Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth.

Qualcomm Bluetooth Low Energy, Qualcomm Trusted Execution Environment, CSRmesh and QCA4024 are products of Qualcomm Technologies, Inc.and/or its subsidiaries.

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Multi-core processing

Dedicated Arm Cortex-M4F CPU for customer applications and low power Arm Cortex-M0 CPU for BLE.

Hardware-based security features

QCA4024 includes hardware-based security features and functions integrated in a single IC, and is designed to provide OEMs with the option of replacing external security chips for potential cost savings.

Greater efficiencies with Mesh Networking

Qualcomm® Bluetooth Low Energy Mesh technology uses a Bluetooth Mesh network to permit management and calibration of multiple beacons, as well as tracking and report assets.

QCA4024 Block Diagram

Features

  • Multi-mode SOC supporting Bluetooth 5.0, and IEEE 802.15.4 concurrently

  • BLE mesh, Zigbee 3.0 and OpenThread support

  • Isolated power islands for low power operation

  • Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and application level security

  • Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs

  • Integrated sensor hub for post-processing designed to enable low power sensor use cases

  • Small package size allows for optimized form factors

  • 300+KB RAM reserved for applications

  • Bluetooth radio details: v5.0 with PA =+4dBm/+10dBm (for Long Range)

  • 802.15.4 radio details: 2006 compliant, 15.4e, 2.4GHz DSSS +4dBm/+21dBm (for Long Range)

Specifications

CPU

CPU Clock Speed: Up to 128 MHz

CPU Cores: Arm Cortex-M4F CPU, Arm Cortex-M0 CPU

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Technology: Qualcomm Bluetooth mesh, Bluetooth Low Energy

802.15.4

LR-WPAN Protocol: Thread, Zigbee

Security Support

Security Features: Application Level Security, Secure Storage, Hardware-based Crypto Engine, Software Image Encryption, True Random Number Generator, Key Provisioning Security, Qualcomm® Trusted Execution Environment, Secure Boot

Wi-Fi Security: WPS

Memory

RAM: 300+KB

Interface

Supported Interfaces: I²S, PWM, ADC, SDIO2.0, SPI/Q-SPI, I²C, GPIO, SPI, UART

Package

Package Type: QFN

Pins: 68 pins

Pitch: 0.9mm Pitch

Package Size: 8 x 8 mm

  1. Up to 128 MHz
  2. Up to 64 MHz
  3. 8ch, 12-bit 1Msps

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Chipset

CPU Clock SpeedCPU CoresWi-Fi StandardsWi-Fi Spectral BandsMIMO ConfigurationBluetooth VersionBluetooth TechnologyLR-WPAN ProtocolPackage TypePitchPackage Size
Up to 128 MHz
Arm Cortex-M4F CPU
Arm Cortex-M0 CPU
Tensilica Xtensa
Bluetooth 5.0
Bluetooth Low Energy
Qualcomm Bluetooth mesh
Thread
Zigbee
QFN
0.9mm Pitch
8 x 8 mm
Up to 650 MHz
MIPS 24Kc
802.11 b/g/n
2.4 GHz
2x2 (2-stream)
DRQFN
0.45mm Pitch
12 x 12 x 0.9 mm
Up to 128 MHz
Arm Cortex-M4F CPU
Arm Cortex-M0 CPU
Tensilica Xtensa
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
Bluetooth 5.0
Bluetooth Low Energy
Qualcomm Bluetooth mesh
Thread
Zigbee
BGA
0.65mm Pitch
11.2 x 11.2 x 0.95 mm
Up to 130 MHz
Tensilica Xtensa
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
DRQFN
0.5mm Pitch
9 x 9 x 0.9 mm
Up to 130 MHz
Tensilica Xtensa
802.11 b/g/n
2.4 GHz
5 GHz
1x1 (1-stream)
DRQFN
0.5mm Pitch
9 x 9 x 0.9 mm
Up to 130 MHz
Tensilica Xtensa
802.11a/b/g
802.11n
2.4 GHz
5 GHz
1x1 (1-stream)
MQFN
0.4mm Pitch
8 x 8 x 0.9 mm
Up to 130 MHz
Tensilica Xtensa
802.11 b/g/n
2.4 GHz
1x1 (1-stream)
MQFN
0.4mm Pitch
7 × 7 × 0.85 mm
  1. 8ch, 12-bit 1Msps
  2. Up to 128 MHz
  3. Up to 64 MHz
  4. Up to 130 MHz. Dedicated Wi-Fi CPU.

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