Wave-2 802.11ac SoC for Routers, Gateways and Access Points
The IPQ4029 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-in....
The IPQ4029 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-in....
The IPQ4029 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-e....
The IPQ4029 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines dual-band 11ac, advanced Wi-Fi features and network processing in a variety of configurations for high-performance, power-efficient and cost-effective network infrastructure products.
IPQ4029 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.
CPU
CPU Clock Speed: 717MHz
CPU Cores: 4x ARM Cortex A7, Quad-core CPU
Process
Process Technology: 40 nm
DSP
DSP Technology: SIMD DSP
Wi-Fi
Wi-Fi Standards: 802.11p, 802.11ac Wave 2, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Peak Speed: 1.733 Gbps
Channel Utilization: 20/40/80 MHz, 5/10/20/40 MHz
MIMO Configuration: 2x2 (2-stream)
Wi-Fi Features: MU-MIMO, Qualcomm® IoT Connectivity, TxBF, Qualcomm® Wi-Fi SON
RF
Ethernet: 5-port ethernet
Security Support
Security Features: Crypto Engine, Qualcomm® Trusted Execution Environment (TEE), Secure Boot
Wi-Fi Security: WPA2, WPA, WPS, 802.11i security, AES-CCMP, AES-GCMP, PRNG, TKIP, WAPI, WEP
Memory
Memory Type: DDR3L
RAM: 1 GB RAM
Interface
Supported Interfaces: I²S, I²C, Ethernet, JTAG, LCD, PCIe 2.0, PCM, RGMII, SD/eMMC, SPDIF, SPI, UART, USB 2.0, USB 3.0
Package
Package Type: BGA
Package Size: 18 x 18 mm
©2020 Qualcomm Technologies, Inc. and/or its affiliated companies.