snapdragon

Qualcomm Snapdragon 2150 Platform

The Snapdragon 2150 is an application processor for smart infrastructure roadside units (RSUs), and onboard units (OBUs) for vehicles to support C-V2X worldwide.

As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V....

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As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V....

more

As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V2X solutions. For the roadside units (RSUs) and onboard units for vehicles (OBUs) that are critical to the smart infrastructure of C-V2X, the Snapdragon 2150 will help provide the ....

more

As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V2X solutions. For the roadside units (RSUs) and onboard units for vehicles (OBUs) that are critical to the smart infrastructure of C-V2X, the Snapdragon 2150 will help provide the high-performance/low-power solution needed to support the growing momentum for C-V2X in the US and around the world.

The recently announced C-V2X reference platform will leverage v....

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Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Engineered for smart RSUs, OBUs and vehicles

Leveraging the Qualcomm C-V2X reference platform, the Snapdragon 2150 offers C-V2X, 4G and 5G connectivity, as well as other technologies to make RSUs, OBUs and connected cars easier to develop and deploy.

Highly integrated V2X solution

Includes an application processor, ITS stack, Aerolink Security, message signing, up to 2500 message verifications per second, PC5/Uu modem connectivity, Wi-Fi 6 and BT 5.1 connectivity, MF-GNSS, and controller area network (CAN) support.

Optimized for Qualcomm Automotive 4G and 5G platforms

Includes simultaneous WWAN Uu network communication and C-V2X side-link PC5 direct communications. Also features clean architecture with modular, scalable and future-poof design.

Features

  • Applications: Arm Cortex-A53 microprocessor cores, 64-bit processor, quad-core (1.4 GHz), primary boot processor

  • RPM system

    • Arm Cortex M3: SoC power manager
    • MPM coordinates shutdown/wakeup, clock rates, and VDDs
  • System memory via external bus interface (EBI)

    • LPDDR3 SDRAM; 32-bit wide; up to 800 MHz
    • PCDDR3/3L SDRAM: 32-bit wide (2x16); up to 800 MHz
    • LPDDR2 SDRAM: 32-bit wide; up to 533 MHz
  • External memory via SDC1: eMMC v5.1

  • Wired Connectivity

    • BAM-enabled low-speed peripheral (BLSP) ports: Six, 4 bits each; multiplexed serial interface functions
    • Universal asynchronous receiver/transmitter (UART): Up to 4 Mbps inter-integrated circuit interface (I²C)
    • SPI (master only)
  • Other interfaces

    • One USB 3.0 high-speed port, Type-C is supported
    • One USB 2.0 port
    • 1xPCIe Gen2, Ethernet RGMI, IR-Rx
  • Secure digital (SD) interfaces

    • Up to two ports
    • One 8-bit (SDC1, 1.8 V) and one 4-bit (SDC2, 1.8/2.95 V)
    • Parallel NAND 8b ECC
  • Audio interfaces: Serial low-power interchip media bus (SLIMbus)

    • One port SLIMbus interface
    • MI2S: Four inter-integrated circuit sound (I²S) channels under PX3 and two I2S under low power island
  • Configurable GPIOs

    • Number of GPIO ports: 120 GPIOs and 21 LPI GPIOs
    • Input configurations: Pull-up, pull-down, keeper, or no pull
    • Output configurations: Programmable drive current
    • Top-level mode multiplexer: Provides a convenient way to program groups of GPIOs

Specifications

CPU

CPU Architecture: 64-bit

USB

USB Version: USB 3.1, USB 2.0

Contributing Chipsets

PMICs: PMS405

Security Support

Security Features: Crypto Engine, Trust Zone, Secure Boot

Memory

Flash: NAND

Memory speed: 740MHz, 533MHz

Memory Type: 16-bit, 32-bit, PCDDR3/3L, LPDDR2

Storage

eMMC: eMMC 5.1

SD: SD 3.0 (UHS-I)

Interface

Supported Interfaces: 4-lane I2S/PCM/TDM, Ethernet RGMII, 2 x SLIMbus, 120 GPIOs, 21 LPI GPIOs, 8 x DMIC, 6 x 4-wire BLSP (I2C / UART / SPI M), 2x SPDIF, PCIe 2.0, RGMII

Input/Output

Additional I/O: Tx/Rx

Package

Package Type: NSP

Pitch: Mixed 0.4/0.5mm Pitch

Printer Software

Output Color Models: 4-bit pixel depth, 8-bit pixel depth

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