Home Security & Automation

Manage and safeguard your smart home.

Find products to develop home security and automation solutions.

Our flexible connectivity and advanced processor solutions help customers to develop smart home hubs, connected control panels, security cameras, door locks, and more that can seamlessly integrate with existing smart home products and the cloud.

Platforms

AIE GPUHexagon ProcessorNeural ProcessingCPU Clock SpeedCPU CoresCPU ArchitectureDSP TechnologyStandardsMIMO ConfigurationImage Signal ProcessorSingle CameraOther Audio Capturing TechnologiesGPU Name
Qualcomm® Adreno™ 615 GPU
Qualcomm® Hexagon™ 685 DSP
2.1 TOPS @ 1w
ONNX
Tensorflow
Android NN
Qualcomm® Neural Processing SDK
Caffe
Caffe2
Up to 2.5 GHz
Qualcomm® Kryo™ 300 CPU
Octa-core CPU
64-bit
2x Qualcomm® Hexagon™ Vector eXtensions (HVX)
Qualcomm® Hexagon™ 685 DSP
Qualcomm All-Ways Aware™ technology
802.11ac Wave 2
802.11a/b/g
802.11n
2x2 (2-stream)
2x Qualcomm Spectra™ 270 image signal processor
14-bit
Up to 32 MP
Qualcomm® Adreno™ 615 GPU
Qualcomm® Adreno™ 615 GPU
Qualcomm® Hexagon™ 685 DSP
1.9 TOPS @ 1w
ONNX
Tensorflow
Android NN
Qualcomm® Neural Processing SDK
Caffe
Caffe2
Up to 1.7 GHz 1
Up to 1.6 GHz 2
Qualcomm® Kryo™ 300 CPU
Quad-core CPU
64-bit
Qualcomm® Hexagon™ 685 DSP
Qualcomm® Hexagon™ Vector Processor
Qualcomm All-Ways Aware™ technology
802.11ac
802.11a/b/g
802.11n
1x1 (1-stream)
2x Qualcomm Spectra™ 270 image signal processor
14-bit
Up to 24 MP
Qualcomm® Adreno™ 615 GPU
Up to 2.2 GHz
8x ARM Cortex A53
64-bit
Qualcomm® Hexagon™ 546 DSP
Qualcomm All-Ways Aware™ technology
802.11ac
802.11a/b/g
802.11n
1x1 (1-stream)
Up to 24 MP
Qualcomm® Adreno™ 506 GPU
1.8 GHz
8x ARM Cortex A53
64-bit
Qualcomm® Hexagon™ 546 DSP
Qualcomm All-Ways Aware™ technology
802.11ac
802.11a/b/g
802.11n
1x1 (1-stream)
Up to 21 MP
Qualcomm® Adreno™ 506 GPU
Up to 128 MHz
Arm Cortex-M4F CPU
802.11a/b/g
802.11n
1x1 (1-stream)
  1. Qualcomm® Kryo™ 300 Gold cores
  2. Qualcomm® Kryo™ 300 Silver cores

Wi-Fi Products

Product
APQ8053

APQ8053

Processor
APQ8009

APQ8009

Processor
QCS605
QCS603
QCA4020
QCA4012
QCA4010
AIE GPUHexagon ProcessorCPU Clock SpeedCPU CoresStandardsWi-Fi Spectral BandsMIMO ConfigurationBluetooth Specification VersionBluetooth TechnologySingle CameraVideo Capture (30 FPS)Slow Motion Video CaptureSupported InterfacesPackage TypePitchSize
1.8 GHz
8x ARM Cortex A53
Octa-core CPU
802.11ac with MU-MIMO
802.11a/b/g
802.11n
2.4 GHz
5 GHz
2x2 (2-stream)
Bluetooth 4.1
Bluetooth Low Energy
Up to 24 MP
4K Ultra HD video capture
Up to 1.3 GHz
4x ARM Cortex A7
Quad-core CPU
802.11ac with MU-MIMO
802.11a/b/g
802.11n
2.4 GHz
5 GHz
2x2 (2-stream)
Bluetooth 4.1
Bluetooth Low Energy
Up to 16 MP
720p video capture
Qualcomm® Adreno™ 615 GPU
Qualcomm® Hexagon™ 685 DSP
Up to 2.5 GHz
Qualcomm® Kryo™ 300 CPU
Octa-core CPU
802.11ac Wave 2
802.11a/b/g
802.11n
2.4 GHz
5 GHz
2x2 (2-stream)
Bluetooth 5.0
Up to 16 MP
4K Ultra HD @ 60 FPS
Qualcomm® Adreno™ 615 GPU
Qualcomm® Hexagon™ 685 DSP
Up to 1.7 GHz 1
Up to 1.6 GHz 2
Qualcomm® Kryo™ 300 CPU
Quad-core CPU
802.11ac
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
Bluetooth 5.0
Up to 16 MP
1080p @ 60 FPS
Up to 128 MHz
Arm Cortex-M4F CPU 3
Arm Cortex-M0 CPU 4
Tensilica Xtensa 5
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
Bluetooth 5.0
Qualcomm® Bluetooth mesh
Bluetooth Low Energy
I²S
PWM
ADC 6
SDIO2.0 6
SPI/Q-SPI 6
I²C 6
GPIO 6
SPI 6
UART 6
BGA
0.65mm Pitch
11.2 x 11.2 x 0.95 mm
Up to 130 MHz
Tensilica Xtensa
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
I²S
I²C
JTAG
SDIO
SPI
UART
USB 2.0
DRQFN
0.5mm Pitch
9 x 9 x 0.9 mm
Up to 130 MHz
Tensilica Xtensa
802.11 b/g/n
2.4 GHz
5 GHz
1x1 (1-stream)
I²S
I²C
JTAG
SDIO
SPI
UART
USB 2.0
DRQFN
0.5mm Pitch
9 x 9 x 0.9 mm
  1. Qualcomm® Kryo™ 300 Silver core
  2. Qualcomm® Kryo™ 300 Gold cores
  3. Up to 128 MHz
  4. Up to 64 MHz
  5. Up to 130 MHz. Dedicated Wi-Fi CPU.
  6. 8ch, 12-bit 1Msps

Bluetooth Products

Bluetooth TechnologyReceiver Sensitivity (basic rate, typical)Maximum Output Power (typical)Maximum Input VoltageROMRAMSupported InterfacesAnalog I/OGeneral Purpose I/OsPWMPWM (LED)Maximum TemperatureMinimum TemperaturePackage TypePitchSize
Qualcomm® Bluetooth mesh
Bluetooth Low Energy
300+ KB
I²S
PWM
ADC 1
SDIO2.0 1
SPI/Q-SPI 1
I²C 1
GPIO 1
SPI 1
UART 1
QFN
0.9mm Pitch
8 x 8 mm
Bluetooth SIG mesh
Bluetooth Low Energy
CSRmesh™ technology
-92 dBm
Up to 4 dBm
80 KB RAM
I²C master/slave
QSPI flash
UART
33x
5x
85°C
-30°C
LGA
0.5mm Pitch
8 x 8 x 0.75mm
Bluetooth SIG mesh
Bluetooth Low Energy
CSRmesh™ technology
Up to 4 dBm
80 KB RAM
I²C master/slave
QSPI flash
SPI master/slave
UART
1x
15x
5x
85°C
-30°C
LGA
0.5mm Pitch
5 x 5 x 0.75mm
Bluetooth SIG mesh
Bluetooth Low Energy
CSRmesh™ technology
-91.5 dBm
Up to 4 dBm
80 KB RAM
I²S
PDM
I²C
SPI
UART
37x
5x
85°C
-30°C
LGA
0.5mm Pitch
5 x 5 x 0.75mm
Bluetooth SIG mesh
Bluetooth Low Energy
CSRmesh™ technology
-91.5 dBm
Up to 4 dBm
80 KB RAM
I²C master/slave
QSPI flash
SPI master/slave
UART
15x
5x
85°C
-30°C
QFN
0.5mm Pitch
5 x 5 x 0.65 mm
Bluetooth Low Energy
CSRmesh™ technology
-93 dBm
Up to 9 dBm
4.4 V
64 KB
64 KB RAM
I²C
SPI
UART
3
12x
4x
UT-WLCSP
0.4mm Pitch
2.43 x 2.56 x 0.35 mm
Bluetooth Low Energy
CSRmesh™ technology
-93 dBm
Up to 9 dBm
4.4 V
64 KB
64 KB RAM
I²C
SPI
UART
3
12x
4x
QFN
0.4mm Pitch
4 x 4 x 0.6 mm
Bluetooth Low Energy
CSRmesh™ technology
-93 dBm
Up to 9 dBm
4.4 V
64 KB
64 KB RAM
I²C
SPI
UART
3
32x
3x
QFN
0.5mm Pitch
8 x 8 x 0.9 mm
Bluetooth Low Energy
CSRmesh™ technology
-93 dBm
Up to 9 dBm
4.4 V
64 KB
64 KB RAM
I²C
SPI
UART
3
12x
4x
85°C
-40°C
QFN
0.5mm Pitch
5 x 5 x 0.65 mm
Bluetooth Low Energy
Dual-mode Bluetooth
-90 dBm
Up to 9 dBm
3.2 V
8 Mb
56 KB RAM
I²C
SPI
UART
USB 2.0
22
Digital I/O
22x
3x
4
85°C
-40°C
BGA
0.5mm Pitch
6 x 6 x 1 mm
Bluetooth Low Energy
Dual-mode Bluetooth
-90 dBm
Up to 9 dBm
3.2 V
8 Mb
56 KB RAM
22
Digital I/O
22x
3x
4
70°C
-20°C
BGA
QFN
0.4mm Pitch 2
0.5mm Pitch 3
6 x 6 x 1 mm 3
10 x 10 mm 2
Bluetooth Low Energy
Dual-mode Bluetooth
-90 dBm
Up to 9 dBm
3.2 V
8 Mb
56 KB RAM
I²C
SPI
UART
USB 2.0
22
22x
3x
4
70°C
-20°C
QFN
0.4mm Pitch
10 x 10 mm
  1. 8ch, 12-bit 1Msps
  2. QFN
  3. BGA

Development Board

Product
CSRmesh

CSRmesh Development Kit

Development Board
CPU Clock SpeedCPU ArchitectureBluetooth Specification VersionBluetooth TechnologyReceiver Sensitivity (basic rate, typical)Maximum Output Power (typical)
64MHz
16-bit
Bluetooth 4.1
CSRmesh™ technology
-92.5 dBm
7.5 dBm

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