QCC300x

QCC300X Series

Entry-level, flash programmable audio platform

These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically b....

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These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically b....

more

These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC300X family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QC....

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These devices are designed to support a rich set of features, use cases and customization, which can allow OEMs to develop unique products for industries which have not typically been associated with fixed function ROM devices. The QCC300X family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bl....

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QCC300x, Qualcomm cVc, Qualcomm aptX, Qualcomm Kalimba, and Qualcomm TrueWireless are products of Qualcomm Technologies International, Ltd.

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Product Brief

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Chipset
Voice & Music ApplicationsDSP TechnologyMCU Clock SpeedBluetooth VersionBluetooth TechnologyBluetooth ProfilesAudio TechnologyQualcomm® aptX™ audio playback supportPackage TypePackage Size
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm TrueWireless™ Technology
Qualcomm® cVc™ audio technology
BGA
WLCSP
3.9 x 3.6 x 0.6 mm 1
5.5 x 5.5 x 1 mm 2
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm TrueWireless™ Technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
BGA
WLCSP
3.9 x 3.6 x 0.6 mm 1
5.5 x 5.5 x 1 mm 2
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm® cVc™ audio technology
BGA
QFN
5.5 x 5.5 x 1 mm
6.0 x 6.0 x 0.6mm
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm® cVc™ audio technology
BGA
QFN
5.5 x 5.5 x 1 mm 2
6.0 x 6.0 x 0.6mm 3
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
BGA
QFN
5.5 x 5.5 x 1 mm 2
6.0 x 6.0 x 0.6mm 3
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm TrueWireless™ Technology
Qualcomm® cVc™ audio technology
QFN
8 x 8 x 0.9 mm
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm TrueWireless™ Technology
Qualcomm® cVc™ audio technology
QFN
8 x 8 x 0.9 mm
Headsets & Headphones
Qualcomm® Kalimba™ DSP
80MHz MCU
Bluetooth 5.0
Dual-mode Bluetooth
AVRCPv1.5
A2DP v1.3
HFP v1.7
Qualcomm TrueWireless™ Technology
Qualcomm® aptX™ audio technology
Qualcomm® cVc™ audio technology
Qualcomm® aptX™
QFN
8 x 8 x 0.9 mm
  1. WLCSP
  2. BGA
  3. QFN

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