QCA4531

QCA4531

Single-band Premium Wi-Fi SoC

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high per....

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The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high per....

more

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high performance connectivity capabilities with a user-programmable Linux OpenWrt environment and is designed to serve either as a feature-rich IoT node or as a hub to support an IoT ecosy....

more

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high performance connectivity capabilities with a user-programmable Linux OpenWrt environment and is designed to serve either as a feature-rich IoT node or as a hub to support an IoT ecosystem.

QCA4531 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Specifications

Wi-Fi

Standards: 802.11b/g/n

Wi-Fi Spectral Bands: 2.4 GHz

Peak Speed: 190 Mbps

Channel Utilization: 20/40 MHz

MIMO Configuration: 2x2 (2-stream)

Wi-Fi Features: Qualcomm® IoT Connectivity

USB

USB Version: USB 2.0

CPU

CPU Clock Speed: Up to 650 MHz

CPU Cores: MIPS 24Kc

Memory

Flash: NAND, NOR

Memory Type: DDR1, DDR2

Interfaces

Layers: MAC, PHY

Supported Interfaces: I²C, JTAG, UART, USB 2.0, PCIe 1.1

Voltage Support: 3.3V

Input/Output

General Purpose I/Os: 12x

Operating Temperature Range

Maximum Temperature: 85 °C

Minimum Temperature: -20 °C

Package

Package Type: DRQFN

Pitch: 0.45 mm Pitch

Size: 12 x 12 x 0.9 mm

Software Options

Operating System: Linux

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    Chipset
    StandardsWi-Fi Spectral BandsMIMO ConfigurationBluetooth Specification VersionBluetooth TechnologyLR-WPAN ProtocolCPU Clock SpeedCPU CoresPackage TypePitchSize
    802.11b/g/n
    2.4 GHz
    2x2 (2-stream)
    Up to 650 MHz
    MIPS 24Kc
    DRQFN
    0.45 mm Pitch
    12 x 12 x 0.9 mm
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Bluetooth 5.0
    Qualcomm® Bluetooth mesh
    Bluetooth Low Energy
    Thread
    Zigbee
    Up to 128 MHz
    Arm Cortex-M4F CPU 1
    Arm Cortex-M0 CPU 2
    Tensilica Xtensa 3
    BGA
    0.65mm Pitch
    11.2 x 11.2 x 0.95 mm
    Bluetooth 5.0
    Qualcomm® Bluetooth mesh
    Bluetooth Low Energy
    Thread
    Zigbee
    Up to 128 MHz
    Arm Cortex-M4F CPU 1
    Arm Cortex-M0 CPU 2
    QFN
    0.9mm Pitch
    8 x 8 mm
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Up to 130 MHz
    Tensilica Xtensa
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    802.11b/g/n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Up to 130 MHz
    Tensilica Xtensa
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Up to 130 MHz
    Tensilica Xtensa
    MQFN
    0.4mm Pitch
    8 x 8 x 0.9 mm
    802.11b/g/n
    2.4 GHz
    1x1 (1-stream)
    Up to 130 MHz
    Tensilica Xtensa
    MQFN
    0.4mm Pitch
    7 × 7 × 0.85 mm
    1. Up to 128 MHz
    2. Up to 64 MHz
    3. Up to 130 MHz. Dedicated Wi-Fi CPU.

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    References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

    Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

    Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

    Nothing in these materials is an offer to sell any of the components or devices referenced herein.