QCC3050

QCC3050

Extremely low-power Bluetooth Audio SoC in a BGA package with stacked Flash memory, designed for premium audio feature differentiation in truly wireless earbuds at price-challenged tiers.

Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 i....

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Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 i....

more

Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and support for our premium audio technologies in the very....

more

Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and support for our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category. Additionally, the QCC3050 is designed to support the forthcoming Bluetooth Low Energy Audio standard, and helps early-....

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Qualcomm QCC3050 and Qualcomm Snapdragon Sound are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

*Battery life varies significantly with settings, usage, and other factors.

Product license agreement

Qualcomm TrueWireless Mirroring

Innovative Qualcomm TrueWireless™ Mirroring technology is designed to deliver a superior user experience by improving robustness and supporting dynamic and virtually seamless bud-to-bud role-swapping with Bluetooth address handover even during run time. Qualcomm TrueWireless Mirroring also supports balancing out power distribution between both earbuds.

Wide range of differentiating audio features

Differentiate at a range of consumer price points with increased choice from our portfolio of audio technologies our licensable audio technologies, including voice service support with Always-on Wakeup Word activation or button press activation, Qualcomm® Adaptive Active Noise Cancellation, Qualcomm(R) aptX(TM) Adaptive Audio, Adaptive for up to 96Khz audio resolution, aptX™ Voice, and Qualcomm® cVc™ Echo Cancellation and Noise Suppression.

Support for Bluetooth Low Energy Audio

Designed to support the forthcoming LE Audio standard and new user experiences with end-to-end operability from smartphone to earbuds. This SoC is designed to help early-adopting manufacturers develop truly wireless earbuds that deliver the audio sharing use cases supported by the exciting LE Audio standard.

QCC3050 Block Diagram

Features

  • Extremely low-power performance

  • Designed to support forthcoming Bluetooth LE Audio standard

  • Bluetooth 5.2 radio

  • Ultra-small form factor

  • Powerful quad-core processor architecture – designed to support complex use cases

    • Dual core 32-bit processor application subsystem (up to 80Mhz)
    • Dual core 120Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
  • Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience

  • Designed to support wake word and button activated digital assistants including Amazon Alexa Voice Service and Google Assistant

  • Support for Google Fast Pair

  • Software architecture compatible with Qualcomm® QCC302x and QCC304x series

  • Embedded ROM + RAM 

  • Integrated FLASH memory for application boot

  • High-performance audio combined with low-power consumption

    • Qualcomm® aptX™ Adaptive audio for consistent, high quality streaming over Bluetooth at up to 96Khz audio resolution
    • Qualcomm® aptX™ Voice for superior call quality on uplink and downlink
    • 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression
  • 1-ch 99.3dBA Class-D

  • 1-ch 101dBA Class-AB

  • Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid – and Qualcomm® Adaptive Active Noise Cancellation

Specifications

CPU

CPU Clock Speed: Up to 80 MHz

CPU Architecture: 32-bit

CPU Features: Programmable Apps CPU

DSP

DSP RAM: 112kB ( P ) + 448kB ( D )

DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP

DSP Clock Speed: 2x 120 MHz

Bluetooth

Bluetooth Specification Version: Bluetooth 5.2 Qualified

Bluetooth Features: Qualcomm TrueWireless™ Mirroring technology

Connection Technology: Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth Data Rate: 3 Mbps EDR, EDR, 1 Mbps BR, 2 Mbps EDR

Voice Services

Digital Assistant Activation: Always on voice wake-word support, Button press

Voice Services Ecosystems: Amazon Alexa Voice Service, Google Assistant and any others

Audio

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Audio, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive

Qualcomm® Active Noise Cancelling (ANC) technology: Adaptive, Feedback, Feedforward, Hybrid, Qualcomm® Active Noise Cancellation

Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-mic Headset, 1-mic Headset

Power Consumption

Amperage: <5 mA

Memory

Memory Type: 64Mbit (8Mbyte) integrated flash

Interfaces

Supported Interfaces: 24-bit audio interfaces

Audio Playback Interfaces

Channel output: Mono

Audio outputs: 1-ch 99dBA Class-D headset

Package

Package Type: BGA, Stacked-flash

Pins: 90 pins

Pitch: 0.5mm Pitch

Size: 5.6 x 5.9 x 1.0mm

    Qualcomm TrueWireless, Qualcomm aptX, Qualcomm cVc, Qualcomm Kalimba, Qualcomm ANC, Qualcomm QCC304X and Qualcomm QCC302x are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

    Compare related products.

    Product
    QCC3050
    QCC3056
    QCC5151
    Voice & Music ApplicationsBluetooth Specification VersionDSP Clock SpeedDigital Assistant ActivationQualcomm® aptX™ audio playback supportQualcomm® Active Noise Cancelling (ANC) technologyQualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technologyPackage TypeSize
    Bluetooth Stereo Headphones and Headsets
    Truly Wireless Earbuds
    Bluetooth 5.2 Qualified
    2x 120 MHz
    Always on voice wake-word support
    Button press
    Qualcomm® aptX™ Audio
    Qualcomm® aptX™ Voice
    Qualcomm® aptX™ Adaptive
    Adaptive
    Feedback
    Feedforward
    Hybrid
    Qualcomm® Active Noise Cancellation
    2-mic Headset
    1-mic Headset
    BGA
    Stacked-flash
    5.6 x 5.9 x 1.0mm
    Bluetooth Stereo Headphones and Headsets
    Truly Wireless Earbuds
    Bluetooth 5.2 Qualified
    2x 120 MHz
    Always on voice wake-word support
    Button press
    Qualcomm® aptX™ Audio
    Qualcomm® aptX™ Voice
    Qualcomm® aptX™ Adaptive
    Adaptive
    Feedback
    Feedforward
    Hybrid
    Qualcomm® Active Noise Cancellation
    2-mic Headset
    Qualcomm® cVc™ Echo Cancellation and Noise Suppression
    1-mic Headset
    WLCSP
    4.38 x 4.26 x 0.4mm
    Bluetooth Stereo Headphones and Headsets
    Truly Wireless Earbuds
    Bluetooth 5.2
    Bluetooth 5.2 Qualified
    2x 120 MHz
    Always on voice wake-word support
    Button press
    Qualcomm® aptX™ Audio
    Qualcomm® aptX™ Voice
    Qualcomm® aptX™ Adaptive
    Adaptive
    Feedback
    Feedforward
    Hybrid
    Qualcomm® Active Noise Cancellation
    2-mic Headset
    Qualcomm® cVc™ Echo Cancellation and Noise Suppression
    1-mic Headset
    WLCSP

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