QCC3046

QCC3046

Extremely low-power Bluetooth Audio SoC in a WLCSP package, designed for use in mid- to entry-level truly wireless earbuds.

Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust conn....

more

Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust conn....

more

Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.

As consumer demand for sm....

more

Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.

As consumer demand for smaller form factor devices continues to grow, QCC3046’s WLCSP package is designed to help manufacturers develop ultra-small earbuds that are comfortable enough to be worn all day.

Qualcomm QCC3046 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries

*Battery life varies significantly with settings, usage, and other factors.

Product license agreement

Integrated Qualcomm Active Noise Cancellation Technology

Our breakthrough ultra-low power ANC is designed to help provide high quality immersive experiences while at the same enabling natural leak-through of noise to allow for awareness of surroundings. Our ANC is totally integrated into this single-chip solution, helping to reduce the complexity, cost, and PCB space of adding ANC to earbuds and hearables by eliminating the need for a separate ANC chip.

Qualcomm TrueWireless™ Mirroring

Innovative new Qualcomm TrueWireless™ Mirroring technology is designed to further improve robustness and support dynamic and seamless bud-to-bud role-swapping with Bluetooth address handover even during run time while also balancing out power distribution between both earbuds.

Support for multiple voice ecosystems

The QCC5144 offers support for push button activated digital assistants, for multiple ecosystems. This helps OEMs to quickly, cost effectively and efficiently add voice assistant capability to mid and entry-level earbuds.

QCC3046 Block Diagram

Features

  • Extremely low-power performance

  • Bluetooth 5.2 radio

  • Ultra-small form factor

  • Powerful tri-core processor architecture – designed to support complex use cases

    • Dual core 32-bit processor application subsystem (up to 32Mhz)
    • Single core 120Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
  • Qualcomm TrueWireless Mirroring technology for improved robustness and seamless user experience

  • Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant

  • Support for Google Fast Pair

  • Software architecture compatible with Qualcomm® QCC302x Series

  • Embedded ROM + RAM and external Q-SPI Flash

  • Connectivity to external SRAM or 2nd Flash Device

  • High-performance audio combined with low-power consumption

    • Qualcomm® aptX™ audio for consistent, high quality streaming over Bluetooth
    • 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression with support for 1 mic and 2 mic configurations
  • 2-ch 98dBA headset class D should be 2-ch 99.3dBA headset class D

  • Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid

Specifications

CPU

CPU Clock Speed: Up to 32MHz

CPU Features: Programmable Apps CPU

CPU Architecture: 32-bit

DSP

DSP RAM: 112kB ( P ) + 448kB ( D )

DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP

DSP Clock Speed: 1x 120 MHz DSP

Bluetooth

Bluetooth Version: Bluetooth 5.2 Qualified

Bluetooth Technology: BR, EDR, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbps, 3 Mbps

Voice Services

Digital Assistant Activation: Button press

General Audio

Audio Technology: Qualcomm TrueWireless™ Mirroring technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™

Voice Services Support: Amazon Alexa Voice Service, Google Assistant (and others)

Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Feedforward, Hybrid

Qualcomm® cVc™ noise cancellation technology: 2-mic Headset, 1-mic Headset

Audio Playback

Channel output: Mono

Audio outputs: 1-ch 99dBA Class-D headset

Power Consumption

Amperage: <5 mA

Memory

Memory Type: External Flash

Interface

Supported Interfaces: 24-bit audio interfaces

Package

Package Type: WLCSP

Pins: 94 pins

Pitch: 0.4mm Pitch

Package Size: 4.38 x 4.26 x 0.4mm

  1. Bluetooth Low Energy 2 Mbps
  2. BR/EDR 3Mbps
  3. Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant

Qualcomm TrueWireless Mirroring, Qualcomm Kalimba, Qualcomm Active Noise Cancellation, Qualcomm FastConnect, Qualcomm aptX, and Qualcomm cVc are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Compare related products.

Product
QCC3046

QCC3046

Product Series
QCC3040
QCC3031
QCC3034
Voice & Music ApplicationsDSP Clock SpeedBluetooth VersionDigital Assistant ActivationQualcomm® aptX™ audio playback supportQualcomm® Active Noise Cancelling (ANC) technologyQualcomm® cVc™ noise cancellation technologyPackage TypePackage Size
1x 120 MHz DSP
Bluetooth 5.2 Qualified
Button press 1
Qualcomm® aptX™
Feedback
Feedforward
Hybrid
2-mic Headset
1-mic Headset
WLCSP
4.38 x 4.26 x 0.4mm
1x 120 MHz DSP
Bluetooth 5.2 Qualified
Button press 1
Qualcomm® aptX™
Feedback
Feedforward
Hybrid
2-mic Headset
1-mic Headset
BGA
Stacked-flash
5.6 x 5.9 x 1.0mm
Bluetooth Speakers
1x 120 MHz DSP
Bluetooth 5.0
Button press
Qualcomm® aptX™
Qualcomm® aptX™ HD
1-mic Speaker
QFN
8 x 8 x 0.85 mm
Headsets & Headphones
1x 120 MHz DSP
Bluetooth 5.0
Button press
Qualcomm® aptX™
Qualcomm® aptX™ HD
Up to 2-mic HS cVc
VFBGA
5.5 x 5.5 x 1 mm
  1. Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant

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