QCA4010 SoC
Intelligent connectivity Wi-Fi SoCs (System-on-Chip) for the Internet of Things (IoT).
Intelligent connectivity Wi-Fi SoCs (System-on-Chip) for the Internet of Things (IoT).
QCA4010 and Qualcomm Wi-Fi Solutions are products of Qualcomm Technologies, Inc., and/or its subsidiaries.
Low power Wi-Fi
Integrated low-power CPU for embedded applications supports power saving modes and extends battery life for home device applications.
Large internal memory
Allows for a hostless architecture with up to 800KB of on-chip memory available to customer applications and third party software.
Expansive interfaces
Directly interconnect interfaces with IoT sensors,
actuators, display, lighting and audio components
for advanced, feature-rich products.
QCA401x Block Diagram
Features
IEEE 802.11n 1x1 single or dual-band 2.4GHz/5GHz
Integrated on-chip application processor and memory (1.5MB)
Advanced security features including antitampering, data integrity and root of trust
Up to 20Mbps TCP/IP throughput
Integrated IPv4v6 networking stack
Low power CPU for embedded applications
Low power modes:
- IEEE Sleep with low power consumption and optimal state transition times
- Power optimized listen, receive, transmit and associated operating modes
- Store and recall
HTTP and DNS services
Manufacturing tools for configuration and test
Cost optimized RBOM with integrated PA and LNA
Software support for Apple HomeKit, Google Weave, Open Connectivity Foundation and AllJoyn from the AllSeen Alliance
Specifications
CPU
CPU Clock Speed: Up to 130 MHz
CPU Cores: Tensilica Xtensa
Wi-Fi
Wi-Fi Standards: 802.11 b/g/n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Peak speed: 150 Mbps
MIMO Configuration: 1x1 (1-stream)
Wi-Fi Features: Qualcomm® IoT Connectivity
USB
USB Version: USB 2.0
Security Support
Wi-Fi Security: TKIP, WAPI, WEP, WPA, WPA2, WPS
Memory
RAM: 8KB RAM
Interface
Supported Interfaces: I²S, I²C, JTAG, SDIO, SPI, UART, USB 2.0
Voltage Support: 1.8V, 3.3V
Input/Output
General Purpose I/Os: 40x
ADC: 1 ADC
PWM: 1x
Operating Temperature Range
Maximum Temperature: 115°C
Minimum Temperature: -40°C
Package
Package Type: DRQFN
Pins: 116 pins
Pitch: 0.5mm Pitch
Package Size: 9 x 9 x 0.9 mm
Compare related products.
| CPU Clock Speed | CPU Cores | Wi-Fi Standards | Wi-Fi Spectral Bands | MIMO Configuration | Bluetooth Version | Bluetooth Technology | LR-WPAN Protocol | Package Type | Pitch | Package Size |
|---|---|---|---|---|---|---|---|---|---|---|
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | DRQFN | 0.5mm Pitch | 9 x 9 x 0.9 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11 b/g/n | 2.4 GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 7 × 7 × 0.85 mm |
Up to 130 MHz | Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | — | — | — | MQFN | 0.4mm Pitch | 8 x 8 x 0.9 mm |
Up to 128 MHz | Arm Cortex-M4F CPU Arm Cortex-M0 CPU Tensilica Xtensa | 802.11a/b/g 802.11n | 2.4 GHz 5 GHz | 1x1 (1-stream) | Bluetooth 5.0 | Bluetooth Low Energy Qualcomm Bluetooth mesh | Thread Zigbee | BGA | 0.65mm Pitch | 11.2 x 11.2 x 0.95 mm |
Up to 128 MHz | Arm Cortex-M4F CPU Arm Cortex-M0 CPU Tensilica Xtensa | — | — | — | Bluetooth 5.0 | Bluetooth Low Energy Qualcomm Bluetooth mesh | Thread Zigbee | QFN | 0.9mm Pitch | 8 x 8 mm |
Up to 650 MHz | MIPS 24Kc | 802.11 b/g/n | 2.4 GHz | 2x2 (2-stream) | — | — | — | DRQFN | 0.45mm Pitch | 12 x 12 x 0.9 mm |
- 8ch, 12-bit 1Msps
- Up to 128 MHz
- Up to 64 MHz
- Up to 130 MHz. Dedicated Wi-Fi CPU.
