QCC3006

QCC3006

Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.

The QCC3006 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with....

more

The QCC3006 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with....

more

The QCC3006 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.

The QCC3006 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to....

more

The QCC3006 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.

The QCC3006 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.

A single-chip dual-mode Bluetooth 5 system, QCC3006 SoC features 8th generation Qu....

more

QCC3006, Qualcomm cVc, Qualcomm TrueWireless and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Cost-effective, single-chip flash programmable platform solution

QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs.

Support for Over-the-Air updates

Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory.

8th generation cVc noise cancellation technology

cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices.

QCC3006 Block Diagram

Features

  • Dual-mode Bluetooth 5 qualified radio

  • Variants designed to address both headsets/headphones and speaker applications

  • Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution

  • Customizable application code

  • Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology

  • A rich set of features, use cases and programmability at more cost-effective price points

  • Pin compatible with CSRA63xxx and CSRA64xxx family of products

  • Supports OTA updates

  • Integrated Qualcomm TrueWireless Stereo technology

  • Qualcomm® meloD™ Expansion audio processing: 3D stereo widening

  • SBC and AAC codecs

  • Promotes reduced development time with support of application image and source code, IDE and configuration

  • Updated Generic Application Interface Architecture (GAIA) protocol v3

Specifications

DSP

DSP Technology: Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed: 80MHz MCU

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Dual-mode Bluetooth

Bluetooth Profiles: AVRCPv1.5, A2DP v1.3, HFP v1.7

General Audio

Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® cVc™ audio technology

Audio Playback

Channel output: Mono

Audio Recording

Microphone: 1 digital mic

Memory

Flash: Up to 64 MB external flash

Interface

Supported Interfaces: I²S, SPDIF, USB 2.0, USB 3.0

Package

Package Type: QFN

Pitch: 0.4mm Pitch

Package Size: 8 x 8 x 0.9 mm

    Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

    Compare related products.

    Product
    QCC3006

    QCC3006

    Chipset
    QCC3007

    QCC3007

    Chipset
    QCC3008

    QCC3008

    Chipset
    DSP TechnologyMCU Clock SpeedBluetooth VersionBluetooth TechnologyBluetooth ProfilesAudio TechnologyChannel outputPackage Type
    Qualcomm® Kalimba™ DSP
    80MHz MCU
    Bluetooth 5.0
    Dual-mode Bluetooth
    AVRCPv1.5
    A2DP v1.3
    HFP v1.7
    Qualcomm TrueWireless™ Technology
    Qualcomm® cVc™ audio technology
    Mono
    QFN
    Qualcomm® Kalimba™ DSP
    80MHz MCU
    Bluetooth 5.0
    Dual-mode Bluetooth
    AVRCPv1.5
    A2DP v1.3
    HFP v1.7
    Qualcomm TrueWireless™ Technology
    Qualcomm® cVc™ audio technology
    Stereo
    QFN
    Qualcomm® Kalimba™ DSP
    80MHz MCU
    Bluetooth 5.0
    Dual-mode Bluetooth
    AVRCPv1.5
    A2DP v1.3
    HFP v1.7
    Qualcomm TrueWireless™ Technology
    Qualcomm® aptX™ audio technology
    Qualcomm® cVc™ audio technology
    Stereo
    QFN

      Access more.

      To access more QCC3006 resources, you need to be a member of a verified company. Company verification is initiated by filling out our access request form.
      Already have a Qualcomm account?

      ©2020 Qualcomm Technologies, Inc. and/or its affiliated companies.

      References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

      Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

      Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

      Nothing in these materials is an offer to sell any of the components or devices referenced herein.