QCC3046
Extremely low-power Bluetooth Audio SoC in a WLCSP package, designed for use in mid- to entry-level truly wireless earbuds.
Extremely low-power Bluetooth Audio SoC in a WLCSP package, designed for use in mid- to entry-level truly wireless earbuds.
Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust conn....
Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust conn....
Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.
As consumer demand for sm....
Qualcomm® QCC3046 is optimized for use in earbuds and hearables, QCC3046 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.
As consumer demand for smaller form factor devices continues to grow, QCC3046’s WLCSP package is designed to help manufacturers develop ultra-small earbuds that are comfortable enough to be worn all day.
Qualcomm QCC3046 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries
*Battery life varies significantly with settings, usage, and other factors.
Integrated Qualcomm Active Noise Cancellation Technology
Our breakthrough ultra-low power ANC is designed to help provide high quality immersive experiences while at the same enabling natural leak-through of noise to allow for awareness of surroundings. Our ANC is totally integrated into this single-chip solution, helping to reduce the complexity, cost, and PCB space of adding ANC to earbuds and hearables by eliminating the need for a separate ANC chip.
Qualcomm TrueWireless™ Mirroring
Innovative new Qualcomm TrueWireless™ Mirroring technology is designed to further improve robustness and support dynamic and seamless bud-to-bud role-swapping with Bluetooth address handover even during run time while also balancing out power distribution between both earbuds.
Support for multiple voice ecosystems
The QCC5144 offers support for push button activated digital assistants, for multiple ecosystems. This helps OEMs to quickly, cost effectively and efficiently add voice assistant capability to mid and entry-level earbuds.
QCC3046 Block Diagram
Features
Extremely low-power performance
Bluetooth 5.2 radio
Ultra-small form factor
Powerful tri-core processor architecture – designed to support complex use cases
- Dual core 32-bit processor application subsystem (up to 32Mhz)
- Single core 120Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
Qualcomm TrueWireless Mirroring technology for improved robustness and seamless user experience
Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
Support for Google Fast Pair
Software architecture compatible with Qualcomm® QCC302x Series
Embedded ROM + RAM and external Q-SPI Flash
Connectivity to external SRAM or 2nd Flash Device
High-performance audio combined with low-power consumption
- Qualcomm® aptX™ audio for consistent, high quality streaming over Bluetooth
- 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression with support for 1 mic and 2 mic configurations
2-ch 98dBA headset class D should be 2-ch 99.3dBA headset class D
Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid
Specifications
CPU
CPU Clock Speed: Up to 32MHz
CPU Features: Programmable Apps CPU
CPU Architecture: 32-bit
DSP
DSP RAM: 112kB ( P ) + 448kB ( D )
DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP
DSP Clock Speed: 1x 120 MHz DSP
Bluetooth
Bluetooth Version: Bluetooth 5.2 Qualified
Bluetooth Technology: BR, EDR, Bluetooth Low Energy, Dual-mode Bluetooth
Bluetooth Speed: 2 Mbps, 3 Mbps
Voice Services
Digital Assistant Activation: Button press
General Audio
Audio Technology: Qualcomm TrueWireless™ Mirroring technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology
Qualcomm® aptX™ audio playback support: Qualcomm® aptX™
Voice Services Support: Amazon Alexa Voice Service, Google Assistant (and others)
Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Feedforward, Hybrid
Qualcomm® cVc™ noise cancellation technology: 2-mic Headset, 1-mic Headset
Audio Playback
Channel output: Mono
Audio outputs: 1-ch 99dBA Class-D headset
Power Consumption
Amperage: <5 mA
Memory
Memory Type: External Flash
Interface
Supported Interfaces: 24-bit audio interfaces
Package
Package Type: WLCSP
Pins: 94 pins
Pitch: 0.4mm Pitch
Package Size: 4.38 x 4.26 x 0.4mm
- Bluetooth Low Energy 2 Mbps
- BR/EDR 3Mbps
- Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
Qualcomm TrueWireless Mirroring, Qualcomm Kalimba, Qualcomm Active Noise Cancellation, Qualcomm FastConnect, Qualcomm aptX, and Qualcomm cVc are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Compare related products.
| Voice & Music Applications | DSP Clock Speed | Bluetooth Version | Digital Assistant Activation | Qualcomm® aptX™ audio playback support | Qualcomm® Active Noise Cancelling (ANC) technology | Qualcomm® cVc™ noise cancellation technology | Package Type | Package Size |
|---|---|---|---|---|---|---|---|---|
| — | 1x 120 MHz DSP | Bluetooth 5.2 Qualified | Button press 1 | Qualcomm® aptX™ | Feedback Feedforward Hybrid | 2-mic Headset 1-mic Headset | WLCSP | 4.38 x 4.26 x 0.4mm |
| — | 1x 120 MHz DSP | Bluetooth 5.2 Qualified | Button press 1 | Qualcomm® aptX™ | Feedback Feedforward Hybrid | 2-mic Headset 1-mic Headset | BGA Stacked-flash | 5.6 x 5.9 x 1.0mm |
Bluetooth Speakers | 1x 120 MHz DSP | Bluetooth 5.0 | Button press | Qualcomm® aptX™ Qualcomm® aptX™ HD | — | 1-mic Speaker | QFN | 8 x 8 x 0.85 mm |
Headsets & Headphones | 1x 120 MHz DSP | Bluetooth 5.0 | Button press | Qualcomm® aptX™ Qualcomm® aptX™ HD | — | Up to 2-mic HS cVc | VFBGA | 5.5 x 5.5 x 1 mm |
- Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
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