---
title: "Snapdragon System-in-Package"
url: "https://www.qualcomm.com/smartphones/products/snapdragon-system-package"
---

# Snapdragon System-in-Package

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On this page

[Overview](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#overview)
[Benefits](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#benefits)
[Block Diagram](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#blockdiagram)
[You deserve to be a Snapdragon Insider.](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#twocolumnhdi)
[Features / Specs](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#specs)
[Access More](https://www.qualcomm.com/smartphones/products/snapdragon-system-package/#accessmore)

Custom-built, integrated solution that enables design flexibility and robust features with low power consumption.

Qualcomm® Snapdragon™ System-in-Package is a custom-built, integrated module that supports design flexibility and robust smartphone features with low power consumption.

Smartphone manufacturers gain more design flexibility, enabling them to choose to extend efficiencies to device design and/or build in more features and attributes. Advanced technologies across camera, multimedia, power management, and performance allow Snapdragon System-in-Package powered devices to provide excellent coverage and improved connectivity.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

[Product license agreement]()

Featured Documents

[Product Brief](https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/prod_brief_qcom_system-in-package.pdf)

## Benefits

#### All-in-one package

Qualcomm Technologies combines multiple high-end software and hardware components into one robust, feature-rich, integrated semiconductor. With this unified approach, devices containing a Snapdragon System-in-Package may be developed in less time and at lower cost.

#### Integrated module for design flexibility

Incorporating advanced Snapdragon technologies into a single module maximizes space and minimizes board size. Manufacturers can choose, depending on need, whether they will produce a thinner device or build in more features like additional cameras or bigger batteries.

#### Connections that go the distance

In the heart of the city or on the outskirts, Snapdragon System-in-Package powered devices will provide excellent coverage. The Snapdragon X9 LTE modem is designed to support global networks and bands for reliable connectivity and super-fast speeds, allowing users to quickly share high-res photos and videos.

#### Powering advanced mobile experiences

This integrated semiconductor balances cutting-edge performance with ultra-low power usage. The system is designed to handle advanced on-device interactions without draining the battery, so users can accomplish more on a single charge.

#### Maximizing every on-device moment

Bring forth the gamut of entertainment experiences. Turn your device into a multimedia machine with support for brilliant displays, hi-fi audio and action-packed mobile gaming. In the photography department, multi-camera support provides access to an expansive set of advanced features.

### Snapdragon System-in-Package Block Diagram

![](https://s7d1.scene7.com/is/image/dmqualcommprod/snapdragon_sip_full_0)

You deserve to be a Snapdragon Insider.

Snapdragon Insiders will get behind-the-scenes access, premium experiences and extra perks that only the Snapdragon Insiders program can deliver. Join our community to get the inside track and help us shape the future of Snapdragon.

[Sign up](https://assets.qualcomm.com/snapdragon-insiders-sign-up.html)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/snapdragon-insiders-badge?$QC_Responsive$&fmt=png-alpha)

## Features

- World's first Snapdragon System-in-Package custom designed for smartphones and IoT devices
- Integrated semiconductor featuring Snapdragon technology enabling design efficiencies, reduced development costs and accelerated time to commercialization
- Advanced technology across camera, connectivity, multimedia, power and performance for amazing smartphone experiences
- Snapdragon X9 LTE modem includes access to 4G, 3G and 2G frequency bands
- Qualcomm® Adreno™ 506 PC-class graphics with support for advanced APIs and Hardware Tessellation
- Snapdragon sensor core is designed to support new always-on use cases at reduced power levels and cost

### Specifications

| | |
|---|---|
| **Location** | |
| Location Support | Qualcomm® Location |
| Satellite Systems | GLONASS, Galileo, Beidou, GPS |
| Location and Global Emergency Services | LTE Observed Time Difference of Arrival (OTDOA), Assisted GPS |
| Features | Pedestrian Navigation, Sensor-assisted Navigation, Low Power Geofencing and Tracking |
| **NFC** | |
| Near Field Communications | Supported |
| **CPU** | |
| Name | 8x Arm® Cortex®-A53 Processor |
| Architecture | 64-bit |
| Clock Speed | Up to 1.8 GHz |
| **DSP** | |
| Name | Qualcomm® Hexagon™ 546 |
| **GPU** | |
| Name | Qualcomm® Adreno™ 506 |
| APIs | OpenCL™ 2.0 Full, OpenGL® ES 3.1 |

1. Meets operator CA requirements: Claro, TIM and Vivo in Brazil

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Qualcomm Snapdragon, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Location, Qualcomm RF Front End solution, Qualcomm Clear Sight Camera, Qualcomm Aqstic, Qualcomm Snapdragon All Mode, Qualcomm Snapdragon Upload+, Qualcomm Quick Charge, and Qualcomm Mobile Security are products of Qualcomm Technologies, Inc., and/or its subsidiaries.