QCA4531

QCA4531

Single-band Premium Wi-Fi SoC

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high per....

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The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high per....

more

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high performance connectivity capabilities with a user-programmable Linux OpenWrt environment and is designed to serve either as a feature-rich IoT node or as a hub to support an IoT ecosy....

more

The QCA4531 is a two stream (2x2) 802.11b/g/n single-band programmable Wi-Fi System-on-Chip (SoC) for the Internet of Things (IoT). This low-cost turnkey solution combines high performance connectivity capabilities with a user-programmable Linux OpenWrt environment and is designed to serve either as a feature-rich IoT node or as a hub to support an IoT ecosystem.

QCA4531 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Product Brief
Selector Guide

Specifications

CPU

CPU Clock Speed: Up to 650 MHz

CPU Cores: MIPS 24Kc

Wi-Fi

Wi-Fi Standards: 802.11 b/g/n

Wi-Fi Spectral Bands: 2.4 GHz

Peak Speed: 190 Mbps

Channel Utilization: 20/40 MHz

MIMO Configuration: 2x2 (2-stream)

Wi-Fi Features: Qualcomm® IoT Connectivity

USB

USB Version: USB 2.0

Memory

Flash: NAND, NOR

Memory Type: DDR1, DDR2

Interface

Layers: MAC, PHY

Supported Interfaces: I²C, JTAG, UART, USB 2.0, PCIe 1.1

Voltage Support: 3.3V

Input/Output

General Purpose I/Os: 12x

Operating Temperature Range

Maximum Temperature: 85°C

Minimum Temperature: -20°C

Package

Package Type: DRQFN

Pitch: 0.45mm Pitch

Package Size: 12 x 12 x 0.9 mm

Software Options

Operating System: Linux

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    Chipset
    CPU Clock SpeedCPU CoresWi-Fi StandardsWi-Fi Spectral BandsMIMO ConfigurationBluetooth VersionBluetooth TechnologyLR-WPAN ProtocolPackage TypePitchPackage Size
    Up to 650 MHz
    MIPS 24Kc
    802.11 b/g/n
    2.4 GHz
    2x2 (2-stream)
    DRQFN
    0.45mm Pitch
    12 x 12 x 0.9 mm
    Up to 128 MHz
    Arm Cortex-M4F CPU 1
    Arm Cortex-M0 CPU 2
    Tensilica Xtensa 3
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Bluetooth 5.0
    Qualcomm® Bluetooth mesh
    Bluetooth Low Energy
    Thread
    Zigbee
    BGA
    0.65mm Pitch
    11.2 x 11.2 x 0.95 mm
    Up to 128 MHz
    Arm Cortex-M4F CPU 1
    Arm Cortex-M0 CPU 2
    Bluetooth 5.0
    Qualcomm® Bluetooth mesh
    Bluetooth Low Energy
    Thread
    Zigbee
    QFN
    0.9mm Pitch
    8 x 8 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11 b/g/n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    MQFN
    0.4mm Pitch
    8 x 8 x 0.9 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11 b/g/n
    2.4 GHz
    1x1 (1-stream)
    MQFN
    0.4mm Pitch
    7 × 7 × 0.85 mm
    1. Up to 128 MHz
    2. Up to 64 MHz
    3. Up to 130 MHz. Dedicated Wi-Fi CPU.

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    References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

    Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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    Nothing in these materials is an offer to sell any of the components or devices referenced herein.