Extremely low-power Bluetooth Audio SoC in a WLCSP package, designed for premium audio feature differentiation in truly wireless earbuds at a range of tiers.
Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. QCC3056 is designed specifically to help manufacturers to ....
Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. QCC3056 is designed specifically to help manufacturers to ....
Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. QCC3056 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and supporting our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbu....
Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. QCC3056 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and supporting our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category. Additionally, the QCC3056 is designed to support the forthcoming Bluetooth Low Energy Audio standard, and helps early-adopting OEMs to develop truly wireless earbuds wi....
Qualcomm QCC3056 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
*Battery life varies significantly with settings, usage, and other factors.
Innovative Qualcomm TrueWireless™ Mirroring technology is designed to deliver a superior user experience by improving robustness and supporting dynamic and seamless bud-to-bud role-swapping with Bluetooth address handover even during run time. True Wireless Mirroring also supports balancing out power distribution between both earbuds.
Differentiate at a range of consumer price points with increased choice from Qualcomm’s portfolio of our licensable audio technologies, including Voice service support with Always-on Wakeup Word activation or button press activation, Qualcomm® Adaptive Active Noise Cancellation, aptX™ Adaptive at up to 96Khz audio resolution, Qualcomm® aptX™ Voice, and Qualcomm® cVc™ Echo Cancellation and Noise Suppression.
Designed to support the forthcoming LE Audio standard and new user experiences with end-to-end operability from smartphone to earbuds. This SoC is designed to help early-adopting manufacturers develop truly wireless earbuds that deliver the audio sharing use cases supported by the exciting LE Audio standard.
Extremely low-power performance
Designed to support forthcoming Bluetooth LE Audio standard
Bluetooth 5.2 radio
Ultra-small form factor
Powerful quad-core processor architecture – designed to support complex use cases
Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience
Designed to support wake word and button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
Support for Google Fast Pair
Software architecture compatible with Qualcomm® QCC302x and QCC304x series
Embedded ROM + RAM and external Q-SPI Flash
Connectivity to external SRAM or 2nd Flash Device
High-performance audio combined with low-power consumption
1-ch 99.3dBA Class-D
1-ch 101dBA Class-AB
Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid – and Qualcomm® Adaptive Active Noise Cancellation
Bluetooth
Bluetooth Version: Bluetooth 5.2 Qualified
Bluetooth Technology: BR, EDR, Bluetooth Low Energy, Dual-mode Bluetooth
Bluetooth Speed: 2 Mbps, 3 Mbps
CPU
CPU Clock Speed: Up to 80 MHz
CPU Features: Programmable Apps CPU
CPU Architecture: 32-bit
DSP
DSP RAM: 112kB ( P ) + 448kB ( D )
DSP Technology: 2x Qualcomm® Kalimba™ DSP
DSP Clock Speed: 2x 120 MHz DSP
Support for Voice Services
Digital Assistant Activation: Button press, Always on voice wake-word support
General Audio
Audio Technology: Qualcomm TrueWireless™ Mirroring technology, Qualcomm® Adaptive Active Noise Cancellation, Qualcomm® cVc™ Echo Cancellation and Noise Suppression, Qualcomm® Active Noise Cancellation, Qualcomm® aptX™ audio technology
Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive
Voice Services Support: Amazon Alexa Voice Service, Google Assistant (and others)
Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Adaptive, Feedforward, Hybrid
Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-mic Headset, 1-mic Headset
Audio Playback
Channel output: Mono
Audio outputs: 1-ch 99dBA Class-D headset
Power Consumption
Amperage: <5 mA
Memory
Memory Type: External Flash
Interface
Supported Interfaces: 24-bit audio interfaces
Package
Package Type: WLCSP
Pins: 94 pins
Pitch: 0.4mm Pitch
Package Size: 4.38 x 4.26 x 0.4mm
Voice & Music Applications | Bluetooth Version | DSP Clock Speed | Digital Assistant Activation | Qualcomm® aptX™ audio playback support | Qualcomm® Active Noise Cancelling (ANC) technology | Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology | Package Type | Package Size |
---|---|---|---|---|---|---|---|---|
Truly Wireless Earbuds | Bluetooth 5.2 Qualified | 1x 120 MHz DSP | Button press 1 | Qualcomm® aptX™ | Feedback Feedforward Hybrid | 2-mic Headset 1-mic Headset | WLCSP | 4.38 x 4.26 x 0.4mm |
Truly Wireless Earbuds | Bluetooth 5.2 Qualified | 2x 120 MHz DSP | Always on voice wake-word support Button press | Qualcomm® aptX™ Voice Qualcomm® aptX™ Adaptive | Adaptive Feedback Feedforward Hybrid | 2-mic Headset 1-mic Headset | WLCSP | 4.38 x 4.26 x 0.4mm |
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