Qualcomm Snapdragon 2150 Platform
The Snapdragon 2150 is an application processor for smart infrastructure roadside units (RSUs), and onboard units (OBUs) for vehicles to support C-V2X worldwide.
The Snapdragon 2150 is an application processor for smart infrastructure roadside units (RSUs), and onboard units (OBUs) for vehicles to support C-V2X worldwide.
As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V....
As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V....
As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V2X solutions. For the roadside units (RSUs) and onboard units for vehicles (OBUs) that are critical to the smart infrastructure of C-V2X, the Snapdragon 2150 will help provide the ....
As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V2X solutions. For the roadside units (RSUs) and onboard units for vehicles (OBUs) that are critical to the smart infrastructure of C-V2X, the Snapdragon 2150 will help provide the high-performance/low-power solution needed to support the growing momentum for C-V2X in the US and around the world.
The recently announced C-V2X reference platform will leverage v....
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Engineered for smart RSUs, OBUs and vehicles
Leveraging the Qualcomm C-V2X reference platform, the Snapdragon 2150 offers C-V2X, 4G and 5G connectivity, as well as other technologies to make RSUs, OBUs and connected cars easier to develop and deploy.
Highly integrated V2X solution
Includes an application processor, ITS stack, Aerolink Security, message signing, up to 2500 message verifications per second, PC5/Uu modem connectivity, Wi-Fi 6 and BT 5.1 connectivity, MF-GNSS, and controller area network (CAN) support.
Optimized for Qualcomm Automotive 4G and 5G platforms
Includes simultaneous WWAN Uu network communication and C-V2X side-link PC5 direct communications. Also features clean architecture with modular, scalable and future-poof design.
Features
Applications: Arm Cortex-A53 microprocessor cores, 64-bit processor, quad-core (1.4 GHz), primary boot processor
RPM system
- Arm Cortex M3: SoC power manager
- MPM coordinates shutdown/wakeup, clock rates, and VDDs
System memory via external bus interface (EBI)
- LPDDR3 SDRAM; 32-bit wide; up to 800 MHz
- PCDDR3/3L SDRAM: 32-bit wide (2x16); up to 800 MHz
- LPDDR2 SDRAM: 32-bit wide; up to 533 MHz
External memory via SDC1: eMMC v5.1
Wired Connectivity
- BAM-enabled low-speed peripheral (BLSP) ports: Six, 4 bits each; multiplexed serial interface functions
- Universal asynchronous receiver/transmitter (UART): Up to 4 Mbps inter-integrated circuit interface (I²C)
- SPI (master only)
Other interfaces
- One USB 3.0 high-speed port, Type-C is supported
- One USB 2.0 port
- 1xPCIe Gen2, Ethernet RGMI, IR-Rx
Secure digital (SD) interfaces
- Up to two ports
- One 8-bit (SDC1, 1.8 V) and one 4-bit (SDC2, 1.8/2.95 V)
- Parallel NAND 8b ECC
Audio interfaces: Serial low-power interchip media bus (SLIMbus)
- One port SLIMbus interface
- MI2S: Four inter-integrated circuit sound (I²S) channels under PX3 and two I2S under low power island
Configurable GPIOs
- Number of GPIO ports: 120 GPIOs and 21 LPI GPIOs
- Input configurations: Pull-up, pull-down, keeper, or no pull
- Output configurations: Programmable drive current
- Top-level mode multiplexer: Provides a convenient way to program groups of GPIOs
Specifications
USB
USB Version: USB 3.1, USB 2.0
CPU
CPU Architecture: 64-bit
Contributing Chipsets
Power Management ICs: PMS405
Security Support
Security Features: Crypto Engine, Trust Zone, Secure Boot
Memory
Flash: NAND
Memory Speed: 740MHz, 533MHz
Memory Type: 16-bit, 32-bit, PCDDR3/3L, LPDDR2
Storage
eMMC: eMMC 5.1
SD: SD 3.0 (UHS-I)
Interface
Supported Interfaces: Ethernet RGMII, 4-lane I2S/PCM/TDM, 120 GPIOs, 2 x SLIMbus, 21 LPI GPIOs, 8 x DMIC, 6 x 4-wire BLSP (I2C / UART / SPI M), 2x SPDIF, PCIe 2.0, RGMII
Input/Output
Additional I/O: Tx/Rx
Package
Package Type: NSP
Pitch: Mixed 0.4/0.5mm Pitch
Printer Software
Output Color Models: 4-bit pixel depth, 8-bit pixel depth
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