QCC3024

QCC3024

Entry-Level Flash Low-Power Bluetooth Audio SoC

Qualcomm QCC3024 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Product Brief

Powerful tri-core processing designed to support flexible innovation

The QCC3024 embeds a tri-core processing architecture, consisting in a pair of programmable dedicated 32-bit application processors and a single, configurable, Qualcomm® Kalimba™ DSP audio subsystem.

Advanced array of audio technologies

The QCC3024 is designed to help create consistent, high-quality audio streaming over Bluetooth, as well as Qualcomm® cVc™ Noise Cancellation Technology to help suppress background noise and echo feedback for a quieter and more seamless user experience.

Digital Assistant ready

The QCC3024 supports voice services via button-press activation. This feature is designed to relay the audio stream and voice control capabilities to a handset to process and execute commands.

Extremely low-power

Bluetooth Stereo Headsets using QCC3024 can extend their battery life by up to approximately three times more than similar headsets using our previous generation ROM products.

Advanced development tools

The QCC3024 is designed to support freedom and flexibility for innovation. A new feature rich audio development kit (ADK) and enhanced development tools are designed to help reduce time needed for integration and commercialization.

QCC3024 Block Diagram

Features

  • Bluetooth Low Energy 5.0

  • Extremely low-power audio DSP with on-chip ROM and RAM

  • High-performance 24-bit stereo audio interface

  • Digital and analog microphone interfaces

  • Flexible PIO controller and LED pins with PWM support

  • Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger

  • SBC and AAC audio codec support

  • Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0

  • 90-ball 5.5 x 5.5 x 1.0 mm, 0.5 mm pitch VFBGA

  • Single ended antenna connection with on-chip balun and Tx/Rx switch

  • Bluetooth, Bluetooth low energy, and mixed topologies supported

  • 32-bit Firmware Processor, reserved for system use, runs Bluetooth upper stack, profiles, house-keeping code

  • On-chip caches per core allow for optimized performance and power consumption

  • 32-bit Kalimba audio digital signal processor (DSP) core with flexible clocking from 2 MHz to 120 MHz to allow optimization and trade-off performance vs. power consumption

  • Both analog-to-digital converter (ADC)s and digital-to analog converter (DAC)s support sample rates of 8, 16, 32, 44.1, 48, 96 kHz. DACs also support 192 kHz.

Specifications

CPU

CPU Clock Speed: Up to 32MHz

CPU Features: Programmable Apps CPU

CPU Architecture: 32-bit

DSP

DSP RAM: 80kB (P) + 256kB (D)

DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP

DSP Clock Speed: 1x 120 MHz DSP

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbps

Voice Services

Digital Assistant Activation: Button press

General Audio

Audio Technology: Qualcomm® Broadcast Audio technology, Qualcomm® cVc™ audio technology

Audio Playback Support: Stereo playback

Qualcomm® cVc™ noise cancellation technology: Up to 2-mic HS cVc

Power Consumption

Amperage: <6 mA

Interface

Supported Interfaces: I²S, QSPI flash, I²C, SPI, UART

Package

Package Type: VFBGA

Pins: 90 pins

Pitch: 0.5mm Pitch

    Qualcomm Kalimba, Qualcomm cVc and Qualcomm Broadcast Audio are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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    DSP TechnologyDSP Clock SpeedBluetooth VersionBluetooth TechnologyBluetooth SpeedDigital Assistant ActivationAudio TechnologyQualcomm® aptX™ audio playback supportAudio Playback SupportAmperagePackage TypePackage Size
    1x Qualcomm® Kalimba™ DSP
    Configurable DSP
    1x 120 MHz DSP
    Bluetooth 5.0
    Bluetooth Low Energy sensor hub
    Dual-mode Bluetooth
    2 Mbps
    Button press
    Qualcomm® Broadcast Audio technology
    Qualcomm® cVc™ audio technology
    Stereo playback
    <6 mA
    VFBGA
    Qualcomm® Kalimba™ DSP
    Bluetooth 5.0
    Dual-mode Bluetooth
    Qualcomm® cVc™ audio technology
    BGA
    QFN
    5.5 x 5.5 x 1 mm 1
    6.0 x 6.0 x 0.6mm 2
    Qualcomm® Kalimba™ DSP
    Bluetooth 5.0
    Dual-mode Bluetooth
    Qualcomm® cVc™ audio technology
    BGA
    QFN
    5.5 x 5.5 x 1 mm 1
    6.0 x 6.0 x 0.6mm 2
    Qualcomm® Kalimba™ DSP
    Bluetooth 5.0
    Dual-mode Bluetooth
    Qualcomm® aptX™ audio technology
    Qualcomm® cVc™ audio technology
    Qualcomm® aptX™
    BGA
    QFN
    5.5 x 5.5 x 1 mm 1
    6.0 x 6.0 x 0.6mm 2
    1x Qualcomm® Kalimba™ DSP
    Configurable DSP
    1x 120 MHz DSP
    Bluetooth 5.0
    Bluetooth Low Energy sensor hub
    Dual-mode Bluetooth
    2 Mbps
    Button press
    Qualcomm® Broadcast Audio technology
    Qualcomm® aptX™ audio technology
    Qualcomm® cVc™ audio technology
    Qualcomm® aptX™ HD
    Qualcomm® aptX™
    Stereo playback
    <6 mA
    VFBGA
    5.5 x 5.5 x 1 mm
    1. BGA
    2. QFN

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    Review details for the QCC30xx Series.