QCA4012

QCA4012 SoC

Intelligent connectivity Wi-Fi SoCs (System-on-Chip) for the Internet of Things (IoT).

QCA4012 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Featured Documents

Product Brief

Selector Guide

Low power Wi-Fi

Integrated low-power CPU for embedded applications supports power saving modes and extends battery life for home device applications.

Large internal memory

Allows for a hostless architecture with up to 800KB of on-chip memory available to customer applications and third party software.

Dual-band Wi-Fi support

Dual-band connectivity for both 2.4GHz and 5GHz, well-suited for applications in interference sensitive environments.

QCA401x Block Diagram

Features

  • IEEE 802.11n 1x1 single or dual-band 2.4GHz/5GHz 

  • Integrated on-chip application processor and memory (1.5MB)

  • Advanced security features including antitampering, data integrity and root of trust

  • Up to 20Mbps TCP/IP throughput

  • Integrated IPv4v6 networking stack

  • Low power CPU for embedded applications

  • Low power modes:

    • IEEE Sleep with low power consumption and optimal state transition times
    • Power optimized listen, receive, transmit and associated operating modes
    • Store and recall
  • HTTP and DNS services

  • Manufacturing tools for configuration and test

  • Cost optimized RBOM with integrated PA and LNA

  • Software support for Apple HomeKit, Google Weave, Open Connectivity Foundation and AllJoyn from the AllSeen Alliance

Specifications

CPU

CPU Clock Speed: Up to 130 MHz

CPU Cores: Tensilica Xtensa

Wi-Fi

Wi-Fi Standards: 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

Peak speed: 150 Mbps

MIMO Configuration: 1x1 (1-stream)

Wi-Fi Features: Qualcomm® IoT Connectivity

USB

USB Version: USB 2.0

Security Support

Wi-Fi Security: TKIP, WAPI, WEP, WPA, WPA2, WPS

Memory

RAM: 8KB RAM

Interface

Supported Interfaces: I²S, I²C, JTAG, SDIO, SPI, UART, USB 2.0

Voltage Support: 1.8V, 3.3V

Input/Output

General Purpose I/Os: 40x

ADC: 1 ADC

PWM: 1x

Operating Temperature Range

Maximum Temperature: 115°C

Minimum Temperature: -40°C

Package

Package Type: DRQFN

Pins: 116 pins

Pitch: 0.5mm Pitch

Package Size: 9 x 9 x 0.9 mm

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    CPU Clock SpeedCPU CoresWi-Fi StandardsWi-Fi Spectral BandsMIMO ConfigurationBluetooth VersionBluetooth TechnologyLR-WPAN ProtocolPackage TypePitchPackage Size
    Up to 130 MHz
    Tensilica Xtensa
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11 b/g/n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    DRQFN
    0.5mm Pitch
    9 x 9 x 0.9 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11 b/g/n
    2.4 GHz
    1x1 (1-stream)
    MQFN
    0.4mm Pitch
    7 × 7 × 0.85 mm
    Up to 130 MHz
    Tensilica Xtensa
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    MQFN
    0.4mm Pitch
    8 x 8 x 0.9 mm
    Up to 128 MHz
    Arm Cortex-M4F CPU
    Arm Cortex-M0 CPU
    Tensilica Xtensa
    802.11a/b/g
    802.11n
    2.4 GHz
    5 GHz
    1x1 (1-stream)
    Bluetooth 5.0
    Bluetooth Low Energy
    Qualcomm Bluetooth mesh
    Thread
    Zigbee
    BGA
    0.65mm Pitch
    11.2 x 11.2 x 0.95 mm
    Up to 128 MHz
    Arm Cortex-M4F CPU
    Arm Cortex-M0 CPU
    Tensilica Xtensa
    Bluetooth 5.0
    Bluetooth Low Energy
    Qualcomm Bluetooth mesh
    Thread
    Zigbee
    QFN
    0.9mm Pitch
    8 x 8 mm
    1. 8ch, 12-bit 1Msps
    2. Up to 128 MHz
    3. Up to 64 MHz
    4. Up to 130 MHz. Dedicated Wi-Fi CPU.

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