QCA6174A

QCA6174A

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High performance 2x2 dual-band 802.11ac Wi-Fi with MU-MIMO and Bluetooth 5.0 radios in a single-chip solution.

Designed to deliver a cost-effective Wi-Fi/Bluetooth combo solution, the Qualcomm® QCA6174A SoC (System-on-Chip) is an integrated, single-chip solution in a small form factor for m....

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Designed to deliver a cost-effective Wi-Fi/Bluetooth combo solution, the Qualcomm® QCA6174A SoC (System-on-Chip) is an integrated, single-chip solution in a small form factor for m....

more

Designed to deliver a cost-effective Wi-Fi/Bluetooth combo solution, the Qualcomm® QCA6174A SoC (System-on-Chip) is an integrated, single-chip solution in a small form factor for mobile and consumer electronics applications.

QCA6174A supports high-speed Wi-Fi connectivity and enriched media experiences. It is optimized for energy efficiency, which is critica....

more

Designed to deliver a cost-effective Wi-Fi/Bluetooth combo solution, the Qualcomm® QCA6174A SoC (System-on-Chip) is an integrated, single-chip solution in a small form factor for mobile and consumer electronics applications.

QCA6174A supports high-speed Wi-Fi connectivity and enriched media experiences. It is optimized for energy efficiency, which is critical to extending the battery life of portable devices.

QCA6174A has integrated RF front-end and single-ended design for simpler and low-cost design. There are three variants availabl....

more

QCA6174A is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Featured Documents
Product Brief

Advanced 802.11ac

Advanced Wi-Fi features such as MU-MIMO and Transmit Beamformee to increase network capacity and improve connectivity.

Dual-mode Bluetooth

Supports Classic Bluetooth as well as Bluetooth Low Energy hub and peripheral devices.

Integrated RF front-end

Supports single-ended RF port design for a simpler and low-cost design.

QCA6174A Block Diagram

Features

  • 2x2 802.11ac + Bluetooth 5.0 in a single SoC

  • Supports Bluetooth 5.0, Bluetooth low energy and is backward compatible with Bluetooth 2.x

  • Integrated RF Front End and singleended design

  • Operates on a single 3.3 V power supply and an I/O supply of 1.8 V or 3.3 V

  • Advanced 11ac features: MU-MIMO, Transmit Beamformee

  • Both WLAN and Bluetooth power management with advanced power saving techniques

  • Maximal Likelihood (ML) decoding, lowdensity parity check (LDPC), maximum ratio combining (MRC) for robust link connection

  • 256-QAM in 2.4GHz

  • 1216KB RAM and 448KB ROM for Wi-Fi

  • 192KB RAM and 672KB ROM for Bluetooth

Specifications

Wi-Fi

Peak Speed: 867 Mbps

Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Channel Utilization: 20/40/80 MHz, 20/40 MHz

MIMO Configuration: 2x2 (2-stream)

Wi-Fi Features: MU-MIMO

Bluetooth

Bluetooth Technology: Bluetooth Low Energy

Bluetooth Specification Version: Bluetooth 5.0

Class: Class 2, Class 1

RF Ports: 1

Memory

OTP: 1.5 KB

Interface

Supported Interfaces: PCIe 2.1, PCM, UART

Package

Size: 4.9 x 6 mm

    Development tools and purchase options.

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    Type1CQ BY MURATA MANUFACTURING CO., LTD.

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    Shielded ultra small Dual Band Wi-Fi 11a/b/g/n/ac+Bluetooth 5.0 module based by Qualcomm® QCA6174A processor

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    SX-PCEAC2-HMC BY SILEX TECHNOLOGY, INC.

    Module / SoM

    The SX-PCEAC2-HMC is a dual-band 802.11ac and Bluetooth PCIe radio module in a Half Mini Card form factor. Featuring Qualcomm® QCA6174A with modular certifications and approvals available for FCC, IC, ETSI, MIC. This recommended evaluation platform can be used in mass production for legacy systems that have a Half Mini Card slot. SX-PCEAC2 supports WPA and WPA2 including 802.1x Extensible Authentication Protocol (EAP) types

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    QW274A-50P BY ITON TECHNOLOGY CO., LTD.

    Module / SoM

    Based on Qualcomm® QCA6174A SOC, QW274A-50P is a small size and low power module for IEEE 802.11ac/b/g/n wireless LAN. IEEE 802.11ac/b/g/n + BT4.1 Combo.

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