Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth.
Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth.
Qualcomm Bluetooth Low Energy, Qualcomm Trusted Execution Environment, CSRmesh and QCA4024 are products of Qualcomm Technologies, Inc.and/or its subsidiaries.
Multi-core processing
Dedicated Arm Cortex-M4F CPU for customer applications and low power Arm Cortex-M0 CPU for BLE.
Hardware-based security features
QCA4024 includes hardware-based security features and functions integrated in a single IC, and is designed to provide OEMs with the option of replacing external security chips for potential cost savings.
Greater efficiencies with Mesh Networking
Qualcomm® Bluetooth Low Energy Mesh technology uses a Bluetooth Mesh network to permit management and calibration of multiple beacons, as well as tracking and report assets.
QCA4024 Block Diagram
Features
Multi-mode SOC supporting Bluetooth 5.0, and IEEE 802.15.4 concurrently
BLE mesh, Zigbee 3.0 and OpenThread support
Isolated power islands for low power operation
Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and application level security
Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
Integrated sensor hub for post-processing designed to enable low power sensor use cases
Small package size allows for optimized form factors
300+KB RAM reserved for applications
Bluetooth radio details: v5.0 with PA =+4dBm/+10dBm (for Long Range)
802.15.4 radio details: 2006 compliant, 15.4e, 2.4GHz DSSS +4dBm/+21dBm (for Long Range)
Specifications
CPU
CPU Clock Speed: Up to 128 MHz
CPU Cores: Arm Cortex-M4F CPU, Arm Cortex-M0 CPU
Bluetooth
Bluetooth Version: Bluetooth 5.0
Bluetooth Technology: Qualcomm Bluetooth mesh, Bluetooth Low Energy
802.15.4
LR-WPAN Protocol: Thread, Zigbee
Security Support
Security Features: Application Level Security, Secure Storage, Hardware-based Crypto Engine, Software Image Encryption, True Random Number Generator, Key Provisioning Security, Qualcomm® Trusted Execution Environment, Secure Boot
Wi-Fi Security: WPS
Memory
RAM: 300+KB
Interface
Supported Interfaces: I²S, PWM, ADC, SDIO2.0, SPI/Q-SPI, I²C, GPIO, SPI, UART
Package
Package Type: QFN
Pins: 68 pins
Pitch: 0.9mm Pitch
Package Size: 8 x 8 mm
- Up to 128 MHz
- Up to 64 MHz
- 8ch, 12-bit 1Msps
Compare related products.
| CPU Clock Speed | CPU Cores | Wi-Fi Standards | Wi-Fi Spectral Bands | MIMO Configuration | Bluetooth Version | Bluetooth Technology | LR-WPAN Protocol | Package Type | Pitch | Package Size |
|---|---|---|---|---|---|---|---|---|---|---|
Up to 128 MHz | Arm Cortex-M4F CPU Arm Cortex-M0 CPU Tensilica Xtensa | — | — | — | Bluetooth 5.0 | Bluetooth Low Energy Qualcomm Bluetooth mesh | Thread Zigbee | QFN | 0.9mm Pitch | 8 x 8 mm |
Up to 650 MHz | MIPS 24Kc | 802.11 b/g/n | 2.4 GHz | 2x2 (2-stream) | — | — | — | DRQFN | 0.45mm Pitch | 12 x 12 x 0.9 mm |
Up to 128 MHz | Arm Cortex-M4F CPU Arm Cortex-M0 CPU Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | Bluetooth 5.0 | Bluetooth Low Energy Qualcomm Bluetooth mesh | Thread Zigbee | BGA | 0.65mm Pitch | 11.2 x 11.2 x 0.95 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 8 x 8 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4 GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 7 × 7 × 0.85 mm |
- 8ch, 12-bit 1Msps
- Up to 128 MHz
- Up to 64 MHz
- Up to 130 MHz. Dedicated Wi-Fi CPU.
Development tools and purchase options.
