Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth.
The QCA4024 SoC is a multi-mode system-on-chip with support for Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
This low power SOC integrates a Cortex M4F....
The QCA4024 SoC is a multi-mode system-on-chip with support for Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
This low power SOC integrates a Cortex M4F....
The QCA4024 SoC is a multi-mode system-on-chip with support for Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
This low power SOC integrates a Cortex M4F for application processing and a Cortex M0 for network stack processing designed to enable a highly concurrent multiple radio solution.
The QCA4020 SDK from Qualcomm Technologies ....
The QCA4024 SoC is a multi-mode system-on-chip with support for Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
This low power SOC integrates a Cortex M4F for application processing and a Cortex M0 for network stack processing designed to enable a highly concurrent multiple radio solution.
The QCA4020 SDK from Qualcomm Technologies pre-integrates support for advanced security features and mesh networking. This solution complements portions of the portfolio beyond IoT devices to address multiple industries.
Qualcomm Bluetooth Low Energy, Qualcomm Trusted Execution Environment, CSRmesh and QCA4024 are products of Qualcomm Technologies, Inc.and/or its subsidiaries.
Dedicated Arm Cortex-M4F CPU for customer applications and low power Arm Cortex-M0 CPU for BLE.
QCA4024 includes hardware-based security features and functions integrated in a single IC, and is designed to provide OEMs with the option of replacing external security chips for potential cost savings.
Qualcomm® Bluetooth Low Energy Mesh technology uses a Bluetooth Mesh network to permit management and calibration of multiple beacons, as well as tracking and report assets.
Multi-mode SOC supporting Bluetooth 5.0, and IEEE 802.15.4 concurrently
BLE mesh, Zigbee 3.0 and OpenThread support
Isolated power islands for low power operation
Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and application level security
Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
Integrated sensor hub for post-processing designed to enable low power sensor use cases
Small package size allows for optimized form factors
300+KB RAM reserved for applications
Bluetooth radio details: v5.0 with PA =+4dBm/+10dBm (for Long Range)
802.15.4 radio details: 2006 compliant, 15.4e, 2.4GHz DSSS +4dBm/+21dBm (for Long Range)
CPU
CPU Clock Speed: Up to 128 MHz
CPU Cores: Arm Cortex-M4F CPU, Arm Cortex-M0 CPU
Bluetooth
Bluetooth Version: Bluetooth 5.0
Bluetooth Technology: Qualcomm® Bluetooth mesh, Bluetooth Low Energy
802.15.4
LR-WPAN Protocol: Thread, Zigbee
Security Support
Security Features: Application Level Security, Hardware-based Crypto Engine, Key Provisioning Security, Qualcomm® Trusted Execution Environment (TEE), Secure Boot, Secure Storage, Software Image Encryption, True Random Number Generator
Wi-Fi Security: WPS
Memory
RAM: 300+KB
Interface
Supported Interfaces: I²S, PWM, ADC, SDIO2.0, SPI/Q-SPI, I²C, GPIO, SPI, UART
Package
Package Type: QFN
Pins: 68 pins
Pitch: 0.9mm Pitch
Package Size: 8 x 8 mm
CPU Clock Speed | CPU Cores | Wi-Fi Standards | Wi-Fi Spectral Bands | MIMO Configuration | Bluetooth Version | Bluetooth Technology | LR-WPAN Protocol | Package Type | Pitch | Package Size |
---|---|---|---|---|---|---|---|---|---|---|
Up to 128 MHz | Arm Cortex-M4F CPU 1 Arm Cortex-M0 CPU 2 | — | — | — | Bluetooth 5.0 | Qualcomm® Bluetooth mesh Bluetooth Low Energy | Thread Zigbee | QFN | 0.9mm Pitch | 8 x 8 mm |
Up to 650 MHz | MIPS 24Kc | 802.11 b/g/n | 2.4GHz | 2x2 (2-stream) | — | — | — | DRQFN | 0.45mm Pitch | 12 x 12 x 0.9 mm |
Up to 128 MHz | Arm Cortex-M4F CPU 1 Arm Cortex-M0 CPU 2 Tensilica Xtensa 3 | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | Bluetooth 5.0 | Qualcomm® Bluetooth mesh Bluetooth Low Energy | Thread Zigbee | BGA | 0.65mm Pitch | 11.2 x 11.2 x 0.95 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 8 x 8 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 7 × 7 × 0.85 mm |
Development Board / Kit
Chip Product
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