Up to +9dBm | 3.2V | 8Mb ROM | 56 KB RAM | I²C SPI UART USB 2.0 | 22 | 22x | 3x | 4 | 70°C | -20°C | QFN | 0.4mm Pitch | 10 x 10 mm |
Product |
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CSRmesh Development Kit |
CPU Clock Speed | CPU Architecture | Bluetooth Version | Bluetooth Technology | Bluetooth Radio | Maximum Output Power |
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64MHz | 16-bit | Bluetooth 4.1 | CSRmesh™ technology | 50Ω -92.5dBm receiver sensitivity | 7.5dBm transmitter |
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