QCC3024
Entry-Level Flash Low-Power Bluetooth Audio SoC
Entry-Level Flash Low-Power Bluetooth Audio SoC
The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.
The QCC3024 is available in a VFBGA pa....
The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.
The QCC3024 is available in a VFBGA pa....
The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.
The QCC3024 is available in a VFBGA package and is designed to help customers reduce development time and cost when developing Bluetooth Stereo Headsets.
The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.
The QCC3024 is available in a VFBGA package and is designed to help customers reduce development time and cost when developing Bluetooth Stereo Headsets.
Qualcomm QCC3024 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.
Powerful tri-core processing designed to support flexible innovation
The QCC3024 embeds a tri-core processing architecture, consisting in a pair of programmable dedicated 32-bit application processors and a single, configurable, Qualcomm® Kalimba™ DSP audio subsystem.
Advanced array of audio technologies
The QCC3024 is designed to help create consistent, high-quality audio streaming over Bluetooth, as well as Qualcomm® cVc™ Noise Cancellation Technology to help suppress background noise and echo feedback for a quieter and more seamless user experience.
Digital Assistant ready
The QCC3024 supports voice services via button-press activation. This feature is designed to relay the audio stream and voice control capabilities to a handset to process and execute commands.
Extremely low-power
Bluetooth Stereo Headsets using QCC3024 can extend their battery life by up to approximately three times more than similar headsets using our previous generation ROM products.
Advanced development tools
The QCC3024 is designed to support freedom and flexibility for innovation. A new feature rich audio development kit (ADK) and enhanced development tools are designed to help reduce time needed for integration and commercialization.
QCC3024 Block Diagram
Features
Bluetooth Low Energy 5.0
Extremely low-power audio DSP with on-chip ROM and RAM
High-performance 24-bit stereo audio interface
Digital and analog microphone interfaces
Flexible PIO controller and LED pins with PWM support
Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger
SBC and AAC audio codec support
Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
90-ball 5.5 x 5.5 x 1.0 mm, 0.5 mm pitch VFBGA
Single ended antenna connection with on-chip balun and Tx/Rx switch
Bluetooth, Bluetooth low energy, and mixed topologies supported
32-bit Firmware Processor, reserved for system use, runs Bluetooth upper stack, profiles, house-keeping code
On-chip caches per core allow for optimized performance and power consumption
32-bit Kalimba audio digital signal processor (DSP) core with flexible clocking from 2 MHz to 120 MHz to allow optimization and trade-off performance vs. power consumption
Both analog-to-digital converter (ADC)s and digital-to analog converter (DAC)s support sample rates of 8, 16, 32, 44.1, 48, 96 kHz. DACs also support 192 kHz.
Specifications
CPU
CPU Clock Speed: Up to 32MHz
CPU Features: Programmable Apps CPU
CPU Architecture: 32-bit
DSP
DSP RAM: 80kB ( P ) + 256kB ( D )
DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP
DSP Clock Speed: 1x 120 MHz DSP
Bluetooth
Bluetooth Version: Bluetooth 5.0
Bluetooth Technology: Bluetooth Low Energy sensor hub, Dual-mode Bluetooth
Bluetooth Speed: 2 Mbps
Support for Voice Services
Digital Assistant Activation: Button press
General Audio
Audio Technology: Qualcomm® Broadcast Audio technology, Qualcomm® cVc™ audio technology
Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: Up to 2-mic Headset cVc
Audio Playback
Channel output: Stereo
Power Consumption
Amperage: <6 mA
Interface
Supported Interfaces: I²S, QSPI flash, I²C, SPI, UART
Package
Package Type: VFBGA
Pins: 90 pins
Pitch: 0.5mm Pitch
Qualcomm Kalimba, Qualcomm cVc and Qualcomm Broadcast Audio are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Compare related products.
| DSP Technology | DSP Clock Speed | Bluetooth Version | Bluetooth Technology | Bluetooth Speed | Digital Assistant Activation | Audio Technology | Qualcomm® aptX™ audio playback support | Channel output | Amperage | Package Type | Package Size |
|---|---|---|---|---|---|---|---|---|---|---|---|
1x Qualcomm® Kalimba™ DSP Configurable DSP | 1x 120 MHz DSP | Bluetooth 5.0 | Bluetooth Low Energy sensor hub Dual-mode Bluetooth | 2 Mbps | Button press | Qualcomm® Broadcast Audio technology Qualcomm® cVc™ audio technology | — | Stereo | <6 mA | VFBGA | — |
Qualcomm® Kalimba™ DSP | — | Bluetooth 5.0 | Dual-mode Bluetooth | — | — | Qualcomm® cVc™ audio technology | — | Stereo | — | BGA QFN | 5.5 x 5.5 x 1 mm 1 6.0 x 6.0 x 0.6mm 2 |
Qualcomm® Kalimba™ DSP | — | Bluetooth 5.0 | Dual-mode Bluetooth | — | — | Qualcomm® cVc™ audio technology | — | Stereo | — | BGA QFN | 5.5 x 5.5 x 1 mm 1 6.0 x 6.0 x 0.6mm 2 |
Qualcomm® Kalimba™ DSP | — | Bluetooth 5.0 | Dual-mode Bluetooth | — | — | Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology | Qualcomm® aptX™ | Stereo | — | BGA QFN | 5.5 x 5.5 x 1 mm 1 6.0 x 6.0 x 0.6mm 2 |
- BGA
- QFN
Development tools and purchase options.
DB-QCC3024-VFBGA90-A-0 BY QUALCOMM
Development Board / Kit
DK-QCC3024-VFBGA90-A-0 BY QUALCOMM
Development Board / Kit
Access more.
©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.