QCS4290

QCS4290

The application processor that delivers greater performance, better graphics and broader connectivity options.

The Qualcomm® QCS4290 offers maximum mid-tier benefits delivering greater performance. With the Qualcomm® Kryo™ 260 CPU architecture for increased speeds and robust on-device perfo....

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The Qualcomm® QCS4290 offers maximum mid-tier benefits delivering greater performance. With the Qualcomm® Kryo™ 260 CPU architecture for increased speeds and robust on-device perfo....

more

The Qualcomm® QCS4290 offers maximum mid-tier benefits delivering greater performance. With the Qualcomm® Kryo™ 260 CPU architecture for increased speeds and robust on-device performance, in addition to the 3rd generation Qualcomm AI Engine, this platform delivers powerful performance, dynamic camera capabilities and Wi-Fi 6-ready connectivity, ideal for ind....

more

The Qualcomm® QCS4290 offers maximum mid-tier benefits delivering greater performance. With the Qualcomm® Kryo™ 260 CPU architecture for increased speeds and robust on-device performance, in addition to the 3rd generation Qualcomm AI Engine, this platform delivers powerful performance, dynamic camera capabilities and Wi-Fi 6-ready connectivity, ideal for industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels and cameras. For increased intuitive on-device intelligence, devi....

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Qualcomm QCS4290 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

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Product Brief

Robust performance

The Qualcomm QCS4290 delivers increased speeds and sustained performance powered by the Qualcomm(R) Kryo™ 260 CPU architecture, so multi-tasking can happen seamlessly with less lag. Videos have vivid graphics thanks to the Qualcomm® Adreno™ 610 GPU.

Connect confidently

Productivity revolves around strong connections. The Qualcomm QCS4290 is Wi-Fi 6-ready for powerful connections that include battery-saving benefits and enhanced Bluetooth 5.1 capabilities. Wi-Fi 6 also supports WPA-3 security, so you can connect confidently.

Intuitive experiences from on-device AI intelligence

IoT devices should work smarter, not harder. The 3rd gen Qualcomm® AI Engine delivers astonishing AI, powering more intuitive on-device AI intelligence. With the Qualcomm® Sensing Hub, a device can quickly respond to different needs.

Accelerate time to commercialization

The Qualcomm QCS4290 baseband chipset is pin-to-pin compatible with Qualcomm® QCS2290 which helps customers leverage hardware and software development across various IoT devices to reduce cost and time to commercialization.

QCS4290 block diagram

Features

  • Designed with CPU architectures for increased speeds and sustained performance

  • Kryo 260 CPU with 4x Arm Cortex-A53 increased up to 1.8 GHz frequency

  • 11 nm Process Technology for improved performance and lower power consumption

  • Dual Frequency GNSS (L1 and L5) and support for India’s NavIC satellite system

  • Qualcomm FastConnect™ 6100 provides the Wi-Fi 6-ready, integrated with Wi-Fi subsystem with Bluetooth 5, WPA3 Security, and digital FM. Bluetooth 5.1 provides improvement in power performance from previous generation.

  • Dedicated Qualcomm® Hexagon™ 683 DSP with dual Hexagon Vector eXtensions (dual HVX at 1.0 GHz)
    LPDDR4x SDRAM designed for 1866 MHz clock (2 × 16 bit)
    LPDDR3 SDRAM designed for 933 MHz clock (1 × 32 bit)
    Dual-channel non-PoP high-speed memory

  • Qualcomm® Universal Bandwidth Compression (UBWC) with display and GPU

  • One 4-lane DSI D-PHY 1.2 at 1.5 Gbps per lane, split link supported

  • 3x ISP (13 MP + 13 MP)/(25 MP + 5 MP) at 30 fps

  • Three 4-lane CSIs (4/4/4 or 4/4/2/1) D-PHY

  • 1.2 at 2.5 Gbps per lane or C-PHY 1.0 at 10 Gbps (3.42 Gbps/trio)

  • Support for USB 3.1 Type-C

  • Long term support with extended life hardware and software support through 2027

Specifications

Qualcomm® Artificial Intelligence (AI) Engine

AIE GPU: Qualcomm® Adreno™ 610 GPU

AIE CPU: 8x Qualcomm® Kryo™ 260 CPU

Hexagon Processor: Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Sensing Hub, Qualcomm® Hexagon™ 683 Processor

CPU

CPU Clock Speed: 2 GHz

CPU Cores: 8x Qualcomm® Kryo™ 260 CPU, Octa-core CPU

DSP

DSP Technology: Qualcomm® Hexagon™ Vector Processor

Wi-Fi

Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g/n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Qualcomm® Wi-Fi 6 technology features: 8x8 sounding (ready), Target Wake Time (ready)

Channel Utilization: 20/40/80 MHz

MIMO Configuration: 1x1 (1-stream)

Bluetooth

Bluetooth Specification Version: Bluetooth 5.1

Bluetooth Features: Qualcomm TrueWireless™ Technology

Location

Satellite Systems Support: Beidou, Galileo, GLONASS, NavIC, GPS, QZSS, SBAS

USB

USB Version: USB-C

Camera

Image Signal Processor: Qualcomm Spectra™ 340T image signal processor

Triple Camera, MFNR, ZSL, 30fps: Up to 25 MP

Dual Camera, MFNR, ZSL, 30fps: Up to 16 MP

Single Camera: Up to 48 MP

Camera Features: HEIC photo capture, HEIF photo capture

Slow Motion Video Capture: 1080p @ 60 FPS

Video Capture Formats: HEVC

Camera Support: 13 MP + 13 MP/25 MP + 5 MP at 30 fps or 16 MP + 16 MP at 24 fps

Single Camera, MFNR: Up to 25 MP

Display

Max On-Device Display: FHD+ (1080 x 2520 @ 60 Hz), HD+ (900 x 1600 @ 90 Hz), FHD+

Audio

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Adaptive

Other Audio Capturing Technologies: Qualcomm® Voice Suite, Qualcomm® Noise and Echo Cancellation technology

GPU

GPU Name: Qualcomm® Adreno™ 610 GPU

API Support: OpenCL™ 2.0 Full, OpenGL® ES 3.2, Vulkan® 1.1

Charging

Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 3.0 technology

Security Support

Wi-Fi Security: WPA3 Easy Connect, WPA3-Enterprise, WPA3-Personal

Memory

Memory Speed: 1866MHz, 933MHz

Flash: eMMC

Storage

UFS: UFS 2.1

Audio Playback Interfaces

Playback Dynamic Range: 122 dB

Total Harmonic Distortion + Noise (THD+N), Playback: -105 dB

Playback Sampling Frequency: 44.1kHz, 48kHz, 88.2kHz, 96kHz, 176.4kHz, 192kHz

Audio Recording Interfaces

Total Harmonic Distortion + Noise (THD+N), Record: -103dB

Recording Sampling: Up to 192kHz/24bit

Recording Dynamic range: 109 dB

Pulse Code Modulation (PCM)

Playback Sampling: Up to 192kHz/24bit

Process

Process Node and Technology: 11 nm

Package

Package Type: 752 NSP

Size: 12.0 × 12.4 × 0.91 mm

  1. with dual HVX

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