QCC3XXX product family

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QCC3XXX Product Family

Entry-level, flash programmable audio platform

These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC3XXX family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products.

 

More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. The introduction of this platform means that consumers can benefit from technologies like Qualcomm® aptX™ audio in lower cost Qualcomm TrueWireless™ Stereo headsets. We are helping our customers to offer a wider range of what were once premium features at a highly competitive price point, which also can expand the overall industry and potential unit sales.

Bluetooth Headset Specs

SpecsQCC3001QCC3002
Bluetooth Version

Bluetooth 5.0

Bluetooth 5.0

Bluetooth Technology

Dual-mode Bluetooth

Dual-mode Bluetooth

Bluetooth Profiles

HFP v1.7

A2DP v1.3

AVRCPv1.5

HFP v1.7

A2DP v1.3

AVRCPv1.5

Audio Technology

Qualcomm® cVc™ audio technology

Qualcomm TrueWireless™ Technology

Qualcomm® aptX™ codec technology

Qualcomm® cVc™ audio technology

Qualcomm TrueWireless™ Technology

Qualcomm® aptX™ playback supportN/A

aptX Classic

Channel Output

Mono

Mono

DSP Technology

Qualcomm® Kalimba™ DSP

Qualcomm® Kalimba™ DSP

MCU Clock Speed

80MHz

80MHz

Package Type

WLCSP

BGA

WLCSP

BGA

Pitch

0.5mm

0.5mm

Package Size

3.9 x 3.6 x 0.6mm

5.5 x 5.5 x 1 mm

3.9 x 3.6 x 0.6mm

5.5 x 5.5 x 1 mm

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  1. WLCSP
  2. BGA
  3. WLCSP
  4. BGA
SpecsQCC3003QCC3004QCC3005
Bluetooth Version

Bluetooth 5.0

Bluetooth 5.0

Bluetooth 5.0

Bluetooth Technology

Dual-mode Bluetooth

Dual-mode Bluetooth

Dual-mode Bluetooth

Bluetooth Profiles

HFP v1.7

A2DP v1.3

AVRCPv1.5

HFP v1.7

A2DP v1.3

AVRCPv1.5

HFP v1.7

A2DP v1.3

AVRCPv1.5

Audio Technology

Qualcomm® cVc™ audio technology

Qualcomm® cVc™ audio technology

Qualcomm® aptX™ codec technology

Qualcomm® cVc™ audio technology

Digital Microphone Input

1 digital mic

2 digital mics

2 digital mics

Channel Output

Stereo

Stereo

Stereo

DSP Technology

Qualcomm® Kalimba™ DSP

Qualcomm® Kalimba™ DSP

Qualcomm® Kalimba™ DSP

MCU Clock Speed

80MHz

80MHz

80MHz

Flash

Up to 64 MB external flash

Up to 64 MB external flash

Up to 64 MB external flash

Package Type

QFN

BGA

QFN

BGA

QFN

BGA

Pitch

0.4mm

0.5mm

0.4mm

0.5mm

0.4mm

0.5mm

Package Size

6.0 x 6.0 x 0.6mm

5.5 x 5.5 x 1 mm

6.0 x 6.0 x 0.6mm

5.5 x 5.5 x 1 mm

6.0 x 6.0 x 0.6mm

5.5 x 5.5 x 1 mm

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  1. QFN
  2. BGA
  3. QFN
  4. BGA
  5. QFN
  6. BGA
  7. QFN
  8. BGA
  9. QFN
  10. BGA
  11. QFN
  12. BGA

Bluetooth Speaker Specs

SpecsQCC3006QCC3007QCC3008
Bluetooth Version

Bluetooth 5.0

Bluetooth 5.0

Bluetooth 5.0

Bluetooth Technology

Dual-mode Bluetooth

Dual-mode Bluetooth

Dual-mode Bluetooth

Bluetooth Profiles

HFP v1.7

A2DP v1.3

AVRCPv1.5

HFP v1.7

A2DP v1.3

AVRCPv1.5

HFP v1.7

A2DP v1.3

AVRCPv1.5

Audio Technology

Qualcomm® cVc™ audio technology

Qualcomm TrueWireless™ Technology

Qualcomm® cVc™ audio technology

Qualcomm TrueWireless™ Technology

Qualcomm® aptX™ codec technology

Qualcomm® cVc™ audio technology

Qualcomm TrueWireless™ Technology

Qualcomm® aptX™ playback supportN/AN/A

aptX Classic

Channel Output

Mono

Stereo

Stereo

DSP Technology

Qualcomm® Kalimba™ DSP

Qualcomm® Kalimba™ DSP

Qualcomm® Kalimba™ DSP

MCU Clock Speed

80MHz

80MHz

80MHz

Package Type

QFN

QFN

QFN

Pitch

0.4mm

0.4mm

0.4mm

Package Size

8 x 8 x 0.9 mm

8 x 8 x 0.9 mm

8 x 8 x 0.9 mm

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