QCC3003
Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.
Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.
The QCC3003 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with....
The QCC3003 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with....
The QCC3003 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3003 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to....
The QCC3003 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3003 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.
A single-chip dual-mode Bluetooth 5 system, QCC3003 SoC features 8th generation Qu....
QCC3001, Qualcomm cVc, Qualcomm Kalimba, and Qualcomm TrueWireless are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Cost-effective, single-chip flash programmable platform solution
QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs.
Support for Over-the-Air updates
Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory.
8th generation cVc noise cancellation technology
cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices.
QCC3003 Block Diagram
Features
Dual-mode Bluetooth 5 qualified radio
Variants designed to address both headsets/headphones and speaker applications
Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single
chip solutionCustomizable application code
Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
A rich set of features, use cases and programmability at more cost-effective price points
Pin compatible with CSRA63xxx and CSRA64xxx family of products
Supports OTA updates
Integrated Qualcomm TrueWireless Stereo technology
Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
SBC and AAC codecs
Promotes reduced development time with support of application image and source code, IDE and configuration
Updated Generic Application Interface Architecture (GAIA) protocol v3
Specifications
DSP
DSP Technology: Qualcomm® Kalimba™ DSP
MCU
MCU Clock Speed: 80 MHz
Bluetooth
Bluetooth Specification Version: Bluetooth 5.0
Bluetooth Technology: Dual-mode Bluetooth
Standard Profiles: Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3, Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5, Bluetooth Hands-Free Profile (HFP) 1.7
Audio
Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: Qualcomm® cVc™ Echo Cancellation and Noise Suppression
Memory
Flash: Up to 64 MB external flash
Interfaces
Supported Interfaces: I²S, SPDIF, USB 2.0, USB 3.0
Audio Playback Interfaces
Channel output: Stereo
Audio Recording Interfaces
Microphone: 1 digital mic
Package
Package Type: BGA, QFN
Pitch: 0.4mm Pitch, 0.5mm Pitch
Size: 5.5 x 5.5 x 1 mm, 6.0 x 6.0 x 0.6mm
- WLCSP
- BGA
Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Compare related products.
| Bluetooth Technology | Bluetooth Specification Version | Standard Profiles | DSP Technology | MCU Clock Speed | Other Audio Capturing Technologies | Channel output | Package Type |
|---|---|---|---|---|---|---|---|
Dual-mode Bluetooth | Bluetooth 5.0 | Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth Hands-Free Profile (HFP) 1.7 | Qualcomm® Kalimba™ DSP | 80 MHz | — | Mono | BGA WLCSP |
Dual-mode Bluetooth | Bluetooth 5.0 | Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth Hands-Free Profile (HFP) 1.7 | Qualcomm® Kalimba™ DSP | 80 MHz | — | Mono | BGA WLCSP |
Dual-mode Bluetooth | Bluetooth 5.0 | Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth Hands-Free Profile (HFP) 1.7 | Qualcomm® Kalimba™ DSP | 80 MHz | — | Stereo | BGA QFN |
Dual-mode Bluetooth | Bluetooth 5.0 | Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth Hands-Free Profile (HFP) 1.7 | Qualcomm® Kalimba™ DSP | 80 MHz | — | Stereo | BGA QFN |
Dual-mode Bluetooth | Bluetooth 5.0 | Bluetooth Advanced Audio Distribution Profile (A2DP) 1.3 Bluetooth Audio/Video Remote Control Profile (AVRCP) 1.5 Bluetooth Hands-Free Profile (HFP) 1.7 | Qualcomm® Kalimba™ DSP | 80 MHz | — | Stereo | BGA QFN |
Development tools and purchase options.
Qualcomm QCC3004 Bluetooth Audio SoC Development Kit BY QUALCOMM
Development Board / Kit
Access more.
©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.