Intelligent connectivity Wi-Fi SoCs (System-on-Chip) for the Internet of Things (IoT).
The QCA4010 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power Qualcomm® Wi-Fi connectivity solution on a single chip.
The QCA4010 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power Qualcomm® Wi-Fi connectivity solution on a single chip.
The QCA4010 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power Qualcomm® Wi-Fi connectivity solution on a single chip.
The QCA4010 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power Qualcomm® Wi-Fi connectivity solution on a single chip.
QCA4010 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Integrated low-power CPU for embedded applications supports power saving modes and extends battery life for home device applications.
Allows for a hostless architecture with up to 800KB of on-chip memory available to customer applications and third party software.
Directly interconnect interfaces with IoT sensors,
actuators, display, lighting and audio components
for advanced, feature-rich products.
IEEE 802.11n 1x1 single or dual-band 2.4GHz/5GHz
Integrated on-chip application processor and memory (1.5MB)
Advanced security features including antitampering, data integrity and root of trust
Up to 20Mbps TCP/IP throughput
Integrated IPv4v6 networking stack
Low power CPU for embedded applications
Low power modes:
HTTP and DNS services
Manufacturing tools for configuration and test
Cost optimized RBOM with integrated PA and LNA
Software support for Apple HomeKit, Google Weave, Open Connectivity Foundation and AllJoyn from the AllSeen Alliance
CPU
CPU Clock Speed: Up to 130 MHz
CPU Cores: Tensilica Xtensa
Wi-Fi
Wi-Fi Standards: 802.11 b/g/n
Wi-Fi Spectral Bands: 2.4GHz, 5GHz
Peak Speed: 150 Mbps
MIMO Configuration: 1x1 (1-stream)
Wi-Fi Features: Qualcomm® IoT Connectivity
USB
USB Version: USB 2.0
Security Support
Wi-Fi Security: WPA2, WPA, WPS, TKIP, WAPI, WEP
Memory
RAM: 8 KB RAM
Interface
Supported Interfaces: I²S, I²C, JTAG, SDIO, SPI, UART, USB 2.0
Voltage Support: 1.8V, 3.3V
Input/Output
General Purpose I/Os: 40x
ADC: 1 ADC
PWM: 1x
Operating Temperature Range
Maximum Temperature: 115°C
Minimum Temperature: -40°C
Package
Package Type: DRQFN
Pins: 116 pins
Pitch: 0.5mm Pitch
Package Size: 9 x 9 x 0.9 mm
CPU Clock Speed | CPU Cores | Wi-Fi Standards | Wi-Fi Spectral Bands | MIMO Configuration | Bluetooth Version | Bluetooth Technology | LR-WPAN Protocol | Package Type | Pitch | Package Size |
---|---|---|---|---|---|---|---|---|---|---|
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 7 × 7 × 0.85 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 8 x 8 x 0.9 mm |
Up to 128 MHz | Arm Cortex-M4F CPU 1 Arm Cortex-M0 CPU 2 Tensilica Xtensa 3 | 802.11a/b/g 802.11n | 2.4GHz 5GHz | 1x1 (1-stream) | Bluetooth 5.0 | Qualcomm® Bluetooth mesh Bluetooth Low Energy | Thread Zigbee | BGA | 0.65mm Pitch | 11.2 x 11.2 x 0.95 mm |
Up to 128 MHz | Arm Cortex-M4F CPU 1 Arm Cortex-M0 CPU 2 | — | — | — | Bluetooth 5.0 | Qualcomm® Bluetooth mesh Bluetooth Low Energy | Thread Zigbee | QFN | 0.9mm Pitch | 8 x 8 mm |
Up to 650 MHz | MIPS 24Kc | 802.11 b/g/n | 2.4GHz | 2x2 (2-stream) | — | — | — | DRQFN | 0.45mm Pitch | 12 x 12 x 0.9 mm |
Module / SoM
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