QCC3008

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Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.

The QCC3008 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with....

The QCC3008 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.

The QCC3008 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to....

The QCC3008 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.

A single-chip dual-mode Bluetooth 5 system, QCC3008 SoC features 8th generation Qu....

QCC3008, Qualcomm cVc, Qualcomm TrueWireless, Qualcomm aptX and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Cost-effective, single-chip flash programmable platform solution

QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs.

Support for Over-the-Air updates

Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory.

8th generation cVc noise cancellation technology

cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices.

QCC3008 Block Diagram

Features

Dual-mode Bluetooth 5 qualified radio
Variants designed to address both headsets/headphones and speaker applications
Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution
Customizable application code
Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
A rich set of features, use cases and programmability at more cost-effective price points
Pin compatible with CSRA64xxx family of products
Integrated Qualcomm TrueWireless Stereo technology
Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
SBC and AAC codecs
Promotes reduced development time with support of application image and source code, IDE and configuration
Updated Generic Application Interface Architecture (GAIA) protocol v3

Specifications

DSP

DSP Technology: Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed: 80MHz MCU

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Dual-mode Bluetooth

Bluetooth Profiles: AVRCPv1.5, A2DP v1.3, HFP v1.7

General Audio

Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™

Audio Playback

Channel output: Stereo

Audio Recording

Microphone: 1 digital mic

Memory

Flash: Up to 64 MB external flash

Interface

Supported Interfaces: I²S, SPDIF, USB 2.0, USB 3.0

Package

Package Type: QFN

Pitch: 0.4mm Pitch

Package Size: 8 x 8 x 0.9 mm

Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Compare related products.

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QCC3007 Chipset
QCC3008 Chipset

DSP Technology	MCU Clock Speed	Bluetooth Version	Bluetooth Technology	Bluetooth Profiles	Audio Technology	Channel output	Package Type
Qualcomm® Kalimba™ DSP	80MHz MCU	Bluetooth 5.0	Dual-mode Bluetooth	AVRCPv1.5 A2DP v1.3 HFP v1.7	Qualcomm TrueWireless™ Technology Qualcomm® cVc™ audio technology	Mono	QFN
Qualcomm® Kalimba™ DSP	80MHz MCU	Bluetooth 5.0	Dual-mode Bluetooth	AVRCPv1.5 A2DP v1.3 HFP v1.7	Qualcomm TrueWireless™ Technology Qualcomm® cVc™ audio technology	Stereo	QFN
Qualcomm® Kalimba™ DSP	80MHz MCU	Bluetooth 5.0	Dual-mode Bluetooth	AVRCPv1.5 A2DP v1.3 HFP v1.7	Qualcomm TrueWireless™ Technology Qualcomm® aptX™ audio technology Qualcomm® cVc™ audio technology	Stereo	QFN

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