smart audio

Smart Audio 200 Platform Dev Kit

The Qualcomm® Smart Audio 200 Platform Development Kit is designed to be a comprehensive, customizable development kit which includes the building blocks to help create a smart speaker, making it simpler for audio manufacturers to start developing straight out of the box. It is based on the Qualcomm® Smart Audio 200 platform.

By helping to reduce the development time, effort and costs associated with designing and customizing smart speaker products, the Qualcomm Smart Audio 200 Platform Development Kit can help audio manufacturers to create differentiated smart speaker products and scale production to volume to capitalize on growing smart speaker opportunities across a range of price points.

Qualcomm Smart Audio 200 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Featured Documents

Development Kit Brief

Features

  • Wi-Fi certified SoM featuring the APQ8009 processor and containing key system components

  • Best in class connectivity with 2x2 MIMO 802.11ac, Bluetooth 4.2 with profiles such as A2DP (SBC, AAC, MP3, aptX), HFP and AVRCP

  • Reference speaker casing with bi-amped, two-way speakers

  • Six-microphone array board designed to meet far-field voice user interface performance quality

  • Multi-microphone far-field voice with keyword detection, noise suppression, beamforming, and stereo echo cancellation technology

  • Premium audio, high resolution 24-bit audio and multi-room networked audio

  • Support for leading voice assistants, including Amazon Alexa Voice Service and Microsoft Cortana

  • Designed to be compatible with our DDFA Class D digital amplifier which supports a superior listening experience

  • Qualcomm® Hexagon™ SDK, which includes a rich set of tools to support customization of the Hexagon DSP software and help to reduce development time and effort

Specifications

CPU

CPU Clock Speed: Up to 1.3 GHz

CPU Cores: 4x ARM Cortex A7, Quad-core CPU

CPU Architecture: 32-bit

DSP

DSP Technology: Qualcomm® Hexagon™ 536 DSP

Wi-Fi

Wi-Fi Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Peak Speed: 433 Mbps

Channel Utilization: 20/40/80 MHz

MIMO Configuration: 2x2 (2-stream), 1x1 (1-stream)

Peak QAM: 256 QAM

Wi-Fi Features: MU-MIMO, Integrated baseband

Bluetooth

Bluetooth Version: Bluetooth 4.2

Bluetooth Technology: Bluetooth Low Energy

Bluetooth Profiles: AVRCPv1.5, A2DP v1.3

USB

USB Version: USB 2.0

Display

Max On-Device Display: 720p

UI FPS: Up to 60 FPS

General Audio

Audio Technology: Qualcomm® echo cancellation technology, Qualcomm® keyword detection technology, Qualcomm® multi-mic noise beamforming noise suppression technology, Qualcomm® Low-Latency networked audio solution, Qualcomm® aptX™ audio technology

Voice Services Support: Amazon Alexa Voice Service, Microsoft Cortana

Audio Playback

Playback Dynamic Range: 130dB

Total Harmonic Distortion + Noise (THD+N), Playback: -109dB

Sampling, Playback: 44.1kHz

PCM, Playback: Up to 192kHz/24bit

Channel output: 4 channels

Audio Recording

Total Harmonic Distortion + Noise (THD+N), Record: -109dB

Sampling, Record: Up to 48kHz/24bit

Recording Dynamic range: 130dB

Microphone: 8 TDM mics, 2 PDM digital mics

GPU

GPU Name: Qualcomm® Adreno™ 304 GPU

Charging

Qualcomm® Quick Charge™ Support: Qualcomm® Quick Charge™ 2.0 technology

Memory

Memory speed: 533MHz

Memory Type: LPDDR3

Storage

eMMC: eMMC 4.5

Interface

Supported Interfaces: Line out, I²S, Aux input, I²C, GPIO, SPI, UART, USB 2.0

Software Options

Operating System: Linux

  1. TDM mode capable

Qualcomm Smart Audio Development Kit, Qualcomm Smart Audio Platform, Qualcomm echo cancellation, Qualcomm multi-mic beamforming, Qualcomm keyword detection technology, Qualcomm Adreno, Qualcomm aptX, Qualcomm Quick Charge, Qualcomm Aqstic, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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