Home Security & Automation

Manage and safeguard your smart home.

Find products to develop home security and automation solutions.

Our flexible connectivity and advanced processor solutions help customers to develop smart home hubs, connected control panels, security cameras, door locks, and more that can seamlessly integrate with existing smart home products and the cloud.

Platforms

Product
Vision Intelligence 400 Platform Platform
Vision Intelligence 300 Platform Platform
Vision Intelligence 200 Platform Platform
Vision Intelligence 100 Platform Platform
Home Hub 100 Platform Platform

AIE GPU	AIE DSP	Neural Processing	CPU Clock Speed	CPU Cores	CPU Architecture	DSP Technology	Wi-Fi Standards	MIMO Configuration	Image Signal Processor	Single Camera	Audio Technology	GPU Name
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	2.1 TOPS @ 1w Android NN Caffe Caffe2 ONNX Qualcomm® Neural Processing SDK Tensorflow	Up to 2.5 GHz	Qualcomm® Kryo™ 300 CPU Octa-core CPU	64-bit	2x Qualcomm® Hexagon™ Vector eXtensions (HVX) Qualcomm® Hexagon™ 685 DSP Qualcomm All-Ways Aware™ technology	802.11ac Wave 2 802.11a/b/g 802.11n	2x2 (2-stream)	2x Qualcomm Spectra™ 270 image signal processor 14-bit	Up to 32 MP	Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology	Qualcomm® Adreno™ 615 GPU
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	1.9 TOPS @ 1w Android NN Caffe Caffe2 ONNX Qualcomm® Neural Processing SDK Tensorflow	Up to 1.7 GHz ¹ Up to 1.6 GHz ²	Qualcomm® Kryo™ 300 CPU Quad-core CPU	64-bit	Qualcomm® Hexagon™ 685 DSP Qualcomm® Hexagon™ Vector Processor Qualcomm All-Ways Aware™ technology	802.11ac 802.11a/b/g 802.11n	1x1 (1-stream)	2x Qualcomm Spectra™ 270 image signal processor 14-bit	Up to 24 MP	Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology	Qualcomm® Adreno™ 615 GPU
—	—	—	Up to 2.2 GHz	8x ARM Cortex A53	64-bit	Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology	802.11ac 802.11a/b/g 802.11n	1x1 (1-stream)	—	Up to 24 MP	Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology	Qualcomm® Adreno™ 506 GPU
—	—	—	1.8 GHz	8x ARM Cortex A53	64-bit	Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology	802.11ac 802.11a/b/g 802.11n	1x1 (1-stream)	—	Up to 21 MP	Qualcomm Aqstic™ audio technology Qualcomm® aptX™ audio technology	Qualcomm® Adreno™ 506 GPU
—	—	—	Up to 128 MHz	Arm Cortex-M4F CPU	—	—	802.11a/b/g 802.11n	1x1 (1-stream)	—	—	—	—

Qualcomm® Kryo™ 300 Gold cores
Qualcomm® Kryo™ 300 Silver cores

Wi-Fi Products

Product
APQ8053 Processor
APQ8009 Processor
QCS605 SoC
QCS603 SoC
QCA4020 SoC
QCA4012 SoC
QCA4010 SoC

AIE GPU	AIE DSP	CPU Clock Speed	CPU Cores	Wi-Fi Standards	Wi-Fi Spectral Bands	MIMO Configuration	Bluetooth Version	Bluetooth Technology	Single Camera	Video Capture (30 FPS)	Slow Motion Video Capture	Supported Interfaces	Package Type	Pitch	Package Size
—	—	1.8 GHz	8x ARM Cortex A53 Octa-core CPU	802.11ac with MU-MIMO 802.11a/b/g 802.11n	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 4.1	Bluetooth Low Energy	Up to 24 MP	4K Ultra HD video capture	—	—	—	—	—
—	—	Up to 1.3 GHz	4x ARM Cortex A7 Quad-core CPU	802.11ac with MU-MIMO 802.11a/b/g 802.11n	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 4.1	Bluetooth Low Energy	Up to 16 MP	720p video capture	—	—	—	—	—
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	Up to 2.5 GHz	Qualcomm® Kryo™ 300 CPU Octa-core CPU	802.11ac Wave 2 802.11a/b/g 802.11n	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 5.0	—	Up to 32 MP	Up to 5.7K video capture	4K Ultra HD @ 60 FPS	—	—	—	—
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	Up to 1.7 GHz ¹ Up to 1.6 GHz ²	Qualcomm® Kryo™ 300 CPU Quad-core CPU	802.11ac 802.11a/b/g 802.11n	2.4 GHz 5 GHz	1x1 (1-stream)	Bluetooth 5.0	—	Up to 24 MP	4K Ultra HD video capture	1080p @ 60 FPS	—	—	—	—
—	—	Up to 128 MHz	Arm Cortex-M4F CPU ³ Arm Cortex-M0 CPU ⁴ Tensilica Xtensa ⁵	802.11a/b/g 802.11n	2.4 GHz 5 GHz	1x1 (1-stream)	Bluetooth 5.0	Qualcomm® Bluetooth mesh Bluetooth Low Energy	—	—	—	I²S PWM ADC ⁶ SDIO2.0 ⁶ SPI/Q-SPI ⁶ I²C ⁶ GPIO ⁶ SPI ⁶ UART ⁶	BGA	0.65mm Pitch	11.2 x 11.2 x 0.95 mm
—	—	Up to 130 MHz	Tensilica Xtensa	802.11a/b/g 802.11n	2.4 GHz 5 GHz	1x1 (1-stream)	—	—	—	—	—	I²S I²C JTAG SDIO SPI UART USB 2.0	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm
—	—	Up to 130 MHz	Tensilica Xtensa	802.11 b/g/n	2.4 GHz 5 GHz	1x1 (1-stream)	—	—	—	—	—	I²S I²C JTAG SDIO SPI UART USB 2.0	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm

Qualcomm® Kryo™ 300 Silver core
Qualcomm® Kryo™ 300 Gold cores
Up to 128 MHz
Up to 64 MHz
Up to 130 MHz. Dedicated Wi-Fi CPU.
8ch, 12-bit 1Msps

Bluetooth Products

Product
QCA4024 SoC
CSR1025 Chipset
CSR1024 Chipset
CSR1021 Chipset
CSR1020 Chipset
CSR1013 Chipset
CSR1012 Chipset
CSR1011 Chipset
CSR1010 Chipset
CSRB5348 SoC
CSRB5342 SoC
CSRB5341 SoC

Bluetooth Technology	Bluetooth Radio	Maximum Output Power	Maximum Input Voltage	ROM	RAM	Supported Interfaces	Analog I/O	General Purpose I/Os	PWM	PWM (LED)	Maximum Temperature	Minimum Temperature	Package Type	Pitch	Package Size
Qualcomm® Bluetooth mesh Bluetooth Low Energy	—	—	—	—	300+KB	I²S PWM ADC ¹ SDIO2.0 ¹ SPI/Q-SPI ¹ I²C ¹ GPIO ¹ SPI ¹ UART ¹	—	—	—	—	—	—	QFN	0.9mm Pitch	8 x 8 mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	Direct 50Ω connection to antenna Integrated balun -92dBm receiver sensitivity	Up to +4dBm	—	—	80 KB RAM	I²C master/slave QSPI flash UART	—	33x	5x	—	85°C	-30°C	LGA	0.5mm Pitch	8 x 8 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	Direct 50Ω connection to antenna Integrated balun	Up to +4dBm	—	—	80 KB RAM	I²C master/slave QSPI flash SPI master/slave UART	1	15x	5x	—	85°C	-30°C	LGA	0.5mm Pitch	5 x 5 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	Direct 50Ω connection to antenna -91.5 dBm RX sensitivity Integrated balun	Up to +4dBm	—	—	80 KB RAM	I²S PDM I²C SPI UART	—	37x	5x	—	85°C	-30°C	LGA	0.5mm Pitch	5 x 5 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	Direct 50Ω connection to antenna -91.5 dBm RX sensitivity Integrated balun	Up to +4dBm	—	—	80 KB RAM	I²C master/slave QSPI flash SPI master/slave UART	—	15x	5x	—	85°C	-30°C	QFN	0.5mm Pitch	5 x 5 x 0.65 mm
Bluetooth Low Energy CSRmesh™ technology	50Ω -93dBm receiver sensitivity	Up to +9dBm	4.4V	64KB ROM	64 KB RAM	I²C SPI UART	3	12x	4x	—	—	—	UT-WLCSP	0.4mm Pitch	2.43 x 2.56 x 0.35 mm
Bluetooth Low Energy CSRmesh™ technology	50Ω -93dBm receiver sensitivity	Up to +9dBm	4.4V	64KB ROM	64 KB RAM	I²C SPI UART	3	12x	4x	—	—	—	QFN	0.4mm Pitch	4 x 4 x 0.6 mm
Bluetooth Low Energy CSRmesh™ technology	50Ω -93dBm receiver sensitivity	Up to +9dBm	4.4V	64KB ROM	64 KB RAM	I²C SPI UART	3	32x	3x	—	—	—	QFN	0.5mm Pitch	8 x 8 x 0.9 mm
Bluetooth Low Energy CSRmesh™ technology	50Ω -93dBm receiver sensitivity	Up to +9dBm	4.4V	64KB ROM	64 KB RAM	I²C SPI UART	3	12x	4x	—	85°C	-40°C	QFN	0.5mm Pitch	5 x 5 x 0.65 mm
Bluetooth Low Energy Dual-mode Bluetooth	50Ω -90dBm receiver sensitivity	Up to +9dBm	3.2V	8Mb ROM	56 KB RAM	I²C SPI UART USB 2.0	22	Digital I/O 22x	3x	4	85°C	-40°C	BGA	0.5mm Pitch	6 x 6 x 1 mm
Bluetooth Low Energy Dual-mode Bluetooth	50Ω -90dBm receiver sensitivity	Up to +9dBm	3.2V	8Mb ROM	56 KB RAM	—	22	Digital I/O 22x	3x	4	70°C	-20°C	BGA QFN	0.4mm Pitch ² 0.5mm Pitch ³	6 x 6 x 1 mm ³ 10 x 10 mm ²
Bluetooth Low Energy Dual-mode Bluetooth	50Ω -90dBm receiver sensitivity	Up to +9dBm	3.2V	8Mb ROM	56 KB RAM	I²C SPI UART USB 2.0	22	22x	3x	4	70°C	-20°C	QFN	0.4mm Pitch	10 x 10 mm

8ch, 12-bit 1Msps
QFN
BGA

Development Board

Product
CSRmesh Development Kit Development Board

CPU Clock Speed	CPU Architecture	Bluetooth Version	Bluetooth Technology	Bluetooth Radio	Maximum Output Power
64MHz	16-bit	Bluetooth 4.1	CSRmesh™ technology	50Ω -92.5dBm receiver sensitivity	7.5dBm transmitter

About Qualcomm Careers Offices Contact Us Support Subscription Center

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell any of the components or devices referenced herein.