smart headset

Qualcomm Smart Headset Platform

Based on the QCC5100 Series Bluetooth Audio SoC

Qualcomm Smart Headest Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm Smart Headset Platform Block Diagram

Features

  • Ultra-low-power consumption for extended playback time and battery life

  • Qualcomm® 2 mic cVc™ noise reduction technology for superior audio when in a voice call

  • Single chip Bluetooth containing the power management, audio DSPs, application processor, Bluetooth RF, GPIO and audio inputs and outputs

  • Class A/B direct drive of the speakers

  • Supports the Amazon Mobile Accessory protocol for seamless integration with the Google Play store Amazon Alexa application

  • 4 button control and LED user interface

  • 13mm speakers to handle low frequency audio to support full range frequency response audio play back

  • Ear interface rubbers supplied in small, medium and large sizes

Specifications

CPU

CPU Clock Speed: Up to 80 MHz

CPU Features: Programmable Apps CPU

CPU Bit Architecture: 32-bit

DSP

DSP RAM: 80kB (P) + 256kB (D)

DSP Technology: 2x Qualcomm® Kalimba™ DSP, Configurable DSP

DSP Clock Speed: 2x 120 MHz DSP

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbps

Voice Services

Digital Assistant Activation: Button press, Qualcomm® Voice Activation

General Audio

Audio Technology: Qualcomm® Broadcast Audio technology, Qualcomm TrueWireless™ Stereo technology, Qualcomm TrueWireless™ Stereo Plus technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology

Qualcomm® aptX™ playback support: aptX Classic, aptX HD, Qualcomm® eXtension program

Audio Playback Support: Stereo playback

Qualcomm® Active Noise Cancelling (ANC) technology: Feedforward, Feedback, Hybrid

Qualcomm® cVc™ audio technology: 2-mic Headset

Power Consumption

Amperage: ~6mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load, ~7mA HFP Narrow Band, 1 Digital MIC cVc

Package

Package Type: BGA

Pins: 81 pins (9 x 9)

Pitch: 0.5mm Pitch

Package Size: 5.5 x 5.5 x 1 mm

  1. Qualcomm® Voice Activation with additional license agreements.

License Keys: Qualcomm® aptX™ audio technology, Qualcomm® Active Noise Cancellation (ANC) technology and Qualcomm® Voice Activation require a software license agreement.

Qualcomm Smart Headset Reference Design, Qualcomm Smart Headset Platform, Qualcomm cVc, QCC5100, QCC5124, Qualcomm Smart Headset Development Kit, Qualcomm Open Board Development Kit and Qualcomm aptX are products of Qualcomm Technologies, Inc. and/or its subsidiaries.