Overview | QCA4010 SoC | Single-band 1x1 stream DRQFN Wi-Fi Chipset for IoT

Intelligent connectivity Wi-Fi SoCs (System-on-Chip) for the Internet of Things (IoT).

The QCA4010 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power Qualcomm® Wi-Fi connectivity solution on a single chip.

QCA4010 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

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Low power Wi-Fi

Integrated low-power CPU for embedded applications supports power saving modes and extends battery life for home device applications.

Large internal memory

Allows for a hostless architecture with up to 800KB of on-chip memory available to customer applications and third party software.

Expansive interfaces

Directly interconnect interfaces with IoT sensors,
actuators, display, lighting and audio components
for advanced, feature-rich products.

QCA401x Block Diagram

Features

IEEE 802.11n 1x1 single or dual-band 2.4GHz/5GHz
Integrated on-chip application processor and memory (1.5MB)
Advanced security features including antitampering, data integrity and root of trust
Up to 20Mbps TCP/IP throughput
Integrated IPv4v6 networking stack
Low power CPU for embedded applications
Low power modes:
- IEEE Sleep with low power consumption and optimal state transition times
- Power optimized listen, receive, transmit and associated operating modes
- Store and recall
HTTP and DNS services
Manufacturing tools for configuration and test
Cost optimized RBOM with integrated PA and LNA
Software support for Apple HomeKit, Google Weave, Open Connectivity Foundation and AllJoyn from the AllSeen Alliance

Specifications

CPU

CPU Clock Speed: Up to 130 MHz

CPU Cores: Tensilica Xtensa

Wi-Fi

Wi-Fi Standards: 802.11 b/g/n

Wi-Fi Spectral Bands: 2.4GHz, 5GHz

Peak Speed: 150 Mbps

MIMO Configuration: 1x1 (1-stream)

Wi-Fi Features: Qualcomm® IoT Connectivity

USB

USB Version: USB 2.0

Security Support

Wi-Fi Security: WPA2, WPA, WPS, TKIP, WAPI, WEP

Memory

RAM: 8 KB RAM

Interface

Supported Interfaces: I²S, I²C, JTAG, SDIO, SPI, UART, USB 2.0

Voltage Support: 1.8V, 3.3V

Input/Output

General Purpose I/Os: 40x

ADC: 1 ADC

PWM: 1x

Operating Temperature Range

Maximum Temperature: 115°C

Minimum Temperature: -40°C

Package

Package Type: DRQFN

Pins: 116 pins

Pitch: 0.5mm Pitch

Package Size: 9 x 9 x 0.9 mm

Compare related products.

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CPU Clock Speed	CPU Cores	Wi-Fi Standards	Wi-Fi Spectral Bands	MIMO Configuration	Bluetooth Version	Bluetooth Technology	LR-WPAN Protocol	Package Type	Pitch	Package Size
Up to 130 MHz	Tensilica Xtensa	802.11 b/g/n	2.4GHz 5GHz	1x1 (1-stream)	—	—	—	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm
Up to 130 MHz	Tensilica Xtensa	802.11a/b/g 802.11n	2.4GHz 5GHz	1x1 (1-stream)	—	—	—	DRQFN	0.5mm Pitch	9 x 9 x 0.9 mm
Up to 130 MHz	Tensilica Xtensa	802.11 b/g/n	2.4GHz	1x1 (1-stream)	—	—	—	MQFN	0.4mm Pitch	7 × 7 × 0.85 mm
Up to 130 MHz	Tensilica Xtensa	802.11a/b/g 802.11n	2.4GHz 5GHz	1x1 (1-stream)	—	—	—	MQFN	0.4mm Pitch	8 x 8 x 0.9 mm
Up to 128 MHz	Arm Cortex-M4F CPU ¹ Arm Cortex-M0 CPU ² Tensilica Xtensa ³	802.11a/b/g 802.11n	2.4GHz 5GHz	1x1 (1-stream)	Bluetooth 5.0	Qualcomm® Bluetooth mesh Bluetooth Low Energy	Thread Zigbee	BGA	0.65mm Pitch	11.2 x 11.2 x 0.95 mm
Up to 128 MHz	Arm Cortex-M4F CPU ¹ Arm Cortex-M0 CPU ²	—	—	—	Bluetooth 5.0	Qualcomm® Bluetooth mesh Bluetooth Low Energy	Thread Zigbee	QFN	0.9mm Pitch	8 x 8 mm
Up to 650 MHz	MIPS 24Kc	802.11 b/g/n	2.4GHz	2x2 (2-stream)	—	—	—	DRQFN	0.45mm Pitch	12 x 12 x 0.9 mm

Up to 128 MHz
Up to 64 MHz
Up to 130 MHz. Dedicated Wi-Fi CPU.

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SX-ULPGN BY SILEX TECHNOLOGY, INC.

Module / SoM

The SX-ULPGN is an ultra-low-power hostless Wi-Fi IoT module with 802.11 b/g/n support. This low power Wi-Fi IoT module is based on Qualcomm(r) QCA4010 radio from Qualcomm. Our close relationship with Qualcomm Technologies and other partners enables us to provide superior support for our modules to our customers.

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