QCC5127

QCC5127

Extremely low power premium tier Bluetooth Audio SoC in a BGA package, designed for use in compact, voice enabled, feature rich wire-free earbuds, hearables and headsets.

The Qualcomm® QCC5127 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants.....

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The Qualcomm® QCC5127 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants.....

more

The Qualcomm® QCC5127 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants. The SoC is optimized for small form-factor devices to support extremely low power consumption for longer audio playback.

QC5127 is a part of the Qualcomm® QCC5100 Low Power Bluet....

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The Qualcomm® QCC5127 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants. The SoC is optimized for small form-factor devices to support extremely low power consumption for longer audio playback.

QC5127 is a part of the Qualcomm® QCC5100 Low Power Bluetooth Audio SoC Series.

Qualcomm QCC5127 and Qualcomm QCC5100 are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Voice assistant support

Support for voice services including Amazon Voice Services and the Google Assistant.

Extremely low power

SoC designed to support development of small form factor, richly-featured earbuds that can be used all day, with up to 10 hours of play from a 65mHA battery.

High quality wireless audio

Qualcomm® aptX™ Audio, aptX HD, and aptX Adaptive technologies are designed to deliver consistent, high quality audio streaming over Bluetooth.

QCC5127 Block Diagram

Features

  • Extremely low power design

  • Bluetooth 5 radio

  • 2Mbps Bluetooth low energy (LE) support

  • Ultra-small form factor

  • Powerful quad-core processor architecture

  • Dual core 32-bit processor application subsystem

  • Dual core Qualcomm® Kalimba™ DSP Audio subsystem

  • Embedded ROM + RAM and external Q-SPI Flash

  • Integrated PSRAM for audio buffering

  • 2-ch 98dBA headset class D

  • High performance low power audio

  • 2-ch 99dBA line inputs (single ended)

  • 192kHz 24-bit I2S & SPDIF interfaces

  • Fully programmable digital ANC

  • Designed to support digital assistants, Push to Talk/Voice Activated

  • Flexible software platform with powerful new IDE support

  • Designed to support aptX, aptX HD and aptX Adaptive

  • Designed to support Qualcomm TrueWireless™ Stereo and Qualcomm TrueWireless Stereo Plus

  • Integrated battery charger supporting internal mode (up to 200 mA) and external mode (up to 1.8 A)

  • Designed for reduced eBoM through highly integrated SoC design

Specifications

CPU

CPU Clock Speed: Up to 80 MHz

CPU Features: Programmable Apps CPU

CPU Architecture: 32-bit

DSP

DSP RAM: 80kB ( P ) + 256kB ( D )

DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP

DSP Clock Speed: 1x 120 MHz DSP

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbps

Voice Services

Digital Assistant Activation: Button press, Qualcomm® Voice Activation

General Audio

Audio Technology: Qualcomm TrueWireless™ Stereo technology, Qualcomm TrueWireless™ Stereo Plus technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD, Qualcomm® aptX™ Adaptive

Voice Services Support: Amazon Alexa Voice Service, Google Assistant

Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Feedforward

Qualcomm® cVc™ noise cancellation technology: 2-mic Headset, 2-mic Speaker, 1-mic Speaker, 1-mic Headset

Audio Playback

Channel output: Stereo

Power Consumption

Amperage: ~10mA HFP Narrow Band, 1 Digital MIC cVc, ~10mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load

Package

Package Type: BGA

Pins: 124 pins

Pitch: 0.5mm Pitch

Package Size: 6.5 x 6.5 x 1 mm

  1. Requires external PSRAM

License Keys: Qualcomm® cVc™ noise suppression technology, Qualcomm® aptX™ audio technology, Qualcomm® Active Noise Cancellation (ANC) technology and Qualcomm® Voice Activation require a software license agreement.

Qualcomm aptX, Qualcomm Active Noise Cancelling, Qualcomm Broadcast Audio, Qualcomm cVc, Qualcomm TrueWireless, and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Chipset
DSP TechnologyDSP Clock SpeedBluetooth VersionBluetooth TechnologyBluetooth SpeedDigital Assistant ActivationAudio TechnologyQualcomm® aptX™ audio playback supportQualcomm® Active Noise Cancelling (ANC) technologyAmperagePackage TypePitchPackage Size
1x Qualcomm® Kalimba™ DSP
Configurable DSP
1x 120 MHz DSP
Bluetooth 5.0
Bluetooth Low Energy sensor hub
Bluetooth Low Energy
Dual-mode Bluetooth
2 Mbps
Button press
Qualcomm® Voice Activation 1
Qualcomm TrueWireless™ Stereo technology
Qualcomm TrueWireless™ Stereo Plus technology
Qualcomm® Active Noise Cancellation (ANC) technology
Qualcomm® Broadcast Audio technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
Qualcomm® aptX™ HD
Qualcomm® aptX™ Adaptive
Feedback
Feedforward
~10mA HFP Narrow Band, 1 Digital MIC cVc
~10mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
BGA
0.5mm Pitch
6.5 x 6.5 x 1 mm
2x Qualcomm® Kalimba™ DSP
Configurable DSP
2x 120 MHz DSP
Bluetooth 5.0
Bluetooth Low Energy sensor hub
Bluetooth Low Energy
Dual-mode Bluetooth
2 Mbps
Button press
Qualcomm TrueWireless™ Stereo technology
Qualcomm TrueWireless™ Stereo Plus technology
Qualcomm® Active Noise Cancellation (ANC) technology
Qualcomm® Broadcast Audio technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
Qualcomm® aptX™ HD
Qualcomm® aptX™ Adaptive
Feedback
Feedforward
Hybrid
~6mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
~7mA HFP Narrow Band, 1 Digital MIC cVc
WLCSP
0.4mm Pitch
3.98 x 4.02 x 0.5 mm
2x Qualcomm® Kalimba™ DSP
Configurable DSP
2x 120 MHz DSP
Bluetooth 5.0
Bluetooth Low Energy sensor hub
Bluetooth Low Energy
Dual-mode Bluetooth
2 Mbps
Button press
Qualcomm TrueWireless™ Stereo technology
Qualcomm TrueWireless™ Stereo Plus technology
Qualcomm® Active Noise Cancellation (ANC) technology
Qualcomm® Broadcast Audio technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
Qualcomm® aptX™ HD
Feedback
Feedforward
Hybrid
~6mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
~7mA HFP Narrow Band, 1 Digital MIC cVc
BGA
0.5mm Pitch
5.5 x 5.5 x 1 mm
1x Qualcomm® Kalimba™ DSP
Configurable DSP
1x 120 MHz DSP
Bluetooth 5.1
Bluetooth Low Energy sensor hub
Bluetooth Low Energy
Dual-mode Bluetooth
2 Mbps
Button press
Qualcomm TrueWireless™ Stereo technology
Qualcomm TrueWireless™ Stereo Plus technology
Qualcomm® Active Noise Cancellation (ANC) technology
Qualcomm® Broadcast Audio technology
Qualcomm® aptX™
Qualcomm® aptX™ HD
Qualcomm® aptX™ Adaptive
Feedback
Feedforward
~10mA HFP Narrow Band, 1 Digital MIC cVc
~10mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
BGA
0.5mm Pitch
5.5 x 5.5 x 1 mm
1x Qualcomm® Kalimba™ DSP
Configurable DSP
1x 120 MHz DSP
Bluetooth 5.0
Bluetooth Low Energy sensor hub
Bluetooth Low Energy
Dual-mode Bluetooth
2 Mbps
Button press
Qualcomm® Voice Activation
Qualcomm TrueWireless™ Stereo technology
Qualcomm TrueWireless™ Stereo Plus technology
Qualcomm® Active Noise Cancellation (ANC) technology
Qualcomm® Broadcast Audio technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
Qualcomm® aptX™ HD
Qualcomm® aptX™ Adaptive
Feedback
Feedforward
~10mA HFP Narrow Band, 1 Digital MIC cVc
~10mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
BGA
0.5mm Pitch
5.5 x 5.5 x 1 mm
  1. Requires external PSRAM

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