Home Security & Automation

Manage and safeguard your smart home.

Find products to develop home security and automation solutions.

Our flexible connectivity and advanced processor solutions help customers to develop smart home hubs, connected control panels, security cameras, door locks, and more that can seamlessly integrate with existing smart home products and the cloud.

Platforms

Product
Vision Intelligence 400 Platform Platform
Vision Intelligence 300 Platform Platform
Vision Intelligence 200 Platform Platform
Vision Intelligence 100 Platform Platform
Home Hub 100 Platform Platform

AIE GPU	Hexagon Processor	Neural Processing	CPU Clock Speed	CPU Cores	CPU Architecture	DSP Technology	Standards	MIMO Configuration	Image Signal Processor	Single Camera	Other Audio Capturing Technologies	GPU Name
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	2.1 TOPS @ 1w ONNX Tensorflow Android NN Qualcomm® Neural Processing SDK Caffe Caffe2	Up to 2.5 GHz	Qualcomm® Kryo™ 300 CPU Octa-core CPU	64-bit	2x Qualcomm® Hexagon™ Vector eXtensions (HVX) Qualcomm® Hexagon™ 685 DSP Qualcomm All-Ways Aware™ technology	802.11ac Wave 2 802.11a/b/g 802.11n	2x2 (2-stream)	2x Qualcomm Spectra™ 270 image signal processor 14-bit	Up to 32 MP	—	Qualcomm® Adreno™ 615 GPU
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	1.9 TOPS @ 1w ONNX Tensorflow Android NN Qualcomm® Neural Processing SDK Caffe Caffe2	Up to 1.7 GHz ¹ Up to 1.6 GHz ²	Qualcomm® Kryo™ 300 CPU Quad-core CPU	64-bit	Qualcomm® Hexagon™ 685 DSP Qualcomm® Hexagon™ Vector Processor Qualcomm All-Ways Aware™ technology	802.11a/b/g 802.11n 802.11ac	1x1 (1-stream)	2x Qualcomm Spectra™ 270 image signal processor 14-bit	Up to 24 MP	—	Qualcomm® Adreno™ 615 GPU
—	—	—	Up to 2.2 GHz	8x ARM Cortex A53	64-bit	Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology	802.11a/b/g 802.11n 802.11ac	1x1 (1-stream)	—	Up to 24 MP	—	Qualcomm® Adreno™ 506 GPU
—	—	—	1.8 GHz	8x ARM Cortex A53	64-bit	Qualcomm® Hexagon™ 546 DSP Qualcomm All-Ways Aware™ technology	802.11a/b/g 802.11n 802.11ac	1x1 (1-stream)	—	Up to 21 MP	—	Qualcomm® Adreno™ 506 GPU
—	—	—	Up to 128 MHz	Arm Cortex-M4F CPU	—	—	802.11a/b/g 802.11n	1x1 (1-stream)	—	—	—	—

Qualcomm® Kryo™ 300 Gold cores
Qualcomm® Kryo™ 300 Silver cores

Wi-Fi Products

Product
APQ8053 Processor
APQ8009 Processor
QCS605 SoC
QCS603 SoC
QCA4020 SoC
QCA4012 SoC
QCA4010 SoC

AIE GPU	Hexagon Processor	CPU Clock Speed	CPU Cores	Standards	Wi-Fi Spectral Bands	MIMO Configuration	Bluetooth Specification Version	Connection Technology	Single Camera	Video Capture (30 FPS)	Slow Motion Video Capture	Supported Interfaces	Package Type	Pitch	Size
—	—	1.8 GHz	8x ARM Cortex A53 Octa-core CPU	802.11a/b/g 802.11n 802.11ac with MU-MIMO	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 4.1	Bluetooth Low Energy	Up to 24 MP	4K Ultra HD video capture	—	—	—	—	—
—	—	Up to 1.3 GHz	4x ARM Cortex A7 Quad-core CPU	802.11a/b/g 802.11n 802.11ac with MU-MIMO	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 4.1	Bluetooth Low Energy	Up to 16 MP	720p video capture	—	—	—	—	—
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	Up to 2.5 GHz	Qualcomm® Kryo™ 300 CPU Octa-core CPU	802.11ac Wave 2 802.11a/b/g 802.11n	2.4 GHz 5 GHz	2x2 (2-stream)	Bluetooth 5.0	—	Up to 16 MP	—	4K Ultra HD @ 60 FPS	—	—	—	—
Qualcomm® Adreno™ 615 GPU	Qualcomm® Hexagon™ 685 DSP	Up to 1.7 GHz ¹ Up to 1.6 GHz ²	Qualcomm® Kryo™ 300 CPU Quad-core CPU	802.11a/b/g 802.11n 802.11ac	2.4 GHz 5 GHz	1x1 (1-stream)	Bluetooth 5.0	—	Up to 16 MP	—	1080p @ 60 FPS	—	—	—	—
—	—	Up to 128 MHz	Arm Cortex-M4F CPU ³ Arm Cortex-M0 CPU ⁴ Tensilica Xtensa ⁵	802.11a/b/g 802.11n	2.4 GHz 5 GHz	1x1 (1-stream)	Bluetooth 5.0	Qualcomm® Bluetooth mesh Bluetooth Low Energy	—	—	—	I²S PWM ADC ⁶ SDIO2.0 ⁶ SPI/Q-SPI ⁶ I²C ⁶ GPIO ⁶ SPI ⁶ UART ⁶	BGA	0.65mm Pitch	11.2 x 11.2 x 0.95 mm
—	—	Up to 130 MHz	Tensilica Xtensa	802.11a/b/g 802.11n	2.4 GHz 5 GHz	1x1 (1-stream)	—	—	—	—	—	I²S I²C JTAG SDIO SPI UART USB 2.0	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm
—	—	Up to 130 MHz	Tensilica Xtensa	802.11b/g/n	2.4 GHz 5 GHz	1x1 (1-stream)	—	—	—	—	—	I²S I²C JTAG SDIO SPI UART USB 2.0	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm

Qualcomm® Kryo™ 300 Silver core
Qualcomm® Kryo™ 300 Gold cores
Up to 128 MHz
Up to 64 MHz
Up to 130 MHz. Dedicated Wi-Fi CPU.
8ch, 12-bit 1Msps

Bluetooth Products

Product
QCA4024 SoC
Qualcomm CSR1025 LGA Bluetooth Low Energy Single-mode Chipset Chipset
Qualcomm CSR1024 LGA Bluetooth Low Energy Single-mode Chipset Chipset
Qualcomm CSR1021 QFN Bluetooth Low Energy Single-mode Chipset Chipset
CSR1020 Chipset
CSR1013 Chipset
CSR1012 Chipset
CSR1011 Chipset
CSR1010 Chipset
CSRB5348 SoC
CSRB5342 SoC
CSRB5341 SoC

Connection Technology	Receiver Sensitivity (basic rate, typical)	Maximum Output Power (typical)	Maximum Input Voltage	ROM	RAM	Supported Interfaces	Analog I/O	General Purpose I/Os	Pulse-Width Modulation (PWM)	Pulse-Width Modulation (PWM) (LED)	Maximum Temperature	Minimum Temperature	Package Type	Pitch	Size
Qualcomm® Bluetooth mesh Bluetooth Low Energy	—	—	—	—	300+ KB	I²S PWM ADC ¹ SDIO2.0 ¹ SPI/Q-SPI ¹ I²C ¹ GPIO ¹ SPI ¹ UART ¹	—	—	—	—	—	—	QFN	0.9mm Pitch	8 x 8 mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	-92 dBm	Up to 4 dBm	—	—	80 KB RAM	Master/Slave I²C QSPI flash UART	—	33x	5x	—	85 °C	-30 °C	LGA	0.5mm Pitch	8 x 8 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	—	Up to 4 dBm	—	—	80 KB RAM	Master/Slave I²C QSPI flash SPI master/slave UART	1x	15x	5x	—	85 °C	-30 °C	LGA	0.5mm Pitch	5 x 5 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	-91.5 dBm	Up to 4 dBm	—	—	80 KB RAM	I²S PDM I²C SPI UART	—	37x	5x	—	85 °C	-30 °C	LGA	0.5mm Pitch	5 x 5 x 0.75mm
Bluetooth SIG mesh Bluetooth Low Energy CSRmesh™ technology	-91.5 dBm	Up to 4 dBm	—	—	80 KB RAM	Master/Slave I²C QSPI flash SPI master/slave UART	—	15x	5x	—	85 °C	-30 °C	QFN	0.5mm Pitch	5 x 5 x 0.65 mm
Bluetooth Low Energy CSRmesh™ technology	-93 dBm	Up to 9 dBm	4.4 V	64 KB	64 KB RAM	I²C SPI UART	3x	12x	4x	—	—	—	UT-WLCSP	0.4mm Pitch	2.43 x 2.56 x 0.35 mm
Bluetooth Low Energy CSRmesh™ technology	-93 dBm	Up to 9 dBm	4.4 V	64 KB	64 KB RAM	I²C SPI UART	3x	12x	4x	—	—	—	QFN	0.4mm Pitch	4 x 4 x 0.6 mm
Bluetooth Low Energy CSRmesh™ technology	-93 dBm	Up to 9 dBm	4.4 V	64 KB	64 KB RAM	I²C SPI UART	3x	32x	3x	—	—	—	QFN	0.5mm Pitch	8 x 8 x 0.9 mm
Bluetooth Low Energy CSRmesh™ technology	-93 dBm	Up to 9 dBm	4.4 V	64 KB	64 KB RAM	I²C SPI UART	3x	12x	4x	—	85 °C	-40 °C	QFN	0.5mm Pitch	5 x 5 x 0.65 mm
Bluetooth Low Energy Dual-mode Bluetooth	-90 dBm	Up to 9 dBm	3.2 V	8 Mb	56 KB RAM	I²C SPI UART USB 2.0	22x	Digital I/O 22x	3x	4x	85 °C	-40 °C	BGA	0.5mm Pitch	6 x 6 x 1 mm
Bluetooth Low Energy Dual-mode Bluetooth	-90 dBm	Up to 9 dBm	3.2 V	8 Mb	56 KB RAM	—	22x	Digital I/O 22x	3x	4x	70 °C	-20 °C	BGA QFN	0.4mm Pitch ² 0.5mm Pitch ³	6 x 6 x 1 mm ³ 10 x 10 mm ²
Bluetooth Low Energy Dual-mode Bluetooth	-90 dBm	Up to 9 dBm	3.2 V	8 Mb	56 KB RAM	I²C SPI UART USB 2.0	22x	22x	3x	4x	70 °C	-20 °C	QFN	0.4mm Pitch	10 x 10 mm

8ch, 12-bit 1Msps
QFN
BGA

Development Board

Product
CSRmesh Development Kit Development Board

CPU Clock Speed	CPU Architecture	Bluetooth Specification Version	Connection Technology	Receiver Sensitivity (basic rate, typical)	Maximum Output Power (typical)
64MHz	16-bit	Bluetooth 4.1	CSRmesh™ technology	-92.5 dBm	7.5 dBm

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Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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